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Coupled effects of chloride ions and branch chained polypropylene ether LP-1™ on the electrochemical deposition of copper from sulfate solutions

Identifieur interne : 000908 ( Istex/Checkpoint ); précédent : 000907; suivant : 000909

Coupled effects of chloride ions and branch chained polypropylene ether LP-1™ on the electrochemical deposition of copper from sulfate solutions

Auteurs : Susanne Goldbach [France] ; Werner Messing [Pays-Bas] ; Theo Daenen [Pays-Bas] ; François Lapicque [France]

Source :

Electrochimica Acta [ 0013-4686 ] ; 1998.

RBID : ISTEX:F838FABE8735F74E97C1B679F0D1C16A6491076B

English descriptors

Abstract

Abstract: The paper presents the results of electrochemical investigations of copper deposition from a sulfate/sulfuric bath of industrial relevancy and containing two additives. In particular the effect of chloride ion with polypropylene ether (LP-1™) could be highlighted by voltammetry and impedance measurements. When used without chloride ion LP-1 adsorbs at the surface which reduces significantly the current density and the double layer capacitance. A current peak was observed for the simultaneous presence of the two additives and this was attributed to a sudden inhibition of the surface: in a narrow range of potential Cl-complexes were assumed to desorb from the surface, allowing significant adsorption of inert LP-1 molecules. Besides, kinetic parameters and the diffusion coefficient of cupric ion were correlated to the concentrations of additives, copper sulfate and sulfuric acid in a broad range of concentration.

Url:

https://api.istex.fr/document/F838FABE8735F74E97C1B679F0D1C16A6491076B/fulltext/pdf

DOI: 10.1016/S0013-4686(98)00112-1

Affiliations:

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Le document en format XML

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</author>
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<author><name sortKey="Daenen, Theo" sort="Daenen, Theo" uniqKey="Daenen T" first="Theo" last="Daenen">Theo Daenen</name>
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<term>Acta</term>
<term>Active surface</term>
<term>Additive</term>
<term>Adsorption</term>
<term>Adsorption phenomena</term>
<term>Ambient temperature</term>
<term>Anodic charge transfer</term>
<term>Average value</term>
<term>Bath composition</term>
<term>Broad range</term>
<term>Bulk concentrations</term>
<term>Bulk solution</term>
<term>Capacitance</term>
<term>Cathode surface</term>
<term>Charge transfer</term>
<term>Charge transfer resistance</term>
<term>Chemical composition</term>
<term>Chloride</term>
<term>Chloride ions</term>
<term>Complexation phenomena</term>
<term>Constant phase element</term>
<term>Copper deposition</term>
<term>Copper electrodeposition</term>
<term>Copper sulfate</term>
<term>Copper surface</term>
<term>Coverage fraction</term>
<term>Cupric</term>
<term>Cupric ions</term>
<term>Cuprous</term>
<term>Cuprous ions</term>
<term>Current densities</term>
<term>Current density</term>
<term>Current peak</term>
<term>Cuso4</term>
<term>Deposition</term>
<term>Disk electrode</term>
<term>Double layer capacitance</term>
<term>Electrochemical investigations</term>
<term>Electrochimica</term>
<term>Electrochimica acta</term>
<term>Electrode</term>
<term>Electrode impedance</term>
<term>Electrode surface</term>
<term>Electrolyte solutions</term>
<term>Electrolytic</term>
<term>Electrolytic bath</term>
<term>Electron transfer</term>
<term>Electrostatic phenomena</term>
<term>Elsevier science</term>
<term>Experimental data</term>
<term>Frequency domain</term>
<term>Frequency loop</term>
<term>Goldbach</term>
<term>Good agreement</term>
<term>High overpotentials</term>
<term>Impedance</term>
<term>Impedance measurements</term>
<term>Impedance parameter</term>
<term>Impedance spectra</term>
<term>Industrial relevancy</term>
<term>Inert molecules</term>
<term>Kinetic parameters</term>
<term>Linear voltammetry</term>
<term>Lower extent</term>
<term>Metal interface</term>
<term>Nacl</term>
<term>Overpotential</term>
<term>Overpotential range</term>
<term>Overpotentials</term>
<term>Physical parameters</term>
<term>Plating surf</term>
<term>Polypropylene ether</term>
<term>Potential range</term>
<term>Previous investigations</term>
<term>Production lines</term>
<term>Reference solution</term>
<term>Rotation rate</term>
<term>Rsol</term>
<term>Scan rate</term>
<term>Second loop</term>
<term>Simultaneous presence</term>
<term>Sodium chloride</term>
<term>Sodium chloride concentrations</term>
<term>Standard potentials</term>
<term>Sudden inhibition</term>
<term>Sulfate</term>
<term>Sulfate bath</term>
<term>Sulfuric</term>
<term>Sulfuric acid</term>
<term>Sulfuric solutions</term>
<term>Voltammetric</term>
<term>Voltammetric curves</term>
<term>Voltammetry</term>
</keywords>
<keywords scheme="Teeft" xml:lang="en"><term>Absolute overpotential</term>
<term>Acta</term>
<term>Active surface</term>
<term>Additive</term>
<term>Adsorption</term>
<term>Adsorption phenomena</term>
<term>Ambient temperature</term>
<term>Anodic charge transfer</term>
<term>Average value</term>
<term>Bath composition</term>
<term>Broad range</term>
<term>Bulk concentrations</term>
<term>Bulk solution</term>
<term>Capacitance</term>
<term>Cathode surface</term>
<term>Charge transfer</term>
<term>Charge transfer resistance</term>
<term>Chemical composition</term>
<term>Chloride</term>
<term>Chloride ions</term>
<term>Complexation phenomena</term>
<term>Constant phase element</term>
<term>Copper deposition</term>
<term>Copper electrodeposition</term>
<term>Copper sulfate</term>
<term>Copper surface</term>
<term>Coverage fraction</term>
<term>Cupric</term>
<term>Cupric ions</term>
<term>Cuprous</term>
<term>Cuprous ions</term>
<term>Current densities</term>
<term>Current density</term>
<term>Current peak</term>
<term>Cuso4</term>
<term>Deposition</term>
<term>Disk electrode</term>
<term>Double layer capacitance</term>
<term>Electrochemical investigations</term>
<term>Electrochimica</term>
<term>Electrochimica acta</term>
<term>Electrode</term>
<term>Electrode impedance</term>
<term>Electrode surface</term>
<term>Electrolyte solutions</term>
<term>Electrolytic</term>
<term>Electrolytic bath</term>
<term>Electron transfer</term>
<term>Electrostatic phenomena</term>
<term>Elsevier science</term>
<term>Experimental data</term>
<term>Frequency domain</term>
<term>Frequency loop</term>
<term>Goldbach</term>
<term>Good agreement</term>
<term>High overpotentials</term>
<term>Impedance</term>
<term>Impedance measurements</term>
<term>Impedance parameter</term>
<term>Impedance spectra</term>
<term>Industrial relevancy</term>
<term>Inert molecules</term>
<term>Kinetic parameters</term>
<term>Linear voltammetry</term>
<term>Lower extent</term>
<term>Metal interface</term>
<term>Nacl</term>
<term>Overpotential</term>
<term>Overpotential range</term>
<term>Overpotentials</term>
<term>Physical parameters</term>
<term>Plating surf</term>
<term>Polypropylene ether</term>
<term>Potential range</term>
<term>Previous investigations</term>
<term>Production lines</term>
<term>Reference solution</term>
<term>Rotation rate</term>
<term>Rsol</term>
<term>Scan rate</term>
<term>Second loop</term>
<term>Simultaneous presence</term>
<term>Sodium chloride</term>
<term>Sodium chloride concentrations</term>
<term>Standard potentials</term>
<term>Sudden inhibition</term>
<term>Sulfate</term>
<term>Sulfate bath</term>
<term>Sulfuric</term>
<term>Sulfuric acid</term>
<term>Sulfuric solutions</term>
<term>Voltammetric</term>
<term>Voltammetric curves</term>
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<front><div type="abstract" xml:lang="en">Abstract: The paper presents the results of electrochemical investigations of copper deposition from a sulfate/sulfuric bath of industrial relevancy and containing two additives. In particular the effect of chloride ion with polypropylene ether (LP-1™) could be highlighted by voltammetry and impedance measurements. When used without chloride ion LP-1 adsorbs at the surface which reduces significantly the current density and the double layer capacitance. A current peak was observed for the simultaneous presence of the two additives and this was attributed to a sudden inhibition of the surface: in a narrow range of potential Cl-complexes were assumed to desorb from the surface, allowing significant adsorption of inert LP-1 molecules. Besides, kinetic parameters and the diffusion coefficient of cupric ion were correlated to the concentrations of additives, copper sulfate and sulfuric acid in a broad range of concentration.</div>
</front>
</TEI>
<affiliations><list><country><li>France</li>
<li>Pays-Bas</li>
</country>
<region><li>Grand Est</li>
<li>Lorraine (région)</li>
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<settlement><li>Nancy</li>
</settlement>
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<tree><country name="France"><region name="Grand Est"><name sortKey="Goldbach, Susanne" sort="Goldbach, Susanne" uniqKey="Goldbach S" first="Susanne" last="Goldbach">Susanne Goldbach</name>
</region>
<name sortKey="Lapicque, Francois" sort="Lapicque, Francois" uniqKey="Lapicque F" first="François" last="Lapicque">François Lapicque</name>
<name sortKey="Lapicque, Francois" sort="Lapicque, Francois" uniqKey="Lapicque F" first="François" last="Lapicque">François Lapicque</name>
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<country name="Pays-Bas"><noRegion><name sortKey="Messing, Werner" sort="Messing, Werner" uniqKey="Messing W" first="Werner" last="Messing">Werner Messing</name>
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<name sortKey="Daenen, Theo" sort="Daenen, Theo" uniqKey="Daenen T" first="Theo" last="Daenen">Theo Daenen</name>
</country>
</tree>
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</record>

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Coupled effects of chloride ions and branch chained polypropylene ether LP-1™ on the electrochemical deposition of copper from sulfate solutions

Coupled effects of chloride ions and branch chained polypropylene ether LP-1™ on the electrochemical deposition of copper from sulfate solutions

Source :

English descriptors

Abstract

Links toward previous steps (curation, corpus...)

Links to Exploration step

Le document en format XML

Pour manipuler ce document sous Unix (Dilib)

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