Coupled effects of chloride ions and branch chained polypropylene ether LP-1™ on the electrochemical deposition of copper from sulfate solutions
Identifieur interne : 001E88 ( Main/Curation ); précédent : 001E87; suivant : 001E89Coupled effects of chloride ions and branch chained polypropylene ether LP-1™ on the electrochemical deposition of copper from sulfate solutions
Auteurs : Susanne Goldbach [France] ; Werner Messing [Pays-Bas] ; Theo Daenen [Pays-Bas] ; François Lapicque [France]Source :
- Electrochimica Acta [ 0013-4686 ] ; 1998.
Descripteurs français
- Pascal (Inist)
- Constante vitesse, Cuivre, Cuivre Sulfate, Dépôt électrolytique, Effet concentration, Effet milieu, Electrode disque tournant, Etude expérimentale, Impédance électrique, Mécanisme réaction, Paramètre cinétique, Platine, Polymère ramifié, Propène oxyde polymère, Réaction électrochimique, Sodium Chlorure, Sulfurique acide.
- Wicri :
English descriptors
- KwdEn :
- Absolute overpotential, Acta, Active surface, Additive, Adsorption, Adsorption phenomena, Ambient temperature, Anodic charge transfer, Average value, Bath composition, Branched polymer, Broad range, Bulk concentrations, Bulk solution, Capacitance, Cathode surface, Charge transfer, Charge transfer resistance, Chemical composition, Chloride, Chloride ions, Complexation phenomena, Concentration effect, Constant phase element, Copper, Copper Sulfates, Copper deposition, Copper electrodeposition, Copper sulfate, Copper surface, Coverage fraction, Cupric, Cupric ions, Cuprous, Cuprous ions, Current densities, Current density, Current peak, Cuso4, Deposition, Disk electrode, Double layer capacitance, Electrical impedance, Electrochemical investigations, Electrochemical reaction, Electrochimica, Electrochimica acta, Electrode, Electrode impedance, Electrode surface, Electrodeposition, Electrolyte solutions, Electrolytic, Electrolytic bath, Electron transfer, Electrostatic phenomena, Elsevier science, Experimental data, Experimental study, Frequency domain, Frequency loop, Goldbach, Good agreement, High overpotentials, Impedance, Impedance measurements, Impedance parameter, Impedance spectra, Industrial relevancy, Inert molecules, Kinetic parameter, Kinetic parameters, Linear voltammetry, Lower extent, Medium effect, Metal interface, Nacl, Overpotential, Overpotential range, Overpotentials, Physical parameters, Plating surf, Platinum, Polypropylene ether, Potential range, Previous investigations, Production lines, Propylene oxide polymer, Rate constant, Reaction mechanism, Reference solution, Rotating disk electrode, Rotation rate, Rsol, Scan rate, Second loop, Simultaneous presence, Sodium Chlorides, Sodium chloride, Sodium chloride concentrations, Standard potentials, Sudden inhibition, Sulfate, Sulfate bath, Sulfuric, Sulfuric acid, Sulfuric solutions, Voltammetric, Voltammetric curves, Voltammetry.
- Teeft :
- Absolute overpotential, Acta, Active surface, Additive, Adsorption, Adsorption phenomena, Ambient temperature, Anodic charge transfer, Average value, Bath composition, Broad range, Bulk concentrations, Bulk solution, Capacitance, Cathode surface, Charge transfer, Charge transfer resistance, Chemical composition, Chloride, Chloride ions, Complexation phenomena, Constant phase element, Copper deposition, Copper electrodeposition, Copper sulfate, Copper surface, Coverage fraction, Cupric, Cupric ions, Cuprous, Cuprous ions, Current densities, Current density, Current peak, Cuso4, Deposition, Disk electrode, Double layer capacitance, Electrochemical investigations, Electrochimica, Electrochimica acta, Electrode, Electrode impedance, Electrode surface, Electrolyte solutions, Electrolytic, Electrolytic bath, Electron transfer, Electrostatic phenomena, Elsevier science, Experimental data, Frequency domain, Frequency loop, Goldbach, Good agreement, High overpotentials, Impedance, Impedance measurements, Impedance parameter, Impedance spectra, Industrial relevancy, Inert molecules, Kinetic parameters, Linear voltammetry, Lower extent, Metal interface, Nacl, Overpotential, Overpotential range, Overpotentials, Physical parameters, Plating surf, Polypropylene ether, Potential range, Previous investigations, Production lines, Reference solution, Rotation rate, Rsol, Scan rate, Second loop, Simultaneous presence, Sodium chloride, Sodium chloride concentrations, Standard potentials, Sudden inhibition, Sulfate, Sulfate bath, Sulfuric, Sulfuric acid, Sulfuric solutions, Voltammetric, Voltammetric curves, Voltammetry.
Abstract
Abstract: The paper presents the results of electrochemical investigations of copper deposition from a sulfate/sulfuric bath of industrial relevancy and containing two additives. In particular the effect of chloride ion with polypropylene ether (LP-1™) could be highlighted by voltammetry and impedance measurements. When used without chloride ion LP-1 adsorbs at the surface which reduces significantly the current density and the double layer capacitance. A current peak was observed for the simultaneous presence of the two additives and this was attributed to a sudden inhibition of the surface: in a narrow range of potential Cl-complexes were assumed to desorb from the surface, allowing significant adsorption of inert LP-1 molecules. Besides, kinetic parameters and the diffusion coefficient of cupric ion were correlated to the concentrations of additives, copper sulfate and sulfuric acid in a broad range of concentration.
Url:
DOI: 10.1016/S0013-4686(98)00112-1
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<term>Acta</term>
<term>Active surface</term>
<term>Additive</term>
<term>Adsorption</term>
<term>Adsorption phenomena</term>
<term>Ambient temperature</term>
<term>Anodic charge transfer</term>
<term>Average value</term>
<term>Bath composition</term>
<term>Branched polymer</term>
<term>Broad range</term>
<term>Bulk concentrations</term>
<term>Bulk solution</term>
<term>Capacitance</term>
<term>Cathode surface</term>
<term>Charge transfer</term>
<term>Charge transfer resistance</term>
<term>Chemical composition</term>
<term>Chloride</term>
<term>Chloride ions</term>
<term>Complexation phenomena</term>
<term>Concentration effect</term>
<term>Constant phase element</term>
<term>Copper</term>
<term>Copper Sulfates</term>
<term>Copper deposition</term>
<term>Copper electrodeposition</term>
<term>Copper sulfate</term>
<term>Copper surface</term>
<term>Coverage fraction</term>
<term>Cupric</term>
<term>Cupric ions</term>
<term>Cuprous</term>
<term>Cuprous ions</term>
<term>Current densities</term>
<term>Current density</term>
<term>Current peak</term>
<term>Cuso4</term>
<term>Deposition</term>
<term>Disk electrode</term>
<term>Double layer capacitance</term>
<term>Electrical impedance</term>
<term>Electrochemical investigations</term>
<term>Electrochemical reaction</term>
<term>Electrochimica</term>
<term>Electrochimica acta</term>
<term>Electrode</term>
<term>Electrode impedance</term>
<term>Electrode surface</term>
<term>Electrodeposition</term>
<term>Electrolyte solutions</term>
<term>Electrolytic</term>
<term>Electrolytic bath</term>
<term>Electron transfer</term>
<term>Electrostatic phenomena</term>
<term>Elsevier science</term>
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<term>Experimental study</term>
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<term>Frequency loop</term>
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<term>High overpotentials</term>
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<term>Impedance parameter</term>
<term>Impedance spectra</term>
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<term>Medium effect</term>
<term>Metal interface</term>
<term>Nacl</term>
<term>Overpotential</term>
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<term>Plating surf</term>
<term>Platinum</term>
<term>Polypropylene ether</term>
<term>Potential range</term>
<term>Previous investigations</term>
<term>Production lines</term>
<term>Propylene oxide polymer</term>
<term>Rate constant</term>
<term>Reaction mechanism</term>
<term>Reference solution</term>
<term>Rotating disk electrode</term>
<term>Rotation rate</term>
<term>Rsol</term>
<term>Scan rate</term>
<term>Second loop</term>
<term>Simultaneous presence</term>
<term>Sodium Chlorides</term>
<term>Sodium chloride</term>
<term>Sodium chloride concentrations</term>
<term>Standard potentials</term>
<term>Sudden inhibition</term>
<term>Sulfate</term>
<term>Sulfate bath</term>
<term>Sulfuric</term>
<term>Sulfuric acid</term>
<term>Sulfuric solutions</term>
<term>Voltammetric</term>
<term>Voltammetric curves</term>
<term>Voltammetry</term>
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<keywords scheme="Pascal" xml:lang="fr"><term>Constante vitesse</term>
<term>Cuivre</term>
<term>Cuivre Sulfate</term>
<term>Dépôt électrolytique</term>
<term>Effet concentration</term>
<term>Effet milieu</term>
<term>Electrode disque tournant</term>
<term>Etude expérimentale</term>
<term>Impédance électrique</term>
<term>Mécanisme réaction</term>
<term>Paramètre cinétique</term>
<term>Platine</term>
<term>Polymère ramifié</term>
<term>Propène oxyde polymère</term>
<term>Réaction électrochimique</term>
<term>Sodium Chlorure</term>
<term>Sulfurique acide</term>
</keywords>
<keywords scheme="Teeft" xml:lang="en"><term>Absolute overpotential</term>
<term>Acta</term>
<term>Active surface</term>
<term>Additive</term>
<term>Adsorption</term>
<term>Adsorption phenomena</term>
<term>Ambient temperature</term>
<term>Anodic charge transfer</term>
<term>Average value</term>
<term>Bath composition</term>
<term>Broad range</term>
<term>Bulk concentrations</term>
<term>Bulk solution</term>
<term>Capacitance</term>
<term>Cathode surface</term>
<term>Charge transfer</term>
<term>Charge transfer resistance</term>
<term>Chemical composition</term>
<term>Chloride</term>
<term>Chloride ions</term>
<term>Complexation phenomena</term>
<term>Constant phase element</term>
<term>Copper deposition</term>
<term>Copper electrodeposition</term>
<term>Copper sulfate</term>
<term>Copper surface</term>
<term>Coverage fraction</term>
<term>Cupric</term>
<term>Cupric ions</term>
<term>Cuprous</term>
<term>Cuprous ions</term>
<term>Current densities</term>
<term>Current density</term>
<term>Current peak</term>
<term>Cuso4</term>
<term>Deposition</term>
<term>Disk electrode</term>
<term>Double layer capacitance</term>
<term>Electrochemical investigations</term>
<term>Electrochimica</term>
<term>Electrochimica acta</term>
<term>Electrode</term>
<term>Electrode impedance</term>
<term>Electrode surface</term>
<term>Electrolyte solutions</term>
<term>Electrolytic</term>
<term>Electrolytic bath</term>
<term>Electron transfer</term>
<term>Electrostatic phenomena</term>
<term>Elsevier science</term>
<term>Experimental data</term>
<term>Frequency domain</term>
<term>Frequency loop</term>
<term>Goldbach</term>
<term>Good agreement</term>
<term>High overpotentials</term>
<term>Impedance</term>
<term>Impedance measurements</term>
<term>Impedance parameter</term>
<term>Impedance spectra</term>
<term>Industrial relevancy</term>
<term>Inert molecules</term>
<term>Kinetic parameters</term>
<term>Linear voltammetry</term>
<term>Lower extent</term>
<term>Metal interface</term>
<term>Nacl</term>
<term>Overpotential</term>
<term>Overpotential range</term>
<term>Overpotentials</term>
<term>Physical parameters</term>
<term>Plating surf</term>
<term>Polypropylene ether</term>
<term>Potential range</term>
<term>Previous investigations</term>
<term>Production lines</term>
<term>Reference solution</term>
<term>Rotation rate</term>
<term>Rsol</term>
<term>Scan rate</term>
<term>Second loop</term>
<term>Simultaneous presence</term>
<term>Sodium chloride</term>
<term>Sodium chloride concentrations</term>
<term>Standard potentials</term>
<term>Sudden inhibition</term>
<term>Sulfate</term>
<term>Sulfate bath</term>
<term>Sulfuric</term>
<term>Sulfuric acid</term>
<term>Sulfuric solutions</term>
<term>Voltammetric</term>
<term>Voltammetric curves</term>
<term>Voltammetry</term>
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<front><div type="abstract" xml:lang="en">Abstract: The paper presents the results of electrochemical investigations of copper deposition from a sulfate/sulfuric bath of industrial relevancy and containing two additives. In particular the effect of chloride ion with polypropylene ether (LP-1™) could be highlighted by voltammetry and impedance measurements. When used without chloride ion LP-1 adsorbs at the surface which reduces significantly the current density and the double layer capacitance. A current peak was observed for the simultaneous presence of the two additives and this was attributed to a sudden inhibition of the surface: in a narrow range of potential Cl-complexes were assumed to desorb from the surface, allowing significant adsorption of inert LP-1 molecules. Besides, kinetic parameters and the diffusion coefficient of cupric ion were correlated to the concentrations of additives, copper sulfate and sulfuric acid in a broad range of concentration.</div>
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<sourceDesc><biblStruct><analytic><title xml:lang="en" level="a">Coupled effects of chloride ions and branch chained polypropylene ether LP-1 on the electrochemical deposition of copper from sulfate solutions</title>
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<s2>54001 Nancy</s2>
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<sZ>1 aut.</sZ>
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<author><name sortKey="Messing, W" sort="Messing, W" uniqKey="Messing W" first="W." last="Messing">W. Messing</name>
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<s3>NLD</s3>
<sZ>2 aut.</sZ>
<sZ>3 aut.</sZ>
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<wicri:noRegion>5600 Eindhoven</wicri:noRegion>
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<author><name sortKey="Daenen, T" sort="Daenen, T" uniqKey="Daenen T" first="T." last="Daenen">T. Daenen</name>
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<sZ>3 aut.</sZ>
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<author><name sortKey="Lapicque, F" sort="Lapicque, F" uniqKey="Lapicque F" first="F." last="Lapicque">François Lapicque</name>
<affiliation wicri:level="3"><inist:fA14 i1="01"><s1>Laboratoire des Sciences du Génie Chimique, CNRS-ENSIC-INPL, BP 451</s1>
<s2>54001 Nancy</s2>
<s3>FRA</s3>
<sZ>1 aut.</sZ>
<sZ>4 aut.</sZ>
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<country>France</country>
<placeName><region type="region" nuts="2">Grand Est</region>
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<settlement type="city">Nancy</settlement>
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<placeName><settlement type="city">Nancy</settlement>
<region type="region" nuts="2">Grand Est</region>
<region type="region" nuts="2">Lorraine (région)</region>
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<orgName type="laboratoire" n="5">Laboratoire réactions et génie des procédés</orgName>
<orgName type="university">Université de Lorraine</orgName>
<orgName type="institution">Centre national de la recherche scientifique</orgName>
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<series><title level="j" type="main">Electrochimica acta</title>
<title level="j" type="abbreviated">Electrochim. acta</title>
<idno type="ISSN">0013-4686</idno>
<imprint><date when="1998">1998</date>
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<idno type="ISSN">0013-4686</idno>
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<profileDesc><textClass><keywords scheme="KwdEn" xml:lang="en"><term>Branched polymer</term>
<term>Concentration effect</term>
<term>Copper</term>
<term>Copper Sulfates</term>
<term>Electrical impedance</term>
<term>Electrochemical reaction</term>
<term>Electrodeposition</term>
<term>Experimental study</term>
<term>Kinetic parameter</term>
<term>Medium effect</term>
<term>Platinum</term>
<term>Propylene oxide polymer</term>
<term>Rate constant</term>
<term>Reaction mechanism</term>
<term>Rotating disk electrode</term>
<term>Sodium Chlorides</term>
<term>Sulfuric acid</term>
</keywords>
<keywords scheme="Pascal" xml:lang="fr"><term>Etude expérimentale</term>
<term>Dépôt électrolytique</term>
<term>Réaction électrochimique</term>
<term>Cuivre</term>
<term>Cuivre Sulfate</term>
<term>Sulfurique acide</term>
<term>Effet milieu</term>
<term>Sodium Chlorure</term>
<term>Propène oxyde polymère</term>
<term>Polymère ramifié</term>
<term>Effet concentration</term>
<term>Electrode disque tournant</term>
<term>Platine</term>
<term>Paramètre cinétique</term>
<term>Constante vitesse</term>
<term>Mécanisme réaction</term>
<term>Impédance électrique</term>
</keywords>
<keywords scheme="Wicri" type="topic" xml:lang="fr"><term>Cuivre</term>
<term>Platine</term>
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<front><div type="abstract" xml:lang="en">The paper presents the results of electrochemical investigations of copper deposition from a sulfate/sulfuric bath of industrial relevancy and containing two additives. In particular the effect of chloride ion with polypropylene ether (LP-1) could be highlighted by voltammetry and impedance measurements. When used without chloride ion LP-1 adsorbs at the surface which reduces significantly the current density and the double layer capacitance. A current peak was observed for the simultaneous presence of the two additives and this was attributed to a sudden inhibition of the surface: in a narrow range of potential Cl-complexes were assumed to desorb from the surface, allowing significant adsorption of inert LP-1 molecules. Besides, kinetic parameters and the diffusion coefficient of cupric ion were correlated to the concentrations of additives, copper sulfate and sulfuric acid in a broad range of concentration.</div>
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<profileDesc><textClass><keywords scheme="KwdEn" xml:lang="en"><term>Absolute overpotential</term>
<term>Acta</term>
<term>Active surface</term>
<term>Additive</term>
<term>Adsorption</term>
<term>Adsorption phenomena</term>
<term>Ambient temperature</term>
<term>Anodic charge transfer</term>
<term>Average value</term>
<term>Bath composition</term>
<term>Broad range</term>
<term>Bulk concentrations</term>
<term>Bulk solution</term>
<term>Capacitance</term>
<term>Cathode surface</term>
<term>Charge transfer</term>
<term>Charge transfer resistance</term>
<term>Chemical composition</term>
<term>Chloride</term>
<term>Chloride ions</term>
<term>Complexation phenomena</term>
<term>Constant phase element</term>
<term>Copper deposition</term>
<term>Copper electrodeposition</term>
<term>Copper sulfate</term>
<term>Copper surface</term>
<term>Coverage fraction</term>
<term>Cupric</term>
<term>Cupric ions</term>
<term>Cuprous</term>
<term>Cuprous ions</term>
<term>Current densities</term>
<term>Current density</term>
<term>Current peak</term>
<term>Cuso4</term>
<term>Deposition</term>
<term>Disk electrode</term>
<term>Double layer capacitance</term>
<term>Electrochemical investigations</term>
<term>Electrochimica</term>
<term>Electrochimica acta</term>
<term>Electrode</term>
<term>Electrode impedance</term>
<term>Electrode surface</term>
<term>Electrolyte solutions</term>
<term>Electrolytic</term>
<term>Electrolytic bath</term>
<term>Electron transfer</term>
<term>Electrostatic phenomena</term>
<term>Elsevier science</term>
<term>Experimental data</term>
<term>Frequency domain</term>
<term>Frequency loop</term>
<term>Goldbach</term>
<term>Good agreement</term>
<term>High overpotentials</term>
<term>Impedance</term>
<term>Impedance measurements</term>
<term>Impedance parameter</term>
<term>Impedance spectra</term>
<term>Industrial relevancy</term>
<term>Inert molecules</term>
<term>Kinetic parameters</term>
<term>Linear voltammetry</term>
<term>Lower extent</term>
<term>Metal interface</term>
<term>Nacl</term>
<term>Overpotential</term>
<term>Overpotential range</term>
<term>Overpotentials</term>
<term>Physical parameters</term>
<term>Plating surf</term>
<term>Polypropylene ether</term>
<term>Potential range</term>
<term>Previous investigations</term>
<term>Production lines</term>
<term>Reference solution</term>
<term>Rotation rate</term>
<term>Rsol</term>
<term>Scan rate</term>
<term>Second loop</term>
<term>Simultaneous presence</term>
<term>Sodium chloride</term>
<term>Sodium chloride concentrations</term>
<term>Standard potentials</term>
<term>Sudden inhibition</term>
<term>Sulfate</term>
<term>Sulfate bath</term>
<term>Sulfuric</term>
<term>Sulfuric acid</term>
<term>Sulfuric solutions</term>
<term>Voltammetric</term>
<term>Voltammetric curves</term>
<term>Voltammetry</term>
</keywords>
<keywords scheme="Teeft" xml:lang="en"><term>Absolute overpotential</term>
<term>Acta</term>
<term>Active surface</term>
<term>Additive</term>
<term>Adsorption</term>
<term>Adsorption phenomena</term>
<term>Ambient temperature</term>
<term>Anodic charge transfer</term>
<term>Average value</term>
<term>Bath composition</term>
<term>Broad range</term>
<term>Bulk concentrations</term>
<term>Bulk solution</term>
<term>Capacitance</term>
<term>Cathode surface</term>
<term>Charge transfer</term>
<term>Charge transfer resistance</term>
<term>Chemical composition</term>
<term>Chloride</term>
<term>Chloride ions</term>
<term>Complexation phenomena</term>
<term>Constant phase element</term>
<term>Copper deposition</term>
<term>Copper electrodeposition</term>
<term>Copper sulfate</term>
<term>Copper surface</term>
<term>Coverage fraction</term>
<term>Cupric</term>
<term>Cupric ions</term>
<term>Cuprous</term>
<term>Cuprous ions</term>
<term>Current densities</term>
<term>Current density</term>
<term>Current peak</term>
<term>Cuso4</term>
<term>Deposition</term>
<term>Disk electrode</term>
<term>Double layer capacitance</term>
<term>Electrochemical investigations</term>
<term>Electrochimica</term>
<term>Electrochimica acta</term>
<term>Electrode</term>
<term>Electrode impedance</term>
<term>Electrode surface</term>
<term>Electrolyte solutions</term>
<term>Electrolytic</term>
<term>Electrolytic bath</term>
<term>Electron transfer</term>
<term>Electrostatic phenomena</term>
<term>Elsevier science</term>
<term>Experimental data</term>
<term>Frequency domain</term>
<term>Frequency loop</term>
<term>Goldbach</term>
<term>Good agreement</term>
<term>High overpotentials</term>
<term>Impedance</term>
<term>Impedance measurements</term>
<term>Impedance parameter</term>
<term>Impedance spectra</term>
<term>Industrial relevancy</term>
<term>Inert molecules</term>
<term>Kinetic parameters</term>
<term>Linear voltammetry</term>
<term>Lower extent</term>
<term>Metal interface</term>
<term>Nacl</term>
<term>Overpotential</term>
<term>Overpotential range</term>
<term>Overpotentials</term>
<term>Physical parameters</term>
<term>Plating surf</term>
<term>Polypropylene ether</term>
<term>Potential range</term>
<term>Previous investigations</term>
<term>Production lines</term>
<term>Reference solution</term>
<term>Rotation rate</term>
<term>Rsol</term>
<term>Scan rate</term>
<term>Second loop</term>
<term>Simultaneous presence</term>
<term>Sodium chloride</term>
<term>Sodium chloride concentrations</term>
<term>Standard potentials</term>
<term>Sudden inhibition</term>
<term>Sulfate</term>
<term>Sulfate bath</term>
<term>Sulfuric</term>
<term>Sulfuric acid</term>
<term>Sulfuric solutions</term>
<term>Voltammetric</term>
<term>Voltammetric curves</term>
<term>Voltammetry</term>
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<front><div type="abstract" xml:lang="en">Abstract: The paper presents the results of electrochemical investigations of copper deposition from a sulfate/sulfuric bath of industrial relevancy and containing two additives. In particular the effect of chloride ion with polypropylene ether (LP-1™) could be highlighted by voltammetry and impedance measurements. When used without chloride ion LP-1 adsorbs at the surface which reduces significantly the current density and the double layer capacitance. A current peak was observed for the simultaneous presence of the two additives and this was attributed to a sudden inhibition of the surface: in a narrow range of potential Cl-complexes were assumed to desorb from the surface, allowing significant adsorption of inert LP-1 molecules. Besides, kinetic parameters and the diffusion coefficient of cupric ion were correlated to the concentrations of additives, copper sulfate and sulfuric acid in a broad range of concentration.</div>
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