Copper particles/epoxy resin thermosetting conductive adhesive using polyamide resin as curing agent
Identifieur interne : 000906 ( Main/Exploration ); précédent : 000905; suivant : 000907Copper particles/epoxy resin thermosetting conductive adhesive using polyamide resin as curing agent
Auteurs : Zhi-Min Dang [République populaire de Chine, France] ; Bo Zhang [République populaire de Chine] ; Jinge Li [République populaire de Chine] ; Jun-Wei Zha [République populaire de Chine] ; Guo-Hua Hu [France]Source :
- Journal of Applied Polymer Science [ 0021-8995 ] ; 2012-11-05.
Descripteurs français
- Pascal (Inist)
- Adhésif, Adhésif conducteur, Adhésivité, Agent accrochage, Amide polymère, Cuivre, Durcissant, Durcissement (matière plastique), Effet température, Epoxyde résine, Etude expérimentale, Matériau composite, Microparticule, Nanocomposite, Particule métallique, Propriété surface, Propriété électrique, Préparation, Relation formulation propriété, Résistivité électrique, Silane organique.
- Wicri :
- topic : Adhésif, Cuivre, Matériau composite, Polymère.
English descriptors
- KwdEn :
- Adhes, Adhes adhes, Adhesive, Adhesivity, Antioxidation ability, Appl polym, Bulk resistivity, Color figure, Composite material, Conductive, Conductive adhesives, Conductive fillers, Contract grant sponsor, Copper, Copper microparticles, Copper powder, Coupling agent, Curing (plastics), Curing agent, Electric resistivity, Electrical properties, Electrical resistivity, Epoxy, Epoxy resin, Experimental study, Filler, Formula weight, Ftir, Ftir spectra, High temperature, Ieee trans compon packag manuf technol, Mass ratio, Matrix, Metal particle, Microparticle, Microparticles, Nanocomposite, Nanoparticles, Nanosized, Nylon, Online issue, Organic silane, Other additives, Packag, Polyamide, Polyamide resin, Polymer, Polymer science, Polymeric matrix, Preparation, Property formulation relationship, Resistivity, Silane, Surface properties, Technol, Temperature effect, Thermal decomposition, Thermosetting conductive.
- Teeft :
- Adhes, Adhes adhes, Antioxidation ability, Appl polym, Bulk resistivity, Color figure, Conductive, Conductive adhesives, Conductive fillers, Contract grant sponsor, Copper microparticles, Copper powder, Electrical resistivity, Epoxy, Epoxy resin, Filler, Formula weight, Ftir, Ftir spectra, High temperature, Ieee trans compon packag manuf technol, Mass ratio, Matrix, Microparticles, Nanoparticles, Nanosized, Online issue, Other additives, Packag, Polyamide, Polyamide resin, Polymer, Polymer science, Polymeric matrix, Resistivity, Silane, Technol, Thermal decomposition, Thermosetting conductive.
- mix :
Abstract
Thermosetting conductive adhesive (TCA) comprised of epoxy resin E‐51 as matrix, Cu microparticles and nanoparticles modified by silane coupling KH550 as conductive fillers, polyamide resin with low molecular weight as curing agent, and some other additives. It was reported creatively a new liquid curing agent, which solved successfully some difficult problems during preparation of TCA, such as limit of quantity of conductive fillers. Therefore, application of this liquid curing agent decreased greatly the resistivity of TCA under the condition of keeping enough adhesion strength. Antioxidized and mixed Cu particles were developed as conductive fillers in place of expensive Ag. The results showed that optimum conditions of conductive adhesive composed of 16 wt % of epoxy resin E‐51, 8 wt % polyamide resin, 65 wt % of Cu microparticles and nanoparticles, 1.3 wt % of silane coupling agent, and 9 wt % of other additives with curing time for 4 h at 60°C. The adhesion strength reached 16.7 MPa and the bulk resistivity was lower than 3.7 × 10−4 Ω cm. The variation of bulk resistivity was less than 15% at high temperature (100°C). © 2012 Wiley Periodicals, Inc. J Appl Polym Sci, 2012
Url:
- https://api.istex.fr/document/FA927A59CCC715EF44CBA01CE3B50BA7B4298EFF/fulltext/pdf
- https://hal.archives-ouvertes.fr/hal-00778384
DOI: 10.1002/app.36951
Affiliations:
- France, République populaire de Chine
- Grand Est, Lorraine (région)
- Nancy, Pékin
- Centre national de la recherche scientifique, Laboratoire réactions et génie des procédés, Université de Lorraine
Links toward previous steps (curation, corpus...)
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Le document en format XML
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of Chemical Resource Engineering, Beijing University of Chemical Technology, Beijing 100029</wicri:regionArea><placeName><settlement type="city">Pékin</settlement></placeName></affiliation><affiliation wicri:level="1"><country wicri:rule="url">République populaire de Chine</country></affiliation><affiliation wicri:level="3"><country xml:lang="fr" wicri:curation="lc">France</country><wicri:regionArea>Zhi‐Min Dang, Department of Polymer Science and Engineering, School of Chemical and Biological Engineering, University of Science and Technology Beijing, Beijing 100083, China===Guo‐Hua Hu, Laboratory of Reactions and Process Engineering, CNRS‐Nancy Université, ENSIC‐INPL, 1 rue Grandville, BP 20451, Nancy 54001</wicri:regionArea><placeName><region type="region" nuts="2">Grand Est</region><region type="old region" nuts="2">Lorraine (région)</region></placeName></affiliation></author><author><name sortKey="Zhang, Bo" sort="Zhang, Bo" uniqKey="Zhang B" first="Bo" last="Zhang">Bo Zhang</name><affiliation wicri:level="1"><country xml:lang="fr">République populaire de Chine</country><wicri:regionArea>Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029</wicri:regionArea><placeName><settlement type="city">Pékin</settlement></placeName></affiliation></author><author><name sortKey="Li, Jinge" sort="Li, Jinge" uniqKey="Li J" first="Jinge" last="Li">Jinge Li</name><affiliation wicri:level="1"><country xml:lang="fr">République populaire de Chine</country><wicri:regionArea>State Key Laboratory of Chemical Resource Engineering, Beijing University of Chemical Technology, Beijing 100029</wicri:regionArea><placeName><settlement type="city">Pékin</settlement></placeName></affiliation></author><author><name sortKey="Zha, Jun Ei" sort="Zha, Jun Ei" uniqKey="Zha J" first="Jun-Wei" last="Zha">Jun-Wei Zha</name><affiliation wicri:level="1"><country xml:lang="fr">République populaire de Chine</country><wicri:regionArea>State Key Laboratory of Chemical Resource Engineering, Beijing University of Chemical Technology, Beijing 100029</wicri:regionArea><placeName><settlement type="city">Pékin</settlement></placeName></affiliation></author><author><name sortKey="Hu, Guo Ua" sort="Hu, Guo Ua" uniqKey="Hu G" first="Guo-Hua" last="Hu">Guo-Hua Hu</name><affiliation wicri:level="3"><country xml:lang="fr">France</country><wicri:regionArea>Laboratory of Reactions and Process Engineering, CNRS‐Nancy Université, ENSIC‐INPL, 1 rue Grandville, BP 20451, Nancy 54001</wicri:regionArea><placeName><region type="region" nuts="2">Grand Est</region><region type="old region" nuts="2">Lorraine (région)</region></placeName><placeName><settlement type="city">Nancy</settlement><region type="region" nuts="2">Grand Est</region><region type="region" nuts="2">Lorraine (région)</region></placeName><orgName type="laboratoire" n="5">Laboratoire réactions et génie des procédés</orgName><orgName type="university">Université de Lorraine</orgName><orgName type="institution">Centre national de la recherche scientifique</orgName></affiliation><affiliation wicri:level="1"><country wicri:rule="url">France</country><placeName><settlement type="city">Nancy</settlement><region type="region" nuts="2">Grand Est</region><region type="region" nuts="2">Lorraine (région)</region></placeName><orgName type="laboratoire" n="5">Laboratoire réactions et génie des procédés</orgName><orgName type="university">Université de Lorraine</orgName><orgName type="institution">Centre national de la recherche scientifique</orgName></affiliation><affiliation wicri:level="3"><country xml:lang="fr" wicri:curation="lc">France</country><wicri:regionArea>Zhi‐Min Dang, Department of Polymer Science and Engineering, School of Chemical and Biological Engineering, University of Science and Technology Beijing, Beijing 100083, China===Guo‐Hua Hu, Laboratory of Reactions and Process Engineering, CNRS‐Nancy Université, ENSIC‐INPL, 1 rue Grandville, BP 20451, Nancy 54001</wicri:regionArea><placeName><region type="region" nuts="2">Grand Est</region><region type="old region" nuts="2">Lorraine (région)</region></placeName><placeName><settlement type="city">Nancy</settlement><region type="region" nuts="2">Grand Est</region><region type="region" nuts="2">Lorraine (région)</region></placeName><orgName type="laboratoire" n="5">Laboratoire réactions et génie des procédés</orgName><orgName type="university">Université de Lorraine</orgName><orgName type="institution">Centre national de la recherche scientifique</orgName></affiliation></author></analytic><monogr></monogr><series><title level="j" type="main">Journal of Applied Polymer Science</title><title level="j" type="alt">JOURNAL OF APPLIED POLYMER SCIENCE</title><idno type="ISSN">0021-8995</idno><idno type="eISSN">1097-4628</idno><imprint><biblScope unit="vol">126</biblScope><biblScope unit="issue">3</biblScope><biblScope unit="page" from="815">815</biblScope><biblScope unit="page" to="821">821</biblScope><biblScope unit="page-count">7</biblScope><publisher>Wiley Subscription Services, Inc., A Wiley Company</publisher><pubPlace>Hoboken</pubPlace><date type="published" when="2012-11-05">2012-11-05</date></imprint><idno type="ISSN">0021-8995</idno></series></biblStruct></sourceDesc><seriesStmt><idno type="ISSN">0021-8995</idno></seriesStmt></fileDesc><profileDesc><textClass><keywords scheme="KwdEn" xml:lang="en"><term>Adhes</term><term>Adhes adhes</term><term>Adhesive</term><term>Adhesivity</term><term>Antioxidation ability</term><term>Appl polym</term><term>Bulk resistivity</term><term>Color figure</term><term>Composite material</term><term>Conductive</term><term>Conductive adhesives</term><term>Conductive fillers</term><term>Contract grant sponsor</term><term>Copper</term><term>Copper microparticles</term><term>Copper powder</term><term>Coupling agent</term><term>Curing (plastics)</term><term>Curing agent</term><term>Electric resistivity</term><term>Electrical properties</term><term>Electrical resistivity</term><term>Epoxy</term><term>Epoxy resin</term><term>Experimental study</term><term>Filler</term><term>Formula weight</term><term>Ftir</term><term>Ftir spectra</term><term>High temperature</term><term>Ieee trans compon packag manuf technol</term><term>Mass ratio</term><term>Matrix</term><term>Metal particle</term><term>Microparticle</term><term>Microparticles</term><term>Nanocomposite</term><term>Nanoparticles</term><term>Nanosized</term><term>Nylon</term><term>Online issue</term><term>Organic silane</term><term>Other additives</term><term>Packag</term><term>Polyamide</term><term>Polyamide resin</term><term>Polymer</term><term>Polymer science</term><term>Polymeric matrix</term><term>Preparation</term><term>Property formulation relationship</term><term>Resistivity</term><term>Silane</term><term>Surface properties</term><term>Technol</term><term>Temperature effect</term><term>Thermal decomposition</term><term>Thermosetting conductive</term></keywords><keywords scheme="Pascal" xml:lang="fr"><term>Adhésif</term><term>Adhésif conducteur</term><term>Adhésivité</term><term>Agent accrochage</term><term>Amide polymère</term><term>Cuivre</term><term>Durcissant</term><term>Durcissement (matière plastique)</term><term>Effet température</term><term>Epoxyde résine</term><term>Etude expérimentale</term><term>Matériau composite</term><term>Microparticule</term><term>Nanocomposite</term><term>Particule métallique</term><term>Propriété surface</term><term>Propriété électrique</term><term>Préparation</term><term>Relation formulation propriété</term><term>Résistivité électrique</term><term>Silane organique</term></keywords><keywords scheme="Teeft" xml:lang="en"><term>Adhes</term><term>Adhes adhes</term><term>Antioxidation ability</term><term>Appl polym</term><term>Bulk resistivity</term><term>Color figure</term><term>Conductive</term><term>Conductive adhesives</term><term>Conductive fillers</term><term>Contract grant sponsor</term><term>Copper microparticles</term><term>Copper powder</term><term>Electrical resistivity</term><term>Epoxy</term><term>Epoxy resin</term><term>Filler</term><term>Formula weight</term><term>Ftir</term><term>Ftir spectra</term><term>High temperature</term><term>Ieee trans compon packag manuf technol</term><term>Mass ratio</term><term>Matrix</term><term>Microparticles</term><term>Nanoparticles</term><term>Nanosized</term><term>Online issue</term><term>Other additives</term><term>Packag</term><term>Polyamide</term><term>Polyamide resin</term><term>Polymer</term><term>Polymer science</term><term>Polymeric matrix</term><term>Resistivity</term><term>Silane</term><term>Technol</term><term>Thermal decomposition</term><term>Thermosetting conductive</term></keywords><keywords scheme="Wicri" type="topic" xml:lang="fr"><term>Adhésif</term><term>Cuivre</term><term>Matériau composite</term><term>Polymère</term></keywords><keywords scheme="mix" xml:lang="en"><term>JOINTS</term><term>PACKAGING APPLICATIONS</term><term>RELIABILITY</term><term>SILANE</term><term>SILICA</term><term>SOLID-PHASE EXTRACTION</term><term>SURFACE-MOUNT APPLICATIONS</term><term>WATER SAMPLES</term><term>conductive adhesive</term><term>copper particles</term><term>epoxy resin</term><term>polyamide resin</term><term>resistivity</term><term>silane coupling agent</term></keywords></textClass></profileDesc></teiHeader><front><div type="abstract" xml:lang="en">Thermosetting conductive adhesive (TCA) comprised of epoxy resin E‐51 as matrix, Cu microparticles and nanoparticles modified by silane coupling KH550 as conductive fillers, polyamide resin with low molecular weight as curing agent, and some other additives. It was reported creatively a new liquid curing agent, which solved successfully some difficult problems during preparation of TCA, such as limit of quantity of conductive fillers. Therefore, application of this liquid curing agent decreased greatly the resistivity of TCA under the condition of keeping enough adhesion strength. Antioxidized and mixed Cu particles were developed as conductive fillers in place of expensive Ag. The results showed that optimum conditions of conductive adhesive composed of 16 wt % of epoxy resin E‐51, 8 wt % polyamide resin, 65 wt % of Cu microparticles and nanoparticles, 1.3 wt % of silane coupling agent, and 9 wt % of other additives with curing time for 4 h at 60°C. The adhesion strength reached 16.7 MPa and the bulk resistivity was lower than 3.7 × 10−4 Ω cm. The variation of bulk resistivity was less than 15% at high temperature (100°C). © 2012 Wiley Periodicals, Inc. J Appl Polym Sci, 2012</div></front></TEI><affiliations><list><country><li>France</li><li>République populaire de Chine</li></country><region><li>Grand Est</li><li>Lorraine (région)</li></region><settlement><li>Nancy</li><li>Pékin</li></settlement><orgName><li>Centre national de la recherche scientifique</li><li>Laboratoire réactions et génie des procédés</li><li>Université de Lorraine</li></orgName></list><tree><country name="République populaire de Chine"><noRegion><name sortKey="Dang, Zhi In" sort="Dang, Zhi In" uniqKey="Dang Z" first="Zhi-Min" last="Dang">Zhi-Min Dang</name></noRegion><name sortKey="Dang, Zhi In" sort="Dang, Zhi In" uniqKey="Dang Z" first="Zhi-Min" last="Dang">Zhi-Min Dang</name><name sortKey="Dang, Zhi In" sort="Dang, Zhi In" uniqKey="Dang Z" first="Zhi-Min" last="Dang">Zhi-Min Dang</name><name sortKey="Li, Jinge" sort="Li, Jinge" uniqKey="Li J" first="Jinge" last="Li">Jinge Li</name><name sortKey="Zha, Jun Ei" sort="Zha, Jun Ei" uniqKey="Zha J" first="Jun-Wei" last="Zha">Jun-Wei Zha</name><name sortKey="Zhang, Bo" sort="Zhang, Bo" uniqKey="Zhang B" first="Bo" last="Zhang">Bo Zhang</name></country><country name="France"><region name="Grand Est"><name sortKey="Dang, Zhi In" sort="Dang, Zhi In" uniqKey="Dang Z" first="Zhi-Min" last="Dang">Zhi-Min Dang</name></region><name sortKey="Hu, Guo Ua" sort="Hu, Guo Ua" uniqKey="Hu G" first="Guo-Hua" last="Hu">Guo-Hua Hu</name><name sortKey="Hu, Guo Ua" sort="Hu, Guo Ua" uniqKey="Hu G" first="Guo-Hua" last="Hu">Guo-Hua Hu</name><name sortKey="Hu, Guo Ua" sort="Hu, Guo Ua" uniqKey="Hu G" first="Guo-Hua" last="Hu">Guo-Hua Hu</name></country></tree></affiliations></record>Pour manipuler ce document sous Unix (Dilib)
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