Copper particles/epoxy resin thermosetting conductive adhesive using polyamide resin as curing agent
Identifieur interne : 000683 ( Hal/Checkpoint ); précédent : 000682; suivant : 000684Copper particles/epoxy resin thermosetting conductive adhesive using polyamide resin as curing agent
Auteurs : Zhi-Min Dang [République populaire de Chine] ; Bo Zhang [République populaire de Chine] ; Jinge Li [République populaire de Chine] ; Jun-Wei Zha [République populaire de Chine] ; Guo-Hua Hu [France]Source :
- Journal of Applied Polymer Science [ 0021-8995 ] ; 2012-11-05.
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Abstract
Thermosetting conductive adhesive (TCA) comprised of epoxy resin E-51 as matrix, Cu microparticles and nanoparticles modified by silane coupling KH550 as conductive fillers, polyamide resin with low molecular weight as curing agent, and some other additives. It was reported creatively a new liquid curing agent, which solved successfully some difficult problems during preparation of TCA, such as limit of quantity of conductive fillers. Therefore, application of this liquid curing agent decreased greatly the resistivity of TCA under the condition of keeping enough adhesion strength. Antioxidized and mixed Cu particles were developed as conductive fillers in place of expensive Ag. The results showed that optimum conditions of conductive adhesive composed of 16 wt % of epoxy resin E-51, 8 wt % polyamide resin, 65 wt % of Cu microparticles and nanoparticles, 1.3 wt % of silane coupling agent, and 9 wt % of other additives with curing time for 4 h at 60 degrees C. The adhesion strength reached 16.7 MPa and the bulk resistivity was lower than 3.7 x 10-4 O cm. The variation of bulk resistivity was less than 15% at high temperature (100 degrees C)
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DOI: 10.1002/app.36951
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It was reported creatively a new liquid curing agent, which solved successfully some difficult problems during preparation of TCA, such as limit of quantity of conductive fillers. Therefore, application of this liquid curing agent decreased greatly the resistivity of TCA under the condition of keeping enough adhesion strength. Antioxidized and mixed Cu particles were developed as conductive fillers in place of expensive Ag. The results showed that optimum conditions of conductive adhesive composed of 16 wt % of epoxy resin E-51, 8 wt % polyamide resin, 65 wt % of Cu microparticles and nanoparticles, 1.3 wt % of silane coupling agent, and 9 wt % of other additives with curing time for 4 h at 60 degrees C. The adhesion strength reached 16.7 MPa and the bulk resistivity was lower than 3.7 x 10-4 O cm. The variation of bulk resistivity was less than 15% at high temperature (100 degrees C)</div></front></TEI><hal api="V3"><titleStmt><title xml:lang="en">Copper particles/epoxy resin thermosetting conductive adhesive using polyamide resin as curing agent</title><author role="crp"><persName><forename type="first">Zhi-Min</forename><surname>Dang</surname></persName><email>dangzm@ustb.edu.cn</email><idno type="halauthor">532145</idno><affiliation ref="#struct-212113"></affiliation><affiliation ref="#struct-212114"></affiliation></author><author role="aut"><persName><forename type="first">Bo</forename><surname>Zhang,</surname></persName><email></email><idno type="halauthor">807570</idno><affiliation ref="#struct-212115"></affiliation></author><author role="aut"><persName><forename type="first">Jinge</forename><surname>Li</surname></persName><email></email><idno type="halauthor">807571</idno><affiliation ref="#struct-212114"></affiliation></author><author role="aut"><persName><forename type="first">Jun-Wei</forename><surname>Zha</surname></persName><email></email><idno type="halauthor">383688</idno><affiliation ref="#struct-212114"></affiliation></author><author role="aut"><persName><forename type="first">Guo-Hua</forename><surname>Hu</surname></persName><email>guo-hua.hu@univ-lorraine.fr</email><idno type="halauthor">805871</idno><affiliation ref="#struct-211875"></affiliation></author><editor role="depositor"><persName><forename>Gabriel</forename><surname>Wild</surname></persName><email>gabriel.wild@univ-lorraine.fr</email></editor><funder>NSF of China 50977001 51073015 State Key Laboratory of Electrical Insulation and Power Equipments 09201 Ministry of Sciences and Technology of China through China-Europe International Incorporation Project 2010DFA51490 Fundamental Research Funds for the Central Universities 06103012 06103011</funder></titleStmt><editionStmt><edition n="v1" type="current"><date type="whenSubmitted">2013-01-19 21:34:42</date><date type="whenWritten">2012</date><date type="whenModified">2016-05-10 16:53:18</date><date type="whenReleased">2013-01-19 21:34:42</date><date type="whenProduced">2012-11-05</date></edition><respStmt><resp>contributor</resp><name key="179637"><persName><forename>Gabriel</forename><surname>Wild</surname></persName><email>gabriel.wild@univ-lorraine.fr</email></name></respStmt></editionStmt><publicationStmt><distributor>CCSD</distributor><idno type="halId">hal-00778384</idno><idno type="halUri">https://hal.archives-ouvertes.fr/hal-00778384</idno><idno type="halBibtex">dang:hal-00778384</idno><idno type="halRefHtml">Journal of Applied Polymer Science, Wiley, 2012, 126 (3), pp.815-821. <10.1002/app.36951></idno><idno type="halRef">Journal of Applied Polymer Science, Wiley, 2012, 126 (3), pp.815-821. <10.1002/app.36951></idno></publicationStmt><seriesStmt><idno type="stamp" n="CNRS">CNRS - Centre national de la recherche scientifique</idno><idno type="stamp" n="UNIV-LORRAINE">Université de Lorraine</idno><idno type="stamp" n="LRGP-UL">LRGP</idno></seriesStmt><notesStmt><note type="audience" n="2">International</note><note type="popular" n="0">No</note><note type="peer" n="1">Yes</note></notesStmt><sourceDesc><biblStruct><analytic><title xml:lang="en">Copper particles/epoxy resin thermosetting conductive adhesive using polyamide resin as curing agent</title><author role="crp"><persName><forename type="first">Zhi-Min</forename><surname>Dang</surname></persName><email>dangzm@ustb.edu.cn</email><idno type="halAuthorId">532145</idno><affiliation ref="#struct-212113"></affiliation><affiliation ref="#struct-212114"></affiliation></author><author role="aut"><persName><forename type="first">Bo</forename><surname>Zhang,</surname></persName><idno type="halAuthorId">807570</idno><affiliation ref="#struct-212115"></affiliation></author><author role="aut"><persName><forename type="first">Jinge</forename><surname>Li</surname></persName><idno type="halAuthorId">807571</idno><affiliation ref="#struct-212114"></affiliation></author><author role="aut"><persName><forename type="first">Jun-Wei</forename><surname>Zha</surname></persName><idno type="halAuthorId">383688</idno><affiliation ref="#struct-212114"></affiliation></author><author role="aut"><persName><forename type="first">Guo-Hua</forename><surname>Hu</surname></persName><email>guo-hua.hu@univ-lorraine.fr</email><idno type="halAuthorId">805871</idno><affiliation ref="#struct-211875"></affiliation></author></analytic><monogr><idno type="halJournalId" status="VALID">15083</idno><idno type="issn">0021-8995</idno><idno type="eissn">1097-4628</idno><title level="j">Journal of Applied Polymer Science</title><imprint><publisher>Wiley</publisher><biblScope unit="volume">126</biblScope><biblScope unit="issue">3</biblScope><biblScope unit="pp">815-821</biblScope><date type="datePub">2012-11-05</date></imprint></monogr><idno type="doi">10.1002/app.36951</idno></biblStruct></sourceDesc><profileDesc><langUsage><language ident="en">English</language></langUsage><textClass><keywords scheme="author"><term xml:lang="en">epoxy resin</term><term xml:lang="en">copper particles</term><term xml:lang="en">conductive adhesive</term><term xml:lang="en">silane coupling agent</term><term xml:lang="en">polyamide resin</term><term xml:lang="en">resistivity</term><term xml:lang="en">SURFACE-MOUNT APPLICATIONS</term><term xml:lang="en">SOLID-PHASE EXTRACTION</term><term xml:lang="en">PACKAGING APPLICATIONS</term><term xml:lang="en">WATER SAMPLES</term><term xml:lang="en">SILANE</term><term xml:lang="en">JOINTS</term><term xml:lang="en">RELIABILITY</term><term xml:lang="en">SILICA</term></keywords><classCode scheme="halDomain" n="spi.gproc">Engineering Sciences [physics]/Chemical and Process Engineering</classCode><classCode scheme="halDomain" n="chim.poly">Chemical Sciences/Polymers</classCode><classCode scheme="halTypology" n="ART">Journal articles</classCode></textClass><abstract xml:lang="en">Thermosetting conductive adhesive (TCA) comprised of epoxy resin E-51 as matrix, Cu microparticles and nanoparticles modified by silane coupling KH550 as conductive fillers, polyamide resin with low molecular weight as curing agent, and some other additives. It was reported creatively a new liquid curing agent, which solved successfully some difficult problems during preparation of TCA, such as limit of quantity of conductive fillers. Therefore, application of this liquid curing agent decreased greatly the resistivity of TCA under the condition of keeping enough adhesion strength. Antioxidized and mixed Cu particles were developed as conductive fillers in place of expensive Ag. The results showed that optimum conditions of conductive adhesive composed of 16 wt % of epoxy resin E-51, 8 wt % polyamide resin, 65 wt % of Cu microparticles and nanoparticles, 1.3 wt % of silane coupling agent, and 9 wt % of other additives with curing time for 4 h at 60 degrees C. The adhesion strength reached 16.7 MPa and the bulk resistivity was lower than 3.7 x 10-4 O cm. The variation of bulk resistivity was less than 15% at high temperature (100 degrees C)</abstract></profileDesc></hal></record>Pour manipuler ce document sous Unix (Dilib)
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