LrgpV1, PascalFrancis, Corpus, bibRecord, 000C54

Coupled effects of chloride ions and branch chained polypropylene ether LP-1 on the electrochemical deposition of copper from sulfate solutions

Identifieur interne : 000C54 ( PascalFrancis/Corpus ); précédent : 000C53; suivant : 000C55

Coupled effects of chloride ions and branch chained polypropylene ether LP-1 on the electrochemical deposition of copper from sulfate solutions

Auteurs : S. Goldbach ; W. Messing ; T. Daenen ; F. Lapicque

Source :

Electrochimica acta [ 0013-4686 ] ; 1998.

RBID : Pascal:98-0467730

Descripteurs français

Pascal (Inist)
- Etude expérimentale, Dépôt électrolytique, Réaction électrochimique, Cuivre, Cuivre Sulfate, Sulfurique acide, Effet milieu, Sodium Chlorure, Propène oxyde polymère, Polymère ramifié, Effet concentration, Electrode disque tournant, Platine, Paramètre cinétique, Constante vitesse, Mécanisme réaction, Impédance électrique.

English descriptors

KwdEn :
- Branched polymer, Concentration effect, Copper, Copper Sulfates, Electrical impedance, Electrochemical reaction, Electrodeposition, Experimental study, Kinetic parameter, Medium effect, Platinum, Propylene oxide polymer, Rate constant, Reaction mechanism, Rotating disk electrode, Sodium Chlorides, Sulfuric acid.

Abstract

The paper presents the results of electrochemical investigations of copper deposition from a sulfate/sulfuric bath of industrial relevancy and containing two additives. In particular the effect of chloride ion with polypropylene ether (LP-1) could be highlighted by voltammetry and impedance measurements. When used without chloride ion LP-1 adsorbs at the surface which reduces significantly the current density and the double layer capacitance. A current peak was observed for the simultaneous presence of the two additives and this was attributed to a sudden inhibition of the surface: in a narrow range of potential Cl-complexes were assumed to desorb from the surface, allowing significant adsorption of inert LP-1 molecules. Besides, kinetic parameters and the diffusion coefficient of cupric ion were correlated to the concentrations of additives, copper sulfate and sulfuric acid in a broad range of concentration.

Notice en format standard (ISO 2709)

Pour connaître la documentation sur le format Inist Standard.

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C01	`01`		`ENG`	@0 The paper presents the results of electrochemical investigations of copper deposition from a sulfate/sulfuric bath of industrial relevancy and containing two additives. In particular the effect of chloride ion with polypropylene ether (LP-1) could be highlighted by voltammetry and impedance measurements. When used without chloride ion LP-1 adsorbs at the surface which reduces significantly the current density and the double layer capacitance. A current peak was observed for the simultaneous presence of the two additives and this was attributed to a sudden inhibition of the surface: in a narrow range of potential Cl-complexes were assumed to desorb from the surface, allowing significant adsorption of inert LP-1 molecules. Besides, kinetic parameters and the diffusion coefficient of cupric ion were correlated to the concentrations of additives, copper sulfate and sulfuric acid in a broad range of concentration.
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C03	`04`	`X`	`SPA`	`@0 Cobre @1 FIN @2 NC @5 04`
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C03	`05`	`X`	`SPA`	`@0 Cobre Sulfato @1 ENT @1 SOL @2 NC @2 NA @5 05`
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C03	`06`	`X`	`ENG`	`@0 Sulfuric acid @1 SOL @2 NK @2 FX @5 06`
C03	`06`	`X`	`GER`	`@0 Schwefelsaeure @1 SOL @2 NK @2 FX @5 06`
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Format Inist (serveur)

NO :	PASCAL 98-0467730 INIST
ET :	Coupled effects of chloride ions and branch chained polypropylene ether LP-1 on the electrochemical deposition of copper from sulfate solutions
AU :	GOLDBACH (S.); MESSING (W.); DAENEN (T.); LAPICQUE (F.)
AF :	Laboratoire des Sciences du Génie Chimique, CNRS-ENSIC-INPL, BP 451/54001 Nancy/France (1 aut., 4 aut.); Philips PMF N.V., Glaslaan S17-II-5/5600 Eindhoven/Pays-Bas (2 aut., 3 aut.)
DT :	Publication en série; Niveau analytique
SO :	Electrochimica acta; ISSN 0013-4686; Coden ELCAAV; Royaume-Uni; Da. 1998; Vol. 44; No. 2-3; Pp. 323-335; Bibl. 22 ref.
LA :	Anglais
EA :	The paper presents the results of electrochemical investigations of copper deposition from a sulfate/sulfuric bath of industrial relevancy and containing two additives. In particular the effect of chloride ion with polypropylene ether (LP-1) could be highlighted by voltammetry and impedance measurements. When used without chloride ion LP-1 adsorbs at the surface which reduces significantly the current density and the double layer capacitance. A current peak was observed for the simultaneous presence of the two additives and this was attributed to a sudden inhibition of the surface: in a narrow range of potential Cl-complexes were assumed to desorb from the surface, allowing significant adsorption of inert LP-1 molecules. Besides, kinetic parameters and the diffusion coefficient of cupric ion were correlated to the concentrations of additives, copper sulfate and sulfuric acid in a broad range of concentration.
CC :	001C01H04A; 001D11C06D; 240
FD :	Etude expérimentale; Dépôt électrolytique; Réaction électrochimique; Cuivre; Cuivre Sulfate; Sulfurique acide; Effet milieu; Sodium Chlorure; Propène oxyde polymère; Polymère ramifié; Effet concentration; Electrode disque tournant; Platine; Paramètre cinétique; Constante vitesse; Mécanisme réaction; Impédance électrique
FG :	Métal transition
ED :	Experimental study; Electrodeposition; Electrochemical reaction; Copper; Copper Sulfates; Sulfuric acid; Medium effect; Sodium Chlorides; Propylene oxide polymer; Branched polymer; Concentration effect; Rotating disk electrode; Platinum; Kinetic parameter; Rate constant; Reaction mechanism; Electrical impedance
EG :	Transition metal
GD :	Experimentelle Untersuchung; Elektroplattieren; Kupfer; Schwefelsaeure; Platin
SD :	Estudio experimental; Depósito electrolítico; Reacción electroquímica; Cobre; Cobre Sulfato; Sulfúrico ácido; Efecto medio; Sodio Cloruro; Propeno óxido polímero; Polímero ramificado; Efecto concentración; Electrodo disco giratorio; Platino; Parámetro cinético; Constante velocidad; Mecanismo reacción; Impedancia eléctrica
LO :	INIST-1516.354000070963820130
ID :	98-0467730

Links to Exploration step

Pascal:98-0467730

Le document en format XML

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<front><div type="abstract" xml:lang="en">The paper presents the results of electrochemical investigations of copper deposition from a sulfate/sulfuric bath of industrial relevancy and containing two additives. In particular the effect of chloride ion with polypropylene ether (LP-1) could be highlighted by voltammetry and impedance measurements. When used without chloride ion LP-1 adsorbs at the surface which reduces significantly the current density and the double layer capacitance. A current peak was observed for the simultaneous presence of the two additives and this was attributed to a sudden inhibition of the surface: in a narrow range of potential Cl-complexes were assumed to desorb from the surface, allowing significant adsorption of inert LP-1 molecules. Besides, kinetic parameters and the diffusion coefficient of cupric ion were correlated to the concentrations of additives, copper sulfate and sulfuric acid in a broad range of concentration.</div>
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<fC01 i1="01" l="ENG"><s0>The paper presents the results of electrochemical investigations of copper deposition from a sulfate/sulfuric bath of industrial relevancy and containing two additives. In particular the effect of chloride ion with polypropylene ether (LP-1) could be highlighted by voltammetry and impedance measurements. When used without chloride ion LP-1 adsorbs at the surface which reduces significantly the current density and the double layer capacitance. A current peak was observed for the simultaneous presence of the two additives and this was attributed to a sudden inhibition of the surface: in a narrow range of potential Cl-complexes were assumed to desorb from the surface, allowing significant adsorption of inert LP-1 molecules. Besides, kinetic parameters and the diffusion coefficient of cupric ion were correlated to the concentrations of additives, copper sulfate and sulfuric acid in a broad range of concentration.</s0>
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<s5>02</s5>
</fC03>
<fC03 i1="03" i2="X" l="FRE"><s0>Réaction électrochimique</s0>
<s5>03</s5>
</fC03>
<fC03 i1="03" i2="X" l="ENG"><s0>Electrochemical reaction</s0>
<s5>03</s5>
</fC03>
<fC03 i1="03" i2="X" l="SPA"><s0>Reacción electroquímica</s0>
<s5>03</s5>
</fC03>
<fC03 i1="04" i2="X" l="FRE"><s0>Cuivre</s0>
<s1>FIN</s1>
<s2>NC</s2>
<s5>04</s5>
</fC03>
<fC03 i1="04" i2="X" l="ENG"><s0>Copper</s0>
<s1>FIN</s1>
<s2>NC</s2>
<s5>04</s5>
</fC03>
<fC03 i1="04" i2="X" l="GER"><s0>Kupfer</s0>
<s1>FIN</s1>
<s2>NC</s2>
<s5>04</s5>
</fC03>
<fC03 i1="04" i2="X" l="SPA"><s0>Cobre</s0>
<s1>FIN</s1>
<s2>NC</s2>
<s5>04</s5>
</fC03>
<fC03 i1="05" i2="X" l="FRE"><s0>Cuivre Sulfate</s0>
<s1>ENT</s1>
<s1>SOL</s1>
<s2>NC</s2>
<s2>NA</s2>
<s5>05</s5>
</fC03>
<fC03 i1="05" i2="X" l="ENG"><s0>Copper Sulfates</s0>
<s1>ENT</s1>
<s1>SOL</s1>
<s2>NC</s2>
<s2>NA</s2>
<s5>05</s5>
</fC03>
<fC03 i1="05" i2="X" l="SPA"><s0>Cobre Sulfato</s0>
<s1>ENT</s1>
<s1>SOL</s1>
<s2>NC</s2>
<s2>NA</s2>
<s5>05</s5>
</fC03>
<fC03 i1="06" i2="X" l="FRE"><s0>Sulfurique acide</s0>
<s1>SOL</s1>
<s2>NK</s2>
<s2>FX</s2>
<s5>06</s5>
</fC03>
<fC03 i1="06" i2="X" l="ENG"><s0>Sulfuric acid</s0>
<s1>SOL</s1>
<s2>NK</s2>
<s2>FX</s2>
<s5>06</s5>
</fC03>
<fC03 i1="06" i2="X" l="GER"><s0>Schwefelsaeure</s0>
<s1>SOL</s1>
<s2>NK</s2>
<s2>FX</s2>
<s5>06</s5>
</fC03>
<fC03 i1="06" i2="X" l="SPA"><s0>Sulfúrico ácido</s0>
<s1>SOL</s1>
<s2>NK</s2>
<s2>FX</s2>
<s5>06</s5>
</fC03>
<fC03 i1="07" i2="X" l="FRE"><s0>Effet milieu</s0>
<s5>07</s5>
</fC03>
<fC03 i1="07" i2="X" l="ENG"><s0>Medium effect</s0>
<s5>07</s5>
</fC03>
<fC03 i1="07" i2="X" l="SPA"><s0>Efecto medio</s0>
<s5>07</s5>
</fC03>
<fC03 i1="08" i2="X" l="FRE"><s0>Sodium Chlorure</s0>
<s2>NC</s2>
<s2>NA</s2>
<s5>08</s5>
</fC03>
<fC03 i1="08" i2="X" l="ENG"><s0>Sodium Chlorides</s0>
<s2>NC</s2>
<s2>NA</s2>
<s5>08</s5>
</fC03>
<fC03 i1="08" i2="X" l="SPA"><s0>Sodio Cloruro</s0>
<s2>NC</s2>
<s2>NA</s2>
<s5>08</s5>
</fC03>
<fC03 i1="09" i2="X" l="FRE"><s0>Propène oxyde polymère</s0>
<s2>NK</s2>
<s5>09</s5>
</fC03>
<fC03 i1="09" i2="X" l="ENG"><s0>Propylene oxide polymer</s0>
<s2>NK</s2>
<s5>09</s5>
</fC03>
<fC03 i1="09" i2="X" l="SPA"><s0>Propeno óxido polímero</s0>
<s2>NK</s2>
<s5>09</s5>
</fC03>
<fC03 i1="10" i2="X" l="FRE"><s0>Polymère ramifié</s0>
<s5>10</s5>
</fC03>
<fC03 i1="10" i2="X" l="ENG"><s0>Branched polymer</s0>
<s5>10</s5>
</fC03>
<fC03 i1="10" i2="X" l="SPA"><s0>Polímero ramificado</s0>
<s5>10</s5>
</fC03>
<fC03 i1="11" i2="X" l="FRE"><s0>Effet concentration</s0>
<s5>11</s5>
</fC03>
<fC03 i1="11" i2="X" l="ENG"><s0>Concentration effect</s0>
<s5>11</s5>
</fC03>
<fC03 i1="11" i2="X" l="SPA"><s0>Efecto concentración</s0>
<s5>11</s5>
</fC03>
<fC03 i1="12" i2="X" l="FRE"><s0>Electrode disque tournant</s0>
<s5>12</s5>
</fC03>
<fC03 i1="12" i2="X" l="ENG"><s0>Rotating disk electrode</s0>
<s5>12</s5>
</fC03>
<fC03 i1="12" i2="X" l="SPA"><s0>Electrodo disco giratorio</s0>
<s5>12</s5>
</fC03>
<fC03 i1="13" i2="X" l="FRE"><s0>Platine</s0>
<s1>ACT</s1>
<s2>NC</s2>
<s5>13</s5>
</fC03>
<fC03 i1="13" i2="X" l="ENG"><s0>Platinum</s0>
<s1>ACT</s1>
<s2>NC</s2>
<s5>13</s5>
</fC03>
<fC03 i1="13" i2="X" l="GER"><s0>Platin</s0>
<s1>ACT</s1>
<s2>NC</s2>
<s5>13</s5>
</fC03>
<fC03 i1="13" i2="X" l="SPA"><s0>Platino</s0>
<s1>ACT</s1>
<s2>NC</s2>
<s5>13</s5>
</fC03>
<fC03 i1="14" i2="X" l="FRE"><s0>Paramètre cinétique</s0>
<s5>17</s5>
</fC03>
<fC03 i1="14" i2="X" l="ENG"><s0>Kinetic parameter</s0>
<s5>17</s5>
</fC03>
<fC03 i1="14" i2="X" l="SPA"><s0>Parámetro cinético</s0>
<s5>17</s5>
</fC03>
<fC03 i1="15" i2="X" l="FRE"><s0>Constante vitesse</s0>
<s5>18</s5>
</fC03>
<fC03 i1="15" i2="X" l="ENG"><s0>Rate constant</s0>
<s5>18</s5>
</fC03>
<fC03 i1="15" i2="X" l="SPA"><s0>Constante velocidad</s0>
<s5>18</s5>
</fC03>
<fC03 i1="16" i2="X" l="FRE"><s0>Mécanisme réaction</s0>
<s5>19</s5>
</fC03>
<fC03 i1="16" i2="X" l="ENG"><s0>Reaction mechanism</s0>
<s5>19</s5>
</fC03>
<fC03 i1="16" i2="X" l="SPA"><s0>Mecanismo reacción</s0>
<s5>19</s5>
</fC03>
<fC03 i1="17" i2="X" l="FRE"><s0>Impédance électrique</s0>
<s5>21</s5>
</fC03>
<fC03 i1="17" i2="X" l="ENG"><s0>Electrical impedance</s0>
<s5>21</s5>
</fC03>
<fC03 i1="17" i2="X" l="SPA"><s0>Impedancia eléctrica</s0>
<s5>21</s5>
</fC03>
<fC07 i1="01" i2="X" l="FRE"><s0>Métal transition</s0>
<s2>NC</s2>
<s5>14</s5>
</fC07>
<fC07 i1="01" i2="X" l="ENG"><s0>Transition metal</s0>
<s2>NC</s2>
<s5>14</s5>
</fC07>
<fC07 i1="01" i2="X" l="GER"><s0>Uebergangsmetalle</s0>
<s2>NC</s2>
<s5>14</s5>
</fC07>
<fC07 i1="01" i2="X" l="SPA"><s0>Metal transición</s0>
<s2>NC</s2>
<s5>14</s5>
</fC07>
<fN21><s1>306</s1>
</fN21>
</pA>
</standard>
<server><NO>PASCAL 98-0467730 INIST</NO>
<ET>Coupled effects of chloride ions and branch chained polypropylene ether LP-1 on the electrochemical deposition of copper from sulfate solutions</ET>
<AU>GOLDBACH (S.); MESSING (W.); DAENEN (T.); LAPICQUE (F.)</AU>
<AF>Laboratoire des Sciences du Génie Chimique, CNRS-ENSIC-INPL, BP 451/54001 Nancy/France (1 aut., 4 aut.); Philips PMF N.V., Glaslaan S17-II-5/5600 Eindhoven/Pays-Bas (2 aut., 3 aut.)</AF>
<DT>Publication en série; Niveau analytique</DT>
<SO>Electrochimica acta; ISSN 0013-4686; Coden ELCAAV; Royaume-Uni; Da. 1998; Vol. 44; No. 2-3; Pp. 323-335; Bibl. 22 ref.</SO>
<LA>Anglais</LA>
<EA>The paper presents the results of electrochemical investigations of copper deposition from a sulfate/sulfuric bath of industrial relevancy and containing two additives. In particular the effect of chloride ion with polypropylene ether (LP-1) could be highlighted by voltammetry and impedance measurements. When used without chloride ion LP-1 adsorbs at the surface which reduces significantly the current density and the double layer capacitance. A current peak was observed for the simultaneous presence of the two additives and this was attributed to a sudden inhibition of the surface: in a narrow range of potential Cl-complexes were assumed to desorb from the surface, allowing significant adsorption of inert LP-1 molecules. Besides, kinetic parameters and the diffusion coefficient of cupric ion were correlated to the concentrations of additives, copper sulfate and sulfuric acid in a broad range of concentration.</EA>
<CC>001C01H04A; 001D11C06D; 240</CC>
<FD>Etude expérimentale; Dépôt électrolytique; Réaction électrochimique; Cuivre; Cuivre Sulfate; Sulfurique acide; Effet milieu; Sodium Chlorure; Propène oxyde polymère; Polymère ramifié; Effet concentration; Electrode disque tournant; Platine; Paramètre cinétique; Constante vitesse; Mécanisme réaction; Impédance électrique</FD>
<FG>Métal transition</FG>
<ED>Experimental study; Electrodeposition; Electrochemical reaction; Copper; Copper Sulfates; Sulfuric acid; Medium effect; Sodium Chlorides; Propylene oxide polymer; Branched polymer; Concentration effect; Rotating disk electrode; Platinum; Kinetic parameter; Rate constant; Reaction mechanism; Electrical impedance</ED>
<EG>Transition metal</EG>
<GD>Experimentelle Untersuchung; Elektroplattieren; Kupfer; Schwefelsaeure; Platin</GD>
<SD>Estudio experimental; Depósito electrolítico; Reacción electroquímica; Cobre; Cobre Sulfato; Sulfúrico ácido; Efecto medio; Sodio Cloruro; Propeno óxido polímero; Polímero ramificado; Efecto concentración; Electrodo disco giratorio; Platino; Parámetro cinético; Constante velocidad; Mecanismo reacción; Impedancia eléctrica</SD>
<LO>INIST-1516.354000070963820130</LO>
<ID>98-0467730</ID>
</server>
</inist>
</record>

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Coupled effects of chloride ions and branch chained polypropylene ether LP-1 on the electrochemical deposition of copper from sulfate solutions

Coupled effects of chloride ions and branch chained polypropylene ether LP-1 on the electrochemical deposition of copper from sulfate solutions

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