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Copper Particles/Epoxy Resin Thermosetting Conductive Adhesive Using Polyamide Resin as Curing Agent

Identifieur interne : 000A38 ( PascalFrancis/Curation ); précédent : 000A37; suivant : 000A39

Copper Particles/Epoxy Resin Thermosetting Conductive Adhesive Using Polyamide Resin as Curing Agent

Auteurs : Zhi-Min Dang [République populaire de Chine] ; BO ZHANG [République populaire de Chine] ; JINGE LI [République populaire de Chine] ; Jun-Wei Zha [République populaire de Chine] ; Guo-Hua Hu [France]

Source :

RBID : Pascal:13-0131549

Descripteurs français

English descriptors

Abstract

Thermosetting conductive adhesive (TCA) comprised of epoxy resin E-51 as matrix, Cu microparticles and nanoparticles modified by silane coupling KH550 as conductive fillers, polyamide resin with low molecular weight as curing agent, and some other additives. It was reported creatively a new liquid curing agent, which solved successfully some difficult problems during preparation of TCA, such as limit of quantity of conductive fillers. Therefore, application of this liquid curing agent decreased greatly the resistivity of TCA under the condition of keeping enough adhesion strength. Antioxidized and mixed Cu particles were developed as conductive fillers in place of expensive Ag. The results showed that optimum conditions of conductive adhesive composed of 16 wt % of epoxy resin E-51, 8 wt % polyamide resin, 65 wt % of Cu microparticles and nanoparticles, 1.3 wt % of silane coupling agent, and 9 wt % of other additives with curing time for 4 h at 60°C. The adhesion strength reached 16.7 MPa and the bulk resistivity was lower than 3.7 x 10-4 Ω cm. The variation of bulk resistivity was less than 15% at high temperature (100°C).
pA  
A01 01  1    @0 0021-8995
A02 01      @0 JAPNAB
A03   1    @0 J. appl. polym. sci.
A05       @2 126
A06       @2 3
A08 01  1  ENG  @1 Copper Particles/Epoxy Resin Thermosetting Conductive Adhesive Using Polyamide Resin as Curing Agent
A11 01  1    @1 DANG (Zhi-Min)
A11 02  1    @1 BO ZHANG
A11 03  1    @1 JINGE LI
A11 04  1    @1 ZHA (Jun-Wei)
A11 05  1    @1 HU (Guo-Hua)
A14 01      @1 Department of Polymer Science and Engineering, School of Chemical and Biological Engineering, University of Science and Technology Beijing @2 Beijing 100083 @3 CHN @Z 1 aut.
A14 02      @1 State Key Laboratory of Chemical Resource Engineering, Beijing University of Chemical Technology @2 Beijing 100029 @3 CHN @Z 1 aut. @Z 3 aut. @Z 4 aut.
A14 03      @1 Institute of Microelectronics, Chinese Academy of Sciences @2 Beijing 100029 @3 CHN @Z 2 aut.
A14 04      @1 Laboratory of Reactions and Process Engineering, CNRS-Nancy Université, ENSIC-INPL, 1 rue Grandville, BP 20451 @2 Nancy 54001 @3 FRA @Z 5 aut.
A20       @1 815-821
A21       @1 2012
A23 01      @0 ENG
A43 01      @1 INIST @2 1257 @5 354000500892350040
A44       @0 0000 @1 © 2013 INIST-CNRS. All rights reserved.
A45       @0 31 ref.
A47 01  1    @0 13-0131549
A60       @1 P
A61       @0 A
A64 01  1    @0 Journal of applied polymer science
A66 01      @0 USA
C01 01    ENG  @0 Thermosetting conductive adhesive (TCA) comprised of epoxy resin E-51 as matrix, Cu microparticles and nanoparticles modified by silane coupling KH550 as conductive fillers, polyamide resin with low molecular weight as curing agent, and some other additives. It was reported creatively a new liquid curing agent, which solved successfully some difficult problems during preparation of TCA, such as limit of quantity of conductive fillers. Therefore, application of this liquid curing agent decreased greatly the resistivity of TCA under the condition of keeping enough adhesion strength. Antioxidized and mixed Cu particles were developed as conductive fillers in place of expensive Ag. The results showed that optimum conditions of conductive adhesive composed of 16 wt % of epoxy resin E-51, 8 wt % polyamide resin, 65 wt % of Cu microparticles and nanoparticles, 1.3 wt % of silane coupling agent, and 9 wt % of other additives with curing time for 4 h at 60°C. The adhesion strength reached 16.7 MPa and the bulk resistivity was lower than 3.7 x 10-4 Ω cm. The variation of bulk resistivity was less than 15% at high temperature (100°C).
C02 01  X    @0 001D10A06H
C03 01  X  FRE  @0 Cuivre @2 NC @5 01
C03 01  X  ENG  @0 Copper @2 NC @5 01
C03 01  X  SPA  @0 Cobre @2 NC @5 01
C03 02  X  FRE  @0 Epoxyde résine @5 02
C03 02  X  ENG  @0 Epoxy resin @5 02
C03 02  X  SPA  @0 Epóxido resina @5 02
C03 03  X  FRE  @0 Amide polymère @2 NK @5 03
C03 03  X  ENG  @0 Nylon @2 NK @5 03
C03 03  X  SPA  @0 Amida polímero @2 NK @5 03
C03 04  X  FRE  @0 Durcissant @5 04
C03 04  X  ENG  @0 Curing agent @5 04
C03 04  X  SPA  @0 Endurecedor @5 04
C03 05  X  FRE  @0 Microparticule @5 05
C03 05  X  ENG  @0 Microparticle @5 05
C03 05  X  SPA  @0 Micropartícula @5 05
C03 06  X  FRE  @0 Nanocomposite @5 06
C03 06  X  ENG  @0 Nanocomposite @5 06
C03 06  X  SPA  @0 Nanocompuesto @5 06
C03 07  X  FRE  @0 Particule métallique @5 07
C03 07  X  ENG  @0 Metal particle @5 07
C03 07  X  SPA  @0 Partícula metálica @5 07
C03 08  X  FRE  @0 Préparation @5 08
C03 08  X  ENG  @0 Preparation @5 08
C03 08  X  SPA  @0 Preparación @5 08
C03 09  X  FRE  @0 Durcissement (matière plastique) @5 09
C03 09  X  ENG  @0 Curing (plastics) @5 09
C03 09  X  SPA  @0 Endurecimiento (material plástico) @5 09
C03 10  X  FRE  @0 Agent accrochage @5 10
C03 10  X  ENG  @0 Coupling agent @5 10
C03 10  X  SPA  @0 Agente enganche @5 10
C03 11  X  FRE  @0 Silane organique @5 11
C03 11  X  ENG  @0 Organic silane @5 11
C03 11  X  SPA  @0 Silano orgánico @5 11
C03 12  X  FRE  @0 Adhésif @5 12
C03 12  X  ENG  @0 Adhesive @5 12
C03 12  X  SPA  @0 Adhesivo @5 12
C03 13  X  FRE  @0 Relation formulation propriété @5 13
C03 13  X  ENG  @0 Property formulation relationship @5 13
C03 13  X  SPA  @0 Relación formulación propiedad @5 13
C03 14  X  FRE  @0 Adhésivité @5 14
C03 14  X  ENG  @0 Adhesivity @5 14
C03 14  X  SPA  @0 Adhesividad @5 14
C03 15  X  FRE  @0 Résistivité électrique @5 15
C03 15  X  ENG  @0 Electric resistivity @5 15
C03 15  X  SPA  @0 Resistividad eléctrica @5 15
C03 16  X  FRE  @0 Effet température @5 16
C03 16  X  ENG  @0 Temperature effect @5 16
C03 16  X  SPA  @0 Efecto temperatura @5 16
C03 17  X  FRE  @0 Etude expérimentale @5 17
C03 17  X  ENG  @0 Experimental study @5 17
C03 17  X  SPA  @0 Estudio experimental @5 17
C03 18  X  FRE  @0 Matériau composite @5 31
C03 18  X  ENG  @0 Composite material @5 31
C03 18  X  SPA  @0 Material compuesto @5 31
C03 19  X  FRE  @0 Propriété surface @5 32
C03 19  X  ENG  @0 Surface properties @5 32
C03 19  X  SPA  @0 Propiedad superficie @5 32
C03 20  X  FRE  @0 Propriété électrique @5 33
C03 20  X  ENG  @0 Electrical properties @5 33
C03 20  X  SPA  @0 Propiedad eléctrica @5 33
C03 21  X  FRE  @0 Adhésif conducteur @4 INC @5 41
N21       @1 105

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Pascal:13-0131549

Le document en format XML

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<title level="j" type="main">Journal of applied polymer science</title>
<title level="j" type="abbreviated">J. appl. polym. sci.</title>
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<keywords scheme="KwdEn" xml:lang="en">
<term>Adhesive</term>
<term>Adhesivity</term>
<term>Composite material</term>
<term>Copper</term>
<term>Coupling agent</term>
<term>Curing (plastics)</term>
<term>Curing agent</term>
<term>Electric resistivity</term>
<term>Electrical properties</term>
<term>Epoxy resin</term>
<term>Experimental study</term>
<term>Metal particle</term>
<term>Microparticle</term>
<term>Nanocomposite</term>
<term>Nylon</term>
<term>Organic silane</term>
<term>Preparation</term>
<term>Property formulation relationship</term>
<term>Surface properties</term>
<term>Temperature effect</term>
</keywords>
<keywords scheme="Pascal" xml:lang="fr">
<term>Cuivre</term>
<term>Epoxyde résine</term>
<term>Amide polymère</term>
<term>Durcissant</term>
<term>Microparticule</term>
<term>Nanocomposite</term>
<term>Particule métallique</term>
<term>Préparation</term>
<term>Durcissement (matière plastique)</term>
<term>Agent accrochage</term>
<term>Silane organique</term>
<term>Adhésif</term>
<term>Relation formulation propriété</term>
<term>Adhésivité</term>
<term>Résistivité électrique</term>
<term>Effet température</term>
<term>Etude expérimentale</term>
<term>Matériau composite</term>
<term>Propriété surface</term>
<term>Propriété électrique</term>
<term>Adhésif conducteur</term>
</keywords>
<keywords scheme="Wicri" type="topic" xml:lang="fr">
<term>Cuivre</term>
<term>Adhésif</term>
<term>Matériau composite</term>
</keywords>
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<div type="abstract" xml:lang="en">Thermosetting conductive adhesive (TCA) comprised of epoxy resin E-51 as matrix, Cu microparticles and nanoparticles modified by silane coupling KH550 as conductive fillers, polyamide resin with low molecular weight as curing agent, and some other additives. It was reported creatively a new liquid curing agent, which solved successfully some difficult problems during preparation of TCA, such as limit of quantity of conductive fillers. Therefore, application of this liquid curing agent decreased greatly the resistivity of TCA under the condition of keeping enough adhesion strength. Antioxidized and mixed Cu particles were developed as conductive fillers in place of expensive Ag. The results showed that optimum conditions of conductive adhesive composed of 16 wt % of epoxy resin E-51, 8 wt % polyamide resin, 65 wt % of Cu microparticles and nanoparticles, 1.3 wt % of silane coupling agent, and 9 wt % of other additives with curing time for 4 h at 60°C. The adhesion strength reached 16.7 MPa and the bulk resistivity was lower than 3.7 x 10
<sup>-4</sup>
Ω cm. The variation of bulk resistivity was less than 15% at high temperature (100°C).</div>
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<fC01 i1="01" l="ENG">
<s0>Thermosetting conductive adhesive (TCA) comprised of epoxy resin E-51 as matrix, Cu microparticles and nanoparticles modified by silane coupling KH550 as conductive fillers, polyamide resin with low molecular weight as curing agent, and some other additives. It was reported creatively a new liquid curing agent, which solved successfully some difficult problems during preparation of TCA, such as limit of quantity of conductive fillers. Therefore, application of this liquid curing agent decreased greatly the resistivity of TCA under the condition of keeping enough adhesion strength. Antioxidized and mixed Cu particles were developed as conductive fillers in place of expensive Ag. The results showed that optimum conditions of conductive adhesive composed of 16 wt % of epoxy resin E-51, 8 wt % polyamide resin, 65 wt % of Cu microparticles and nanoparticles, 1.3 wt % of silane coupling agent, and 9 wt % of other additives with curing time for 4 h at 60°C. The adhesion strength reached 16.7 MPa and the bulk resistivity was lower than 3.7 x 10
<sup>-4</sup>
Ω cm. The variation of bulk resistivity was less than 15% at high temperature (100°C).</s0>
</fC01>
<fC02 i1="01" i2="X">
<s0>001D10A06H</s0>
</fC02>
<fC03 i1="01" i2="X" l="FRE">
<s0>Cuivre</s0>
<s2>NC</s2>
<s5>01</s5>
</fC03>
<fC03 i1="01" i2="X" l="ENG">
<s0>Copper</s0>
<s2>NC</s2>
<s5>01</s5>
</fC03>
<fC03 i1="01" i2="X" l="SPA">
<s0>Cobre</s0>
<s2>NC</s2>
<s5>01</s5>
</fC03>
<fC03 i1="02" i2="X" l="FRE">
<s0>Epoxyde résine</s0>
<s5>02</s5>
</fC03>
<fC03 i1="02" i2="X" l="ENG">
<s0>Epoxy resin</s0>
<s5>02</s5>
</fC03>
<fC03 i1="02" i2="X" l="SPA">
<s0>Epóxido resina</s0>
<s5>02</s5>
</fC03>
<fC03 i1="03" i2="X" l="FRE">
<s0>Amide polymère</s0>
<s2>NK</s2>
<s5>03</s5>
</fC03>
<fC03 i1="03" i2="X" l="ENG">
<s0>Nylon</s0>
<s2>NK</s2>
<s5>03</s5>
</fC03>
<fC03 i1="03" i2="X" l="SPA">
<s0>Amida polímero</s0>
<s2>NK</s2>
<s5>03</s5>
</fC03>
<fC03 i1="04" i2="X" l="FRE">
<s0>Durcissant</s0>
<s5>04</s5>
</fC03>
<fC03 i1="04" i2="X" l="ENG">
<s0>Curing agent</s0>
<s5>04</s5>
</fC03>
<fC03 i1="04" i2="X" l="SPA">
<s0>Endurecedor</s0>
<s5>04</s5>
</fC03>
<fC03 i1="05" i2="X" l="FRE">
<s0>Microparticule</s0>
<s5>05</s5>
</fC03>
<fC03 i1="05" i2="X" l="ENG">
<s0>Microparticle</s0>
<s5>05</s5>
</fC03>
<fC03 i1="05" i2="X" l="SPA">
<s0>Micropartícula</s0>
<s5>05</s5>
</fC03>
<fC03 i1="06" i2="X" l="FRE">
<s0>Nanocomposite</s0>
<s5>06</s5>
</fC03>
<fC03 i1="06" i2="X" l="ENG">
<s0>Nanocomposite</s0>
<s5>06</s5>
</fC03>
<fC03 i1="06" i2="X" l="SPA">
<s0>Nanocompuesto</s0>
<s5>06</s5>
</fC03>
<fC03 i1="07" i2="X" l="FRE">
<s0>Particule métallique</s0>
<s5>07</s5>
</fC03>
<fC03 i1="07" i2="X" l="ENG">
<s0>Metal particle</s0>
<s5>07</s5>
</fC03>
<fC03 i1="07" i2="X" l="SPA">
<s0>Partícula metálica</s0>
<s5>07</s5>
</fC03>
<fC03 i1="08" i2="X" l="FRE">
<s0>Préparation</s0>
<s5>08</s5>
</fC03>
<fC03 i1="08" i2="X" l="ENG">
<s0>Preparation</s0>
<s5>08</s5>
</fC03>
<fC03 i1="08" i2="X" l="SPA">
<s0>Preparación</s0>
<s5>08</s5>
</fC03>
<fC03 i1="09" i2="X" l="FRE">
<s0>Durcissement (matière plastique)</s0>
<s5>09</s5>
</fC03>
<fC03 i1="09" i2="X" l="ENG">
<s0>Curing (plastics)</s0>
<s5>09</s5>
</fC03>
<fC03 i1="09" i2="X" l="SPA">
<s0>Endurecimiento (material plástico)</s0>
<s5>09</s5>
</fC03>
<fC03 i1="10" i2="X" l="FRE">
<s0>Agent accrochage</s0>
<s5>10</s5>
</fC03>
<fC03 i1="10" i2="X" l="ENG">
<s0>Coupling agent</s0>
<s5>10</s5>
</fC03>
<fC03 i1="10" i2="X" l="SPA">
<s0>Agente enganche</s0>
<s5>10</s5>
</fC03>
<fC03 i1="11" i2="X" l="FRE">
<s0>Silane organique</s0>
<s5>11</s5>
</fC03>
<fC03 i1="11" i2="X" l="ENG">
<s0>Organic silane</s0>
<s5>11</s5>
</fC03>
<fC03 i1="11" i2="X" l="SPA">
<s0>Silano orgánico</s0>
<s5>11</s5>
</fC03>
<fC03 i1="12" i2="X" l="FRE">
<s0>Adhésif</s0>
<s5>12</s5>
</fC03>
<fC03 i1="12" i2="X" l="ENG">
<s0>Adhesive</s0>
<s5>12</s5>
</fC03>
<fC03 i1="12" i2="X" l="SPA">
<s0>Adhesivo</s0>
<s5>12</s5>
</fC03>
<fC03 i1="13" i2="X" l="FRE">
<s0>Relation formulation propriété</s0>
<s5>13</s5>
</fC03>
<fC03 i1="13" i2="X" l="ENG">
<s0>Property formulation relationship</s0>
<s5>13</s5>
</fC03>
<fC03 i1="13" i2="X" l="SPA">
<s0>Relación formulación propiedad</s0>
<s5>13</s5>
</fC03>
<fC03 i1="14" i2="X" l="FRE">
<s0>Adhésivité</s0>
<s5>14</s5>
</fC03>
<fC03 i1="14" i2="X" l="ENG">
<s0>Adhesivity</s0>
<s5>14</s5>
</fC03>
<fC03 i1="14" i2="X" l="SPA">
<s0>Adhesividad</s0>
<s5>14</s5>
</fC03>
<fC03 i1="15" i2="X" l="FRE">
<s0>Résistivité électrique</s0>
<s5>15</s5>
</fC03>
<fC03 i1="15" i2="X" l="ENG">
<s0>Electric resistivity</s0>
<s5>15</s5>
</fC03>
<fC03 i1="15" i2="X" l="SPA">
<s0>Resistividad eléctrica</s0>
<s5>15</s5>
</fC03>
<fC03 i1="16" i2="X" l="FRE">
<s0>Effet température</s0>
<s5>16</s5>
</fC03>
<fC03 i1="16" i2="X" l="ENG">
<s0>Temperature effect</s0>
<s5>16</s5>
</fC03>
<fC03 i1="16" i2="X" l="SPA">
<s0>Efecto temperatura</s0>
<s5>16</s5>
</fC03>
<fC03 i1="17" i2="X" l="FRE">
<s0>Etude expérimentale</s0>
<s5>17</s5>
</fC03>
<fC03 i1="17" i2="X" l="ENG">
<s0>Experimental study</s0>
<s5>17</s5>
</fC03>
<fC03 i1="17" i2="X" l="SPA">
<s0>Estudio experimental</s0>
<s5>17</s5>
</fC03>
<fC03 i1="18" i2="X" l="FRE">
<s0>Matériau composite</s0>
<s5>31</s5>
</fC03>
<fC03 i1="18" i2="X" l="ENG">
<s0>Composite material</s0>
<s5>31</s5>
</fC03>
<fC03 i1="18" i2="X" l="SPA">
<s0>Material compuesto</s0>
<s5>31</s5>
</fC03>
<fC03 i1="19" i2="X" l="FRE">
<s0>Propriété surface</s0>
<s5>32</s5>
</fC03>
<fC03 i1="19" i2="X" l="ENG">
<s0>Surface properties</s0>
<s5>32</s5>
</fC03>
<fC03 i1="19" i2="X" l="SPA">
<s0>Propiedad superficie</s0>
<s5>32</s5>
</fC03>
<fC03 i1="20" i2="X" l="FRE">
<s0>Propriété électrique</s0>
<s5>33</s5>
</fC03>
<fC03 i1="20" i2="X" l="ENG">
<s0>Electrical properties</s0>
<s5>33</s5>
</fC03>
<fC03 i1="20" i2="X" l="SPA">
<s0>Propiedad eléctrica</s0>
<s5>33</s5>
</fC03>
<fC03 i1="21" i2="X" l="FRE">
<s0>Adhésif conducteur</s0>
<s4>INC</s4>
<s5>41</s5>
</fC03>
<fN21>
<s1>105</s1>
</fN21>
</pA>
</standard>
</inist>
</record>

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   |wiki=    Wicri/Lorraine
   |area=    LrgpV1
   |flux=    PascalFrancis
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   |texte=   Copper Particles/Epoxy Resin Thermosetting Conductive Adhesive Using Polyamide Resin as Curing Agent
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