Copper particles/epoxy resin thermosetting conductive adhesive using polyamide resin as curing agent
Identifieur interne : 000683 ( Hal/Checkpoint ); précédent : 000682; suivant : 000684Copper particles/epoxy resin thermosetting conductive adhesive using polyamide resin as curing agent
Auteurs : Zhi-Min Dang [République populaire de Chine] ; Bo Zhang [République populaire de Chine] ; Jinge Li [République populaire de Chine] ; Jun-Wei Zha [République populaire de Chine] ; Guo-Hua Hu [France]Source :
- Journal of Applied Polymer Science [ 0021-8995 ] ; 2012-11-05.
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- mix :
Abstract
Thermosetting conductive adhesive (TCA) comprised of epoxy resin E-51 as matrix, Cu microparticles and nanoparticles modified by silane coupling KH550 as conductive fillers, polyamide resin with low molecular weight as curing agent, and some other additives. It was reported creatively a new liquid curing agent, which solved successfully some difficult problems during preparation of TCA, such as limit of quantity of conductive fillers. Therefore, application of this liquid curing agent decreased greatly the resistivity of TCA under the condition of keeping enough adhesion strength. Antioxidized and mixed Cu particles were developed as conductive fillers in place of expensive Ag. The results showed that optimum conditions of conductive adhesive composed of 16 wt % of epoxy resin E-51, 8 wt % polyamide resin, 65 wt % of Cu microparticles and nanoparticles, 1.3 wt % of silane coupling agent, and 9 wt % of other additives with curing time for 4 h at 60 degrees C. The adhesion strength reached 16.7 MPa and the bulk resistivity was lower than 3.7 x 10-4 O cm. The variation of bulk resistivity was less than 15% at high temperature (100 degrees C)
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DOI: 10.1002/app.36951
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<term>PACKAGING APPLICATIONS</term>
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<term>SILICA</term>
<term>SOLID-PHASE EXTRACTION</term>
<term>SURFACE-MOUNT APPLICATIONS</term>
<term>WATER SAMPLES</term>
<term>conductive adhesive</term>
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<front><div type="abstract" xml:lang="en">Thermosetting conductive adhesive (TCA) comprised of epoxy resin E-51 as matrix, Cu microparticles and nanoparticles modified by silane coupling KH550 as conductive fillers, polyamide resin with low molecular weight as curing agent, and some other additives. It was reported creatively a new liquid curing agent, which solved successfully some difficult problems during preparation of TCA, such as limit of quantity of conductive fillers. Therefore, application of this liquid curing agent decreased greatly the resistivity of TCA under the condition of keeping enough adhesion strength. Antioxidized and mixed Cu particles were developed as conductive fillers in place of expensive Ag. The results showed that optimum conditions of conductive adhesive composed of 16 wt % of epoxy resin E-51, 8 wt % polyamide resin, 65 wt % of Cu microparticles and nanoparticles, 1.3 wt % of silane coupling agent, and 9 wt % of other additives with curing time for 4 h at 60 degrees C. The adhesion strength reached 16.7 MPa and the bulk resistivity was lower than 3.7 x 10-4 O cm. The variation of bulk resistivity was less than 15% at high temperature (100 degrees C)</div>
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<term xml:lang="en">copper particles</term>
<term xml:lang="en">conductive adhesive</term>
<term xml:lang="en">silane coupling agent</term>
<term xml:lang="en">polyamide resin</term>
<term xml:lang="en">resistivity</term>
<term xml:lang="en">SURFACE-MOUNT APPLICATIONS</term>
<term xml:lang="en">SOLID-PHASE EXTRACTION</term>
<term xml:lang="en">PACKAGING APPLICATIONS</term>
<term xml:lang="en">WATER SAMPLES</term>
<term xml:lang="en">SILANE</term>
<term xml:lang="en">JOINTS</term>
<term xml:lang="en">RELIABILITY</term>
<term xml:lang="en">SILICA</term>
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<classCode scheme="halDomain" n="spi.gproc">Engineering Sciences [physics]/Chemical and Process Engineering</classCode>
<classCode scheme="halDomain" n="chim.poly">Chemical Sciences/Polymers</classCode>
<classCode scheme="halTypology" n="ART">Journal articles</classCode>
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<abstract xml:lang="en">Thermosetting conductive adhesive (TCA) comprised of epoxy resin E-51 as matrix, Cu microparticles and nanoparticles modified by silane coupling KH550 as conductive fillers, polyamide resin with low molecular weight as curing agent, and some other additives. It was reported creatively a new liquid curing agent, which solved successfully some difficult problems during preparation of TCA, such as limit of quantity of conductive fillers. Therefore, application of this liquid curing agent decreased greatly the resistivity of TCA under the condition of keeping enough adhesion strength. Antioxidized and mixed Cu particles were developed as conductive fillers in place of expensive Ag. The results showed that optimum conditions of conductive adhesive composed of 16 wt % of epoxy resin E-51, 8 wt % polyamide resin, 65 wt % of Cu microparticles and nanoparticles, 1.3 wt % of silane coupling agent, and 9 wt % of other additives with curing time for 4 h at 60 degrees C. The adhesion strength reached 16.7 MPa and the bulk resistivity was lower than 3.7 x 10-4 O cm. The variation of bulk resistivity was less than 15% at high temperature (100 degrees C)</abstract>
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