LrgpV1, Istex, Corpus, bibRecord, 001385

Coupled effects of chloride ions and branch chained polypropylene ether LP-1™ on the electrochemical deposition of copper from sulfate solutions

Identifieur interne : 001385 ( Istex/Corpus ); précédent : 001384; suivant : 001386

Coupled effects of chloride ions and branch chained polypropylene ether LP-1™ on the electrochemical deposition of copper from sulfate solutions

Auteurs : Susanne Goldbach ; Werner Messing ; Theo Daenen ; François Lapicque

Source :

Electrochimica Acta [ 0013-4686 ] ; 1998.

RBID : ISTEX:F838FABE8735F74E97C1B679F0D1C16A6491076B

English descriptors

Abstract

Abstract: The paper presents the results of electrochemical investigations of copper deposition from a sulfate/sulfuric bath of industrial relevancy and containing two additives. In particular the effect of chloride ion with polypropylene ether (LP-1™) could be highlighted by voltammetry and impedance measurements. When used without chloride ion LP-1 adsorbs at the surface which reduces significantly the current density and the double layer capacitance. A current peak was observed for the simultaneous presence of the two additives and this was attributed to a sudden inhibition of the surface: in a narrow range of potential Cl-complexes were assumed to desorb from the surface, allowing significant adsorption of inert LP-1 molecules. Besides, kinetic parameters and the diffusion coefficient of cupric ion were correlated to the concentrations of additives, copper sulfate and sulfuric acid in a broad range of concentration.

Url:

https://api.istex.fr/document/F838FABE8735F74E97C1B679F0D1C16A6491076B/fulltext/pdf

DOI: 10.1016/S0013-4686(98)00112-1

Links to Exploration step

ISTEX:F838FABE8735F74E97C1B679F0D1C16A6491076B

Le document en format XML

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<front><div type="abstract" xml:lang="en">Abstract: The paper presents the results of electrochemical investigations of copper deposition from a sulfate/sulfuric bath of industrial relevancy and containing two additives. In particular the effect of chloride ion with polypropylene ether (LP-1™) could be highlighted by voltammetry and impedance measurements. When used without chloride ion LP-1 adsorbs at the surface which reduces significantly the current density and the double layer capacitance. A current peak was observed for the simultaneous presence of the two additives and this was attributed to a sudden inhibition of the surface: in a narrow range of potential Cl-complexes were assumed to desorb from the surface, allowing significant adsorption of inert LP-1 molecules. Besides, kinetic parameters and the diffusion coefficient of cupric ion were correlated to the concentrations of additives, copper sulfate and sulfuric acid in a broad range of concentration.</div>
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<abstract>The paper presents the results of electrochemical investigations of copper deposition from a sulfate/sulfuric bath of industrial relevancy and containing two additives. In particular the effect of chloride ion with polypropylene ether (LP-1™) could be highlighted by voltammetry and impedance measurements. When used without chloride ion LP-1 adsorbs at the surface which reduces significantly the current density and the double layer capacitance. A current peak was observed for the simultaneous presence of the two additives and this was attributed to a sudden inhibition of the surface: in a narrow range of potential Cl-complexes were assumed to desorb from the surface, allowing significant adsorption of inert LP-1 molecules. Besides, kinetic parameters and the diffusion coefficient of cupric ion were correlated to the concentrations of additives, copper sulfate and sulfuric acid in a broad range of concentration.</abstract>
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<notesStmt><note type="content">Fig. 1: Voltammetric curves recorded at a RDE at 500rpm from a 0.348M CuSO4 2.06M H2SO4 solution at 22°C without additives.</note>
<note type="content">Fig. 2: Voltammetric curves of copper deposition from a 0.348M CuSO4 2.06M H2SO4 solution; 500rpm and 22°C. Effect of the presence of the additives: NaCl at 100ppm and LP-1 at 0.6vol%.</note>
<note type="content">Fig. 3: Zoomed view of the voltammetric curves of copper deposition from a 0.348M CuSO4 2.06M H2SO4 solution; 500rpm and 22°C; Effect of the sodium chloride concentration and the amount of LP-1 added.</note>
<note type="content">Fig. 4: Impedance spectra of RDE electrode immersed in a 0.348M CuSO4 2.06M H2SO4 solution near the rest potential. Effect of the presence of the additives: NaCl at 100ppm and LP-1 at 0.6vol%.</note>
<note type="content">Fig. 5: Impedance spectra of RDE electrode immersed in a 0.348M CuSO4 2.06M H2SO4 solution with the additives (NaCl at 100ppm and LP-1 at 0.6vol%): effect of the electrode potential referred to the saturated mercury sulfate electrode.</note>
<note type="content">Fig. 6: Variation of the impedance parameter for the CPE with the overpotential. Spectra were recorded from a 0.348M CuSO4 2.06M H2SO4 solution. Effect of the presence of the additives: NaCl at 100ppm and LP-1 at 0.6vol%.</note>
<note type="content">Fig. 7: Variation of the double layer capacitance with the overpotential. Spectra were recorded from a 0.348M CuSO4 2.06M H2SO4 solution. Effect of the presence of the additives: NaCl at 100ppm and LP-1 at 0.6vol%.</note>
<note type="content">Table 1: Physico-chemical properties of electrolyte solutions at 22°C</note>
<note type="content">Table 2: Kinetic parameters for copper deposition from a 0.348M CuSO4 2.06M H2SO4 solution at 22°C obtained by treatment of voltammetric curves at a platinum RDE: influence of additive contents</note>
<note type="content">Table 3: Kinetic parameters for copper deposition from a 0.348M CuSO4 2.06M H2SO4 solution at 22°C obtained by treatment of impedance measurements at a copper RDE</note>
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<sourceDesc><biblStruct type="inbook"><analytic><title level="a">Coupled effects of chloride ions and branch chained polypropylene ether LP-1™ on the electrochemical deposition of copper from sulfate solutions</title>
<author xml:id="author-0000"><persName><forename type="first">Susanne</forename>
<surname>Goldbach</surname>
</persName>
<affiliation>Laboratoire des Sciences du Génie Chimique, CNRS-ENSIC-INPL, BP 451, F-54001 Nancy, France</affiliation>
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<author xml:id="author-0001"><persName><forename type="first">Werner</forename>
<surname>Messing</surname>
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<affiliation>Philips PMF N.V., Glaslaan S17-II-5, NL-5600 Eindhoven, The Netherlands</affiliation>
</author>
<author xml:id="author-0002"><persName><forename type="first">Theo</forename>
<surname>Daenen</surname>
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<affiliation>Philips PMF N.V., Glaslaan S17-II-5, NL-5600 Eindhoven, The Netherlands</affiliation>
</author>
<author xml:id="author-0003"><persName><forename type="first">François</forename>
<surname>Lapicque</surname>
</persName>
<affiliation>Laboratoire des Sciences du Génie Chimique, CNRS-ENSIC-INPL, BP 451, F-54001 Nancy, France</affiliation>
<affiliation>Author to whom correspondence should be addressed. Tel.: +33 383 175266; Fax: +33 383 32 2975; e-mail: lapicque@ensic.u-nancy.fr</affiliation>
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<title level="j" type="abbrev">EA</title>
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<biblScope unit="volume">44</biblScope>
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<abstract xml:lang="en"><p>The paper presents the results of electrochemical investigations of copper deposition from a sulfate/sulfuric bath of industrial relevancy and containing two additives. In particular the effect of chloride ion with polypropylene ether (LP-1™) could be highlighted by voltammetry and impedance measurements. When used without chloride ion LP-1 adsorbs at the surface which reduces significantly the current density and the double layer capacitance. A current peak was observed for the simultaneous presence of the two additives and this was attributed to a sudden inhibition of the surface: in a narrow range of potential Cl-complexes were assumed to desorb from the surface, allowing significant adsorption of inert LP-1 molecules. Besides, kinetic parameters and the diffusion coefficient of cupric ion were correlated to the concentrations of additives, copper sulfate and sulfuric acid in a broad range of concentration.</p>
</abstract>
<textClass><keywords scheme="keyword"><list><head>Keywords</head>
<item><term>copper electrodeposition</term>
</item>
<item><term>sulfate bath</term>
</item>
<item><term>effect of additives</term>
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<item><term>voltammetry</term>
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<item><term>impedance measurements</term>
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<head><ce:title>Coupled effects of chloride ions and branch chained polypropylene ether LP-1<ce:sup>™</ce:sup>
 on the electrochemical deposition of copper from sulfate solutions</ce:title>
<ce:author-group><ce:author><ce:given-name>Susanne</ce:given-name>
<ce:surname>Goldbach</ce:surname>
<ce:cross-ref refid="AFF1">a</ce:cross-ref>
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<ce:author><ce:given-name>Werner</ce:given-name>
<ce:surname>Messing</ce:surname>
<ce:cross-ref refid="AFF2">b</ce:cross-ref>
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<ce:author><ce:given-name>Theo</ce:given-name>
<ce:surname>Daenen</ce:surname>
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<ce:author><ce:given-name>François</ce:given-name>
<ce:surname>Lapicque</ce:surname>
<ce:cross-ref refid="AFF1">a</ce:cross-ref>
<ce:cross-ref refid="CORR1">*</ce:cross-ref>
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<ce:textfn>Philips PMF N.V., Glaslaan S17-II-5, NL-5600 Eindhoven, The Netherlands</ce:textfn>
</ce:affiliation>
<ce:correspondence id="CORR1"><ce:label>*</ce:label>
<ce:text>Author to whom correspondence should be addressed. Tel.: +33 383 175266; Fax: +33 383 32 2975; e-mail: lapicque@ensic.u-nancy.fr</ce:text>
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<ce:abstract><ce:section-title>Abstract</ce:section-title>
<ce:abstract-sec><ce:simple-para>The paper presents the results of electrochemical investigations of copper deposition from a sulfate/sulfuric bath of industrial relevancy and containing two additives. In particular the effect of chloride ion with polypropylene ether (LP-1™) could be highlighted by voltammetry and impedance measurements. When used without chloride ion LP-1 adsorbs at the surface which reduces significantly the current density and the double layer capacitance. A current peak was observed for the simultaneous presence of the two additives and this was attributed to a sudden inhibition of the surface: in a narrow range of potential Cl-complexes were assumed to desorb from the surface, allowing significant adsorption of inert LP-1 molecules. Besides, kinetic parameters and the diffusion coefficient of cupric ion were correlated to the concentrations of additives, copper sulfate and sulfuric acid in a broad range of concentration.</ce:simple-para>
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<ce:keywords class="keyword"><ce:section-title>Keywords</ce:section-title>
<ce:keyword><ce:text>copper electrodeposition</ce:text>
</ce:keyword>
<ce:keyword><ce:text>sulfate bath</ce:text>
</ce:keyword>
<ce:keyword><ce:text>effect of additives</ce:text>
</ce:keyword>
<ce:keyword><ce:text>voltammetry</ce:text>
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<ce:keyword><ce:text>impedance measurements</ce:text>
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<abstract lang="en">Abstract: The paper presents the results of electrochemical investigations of copper deposition from a sulfate/sulfuric bath of industrial relevancy and containing two additives. In particular the effect of chloride ion with polypropylene ether (LP-1™) could be highlighted by voltammetry and impedance measurements. When used without chloride ion LP-1 adsorbs at the surface which reduces significantly the current density and the double layer capacitance. A current peak was observed for the simultaneous presence of the two additives and this was attributed to a sudden inhibition of the surface: in a narrow range of potential Cl-complexes were assumed to desorb from the surface, allowing significant adsorption of inert LP-1 molecules. Besides, kinetic parameters and the diffusion coefficient of cupric ion were correlated to the concentrations of additives, copper sulfate and sulfuric acid in a broad range of concentration.</abstract>
<note type="content">Fig. 1: Voltammetric curves recorded at a RDE at 500rpm from a 0.348M CuSO4 2.06M H2SO4 solution at 22°C without additives.</note>
<note type="content">Fig. 2: Voltammetric curves of copper deposition from a 0.348M CuSO4 2.06M H2SO4 solution; 500rpm and 22°C. Effect of the presence of the additives: NaCl at 100ppm and LP-1 at 0.6vol%.</note>
<note type="content">Fig. 3: Zoomed view of the voltammetric curves of copper deposition from a 0.348M CuSO4 2.06M H2SO4 solution; 500rpm and 22°C; Effect of the sodium chloride concentration and the amount of LP-1 added.</note>
<note type="content">Fig. 4: Impedance spectra of RDE electrode immersed in a 0.348M CuSO4 2.06M H2SO4 solution near the rest potential. Effect of the presence of the additives: NaCl at 100ppm and LP-1 at 0.6vol%.</note>
<note type="content">Fig. 5: Impedance spectra of RDE electrode immersed in a 0.348M CuSO4 2.06M H2SO4 solution with the additives (NaCl at 100ppm and LP-1 at 0.6vol%): effect of the electrode potential referred to the saturated mercury sulfate electrode.</note>
<note type="content">Fig. 6: Variation of the impedance parameter for the CPE with the overpotential. Spectra were recorded from a 0.348M CuSO4 2.06M H2SO4 solution. Effect of the presence of the additives: NaCl at 100ppm and LP-1 at 0.6vol%.</note>
<note type="content">Fig. 7: Variation of the double layer capacitance with the overpotential. Spectra were recorded from a 0.348M CuSO4 2.06M H2SO4 solution. Effect of the presence of the additives: NaCl at 100ppm and LP-1 at 0.6vol%.</note>
<note type="content">Table 1: Physico-chemical properties of electrolyte solutions at 22°C</note>
<note type="content">Table 2: Kinetic parameters for copper deposition from a 0.348M CuSO4 2.06M H2SO4 solution at 22°C obtained by treatment of voltammetric curves at a platinum RDE: influence of additive contents</note>
<note type="content">Table 3: Kinetic parameters for copper deposition from a 0.348M CuSO4 2.06M H2SO4 solution at 22°C obtained by treatment of impedance measurements at a copper RDE</note>
<subject><genre>Keywords</genre>
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<topic>effect of additives</topic>
<topic>voltammetry</topic>
<topic>impedance measurements</topic>
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Coupled effects of chloride ions and branch chained polypropylene ether LP-1™ on the electrochemical deposition of copper from sulfate solutions

Coupled effects of chloride ions and branch chained polypropylene ether LP-1™ on the electrochemical deposition of copper from sulfate solutions

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