LrgpV1, PascalFrancis, Checkpoint, bibRecord, 000127

Copper Particles/Epoxy Resin Thermosetting Conductive Adhesive Using Polyamide Resin as Curing Agent

Identifieur interne : 000127 ( PascalFrancis/Checkpoint ); précédent : 000126; suivant : 000128

Copper Particles/Epoxy Resin Thermosetting Conductive Adhesive Using Polyamide Resin as Curing Agent

Auteurs : Zhi-Min Dang [République populaire de Chine] ; BO ZHANG [République populaire de Chine] ; JINGE LI [République populaire de Chine] ; Jun-Wei Zha [République populaire de Chine] ; Guo-Hua Hu [France]

Source :

Journal of applied polymer science [ 0021-8995 ] ; 2012.

RBID : Pascal:13-0131549

Descripteurs français

Pascal (Inist)
- Cuivre, Epoxyde résine, Amide polymère, Durcissant, Microparticule, Nanocomposite, Particule métallique, Préparation, Durcissement (matière plastique), Agent accrochage, Silane organique, Adhésif, Relation formulation propriété, Adhésivité, Résistivité électrique, Effet température, Etude expérimentale, Matériau composite, Propriété surface, Propriété électrique, Adhésif conducteur.
Wicri :
- topic : Cuivre, Adhésif, Matériau composite.

English descriptors

KwdEn :
- Adhesive, Adhesivity, Composite material, Copper, Coupling agent, Curing (plastics), Curing agent, Electric resistivity, Electrical properties, Epoxy resin, Experimental study, Metal particle, Microparticle, Nanocomposite, Nylon, Organic silane, Preparation, Property formulation relationship, Surface properties, Temperature effect.

Abstract

Thermosetting conductive adhesive (TCA) comprised of epoxy resin E-51 as matrix, Cu microparticles and nanoparticles modified by silane coupling KH550 as conductive fillers, polyamide resin with low molecular weight as curing agent, and some other additives. It was reported creatively a new liquid curing agent, which solved successfully some difficult problems during preparation of TCA, such as limit of quantity of conductive fillers. Therefore, application of this liquid curing agent decreased greatly the resistivity of TCA under the condition of keeping enough adhesion strength. Antioxidized and mixed Cu particles were developed as conductive fillers in place of expensive Ag. The results showed that optimum conditions of conductive adhesive composed of 16 wt % of epoxy resin E-51, 8 wt % polyamide resin, 65 wt % of Cu microparticles and nanoparticles, 1.3 wt % of silane coupling agent, and 9 wt % of other additives with curing time for 4 h at 60°C. The adhesion strength reached 16.7 MPa and the bulk resistivity was lower than 3.7 x 10^-4 Ω cm. The variation of bulk resistivity was less than 15% at high temperature (100°C).

Affiliations:

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Le document en format XML

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<profileDesc><textClass><keywords scheme="KwdEn" xml:lang="en"><term>Adhesive</term>
<term>Adhesivity</term>
<term>Composite material</term>
<term>Copper</term>
<term>Coupling agent</term>
<term>Curing (plastics)</term>
<term>Curing agent</term>
<term>Electric resistivity</term>
<term>Electrical properties</term>
<term>Epoxy resin</term>
<term>Experimental study</term>
<term>Metal particle</term>
<term>Microparticle</term>
<term>Nanocomposite</term>
<term>Nylon</term>
<term>Organic silane</term>
<term>Preparation</term>
<term>Property formulation relationship</term>
<term>Surface properties</term>
<term>Temperature effect</term>
</keywords>
<keywords scheme="Pascal" xml:lang="fr"><term>Cuivre</term>
<term>Epoxyde résine</term>
<term>Amide polymère</term>
<term>Durcissant</term>
<term>Microparticule</term>
<term>Nanocomposite</term>
<term>Particule métallique</term>
<term>Préparation</term>
<term>Durcissement (matière plastique)</term>
<term>Agent accrochage</term>
<term>Silane organique</term>
<term>Adhésif</term>
<term>Relation formulation propriété</term>
<term>Adhésivité</term>
<term>Résistivité électrique</term>
<term>Effet température</term>
<term>Etude expérimentale</term>
<term>Matériau composite</term>
<term>Propriété surface</term>
<term>Propriété électrique</term>
<term>Adhésif conducteur</term>
</keywords>
<keywords scheme="Wicri" type="topic" xml:lang="fr"><term>Cuivre</term>
<term>Adhésif</term>
<term>Matériau composite</term>
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<front><div type="abstract" xml:lang="en">Thermosetting conductive adhesive (TCA) comprised of epoxy resin E-51 as matrix, Cu microparticles and nanoparticles modified by silane coupling KH550 as conductive fillers, polyamide resin with low molecular weight as curing agent, and some other additives. It was reported creatively a new liquid curing agent, which solved successfully some difficult problems during preparation of TCA, such as limit of quantity of conductive fillers. Therefore, application of this liquid curing agent decreased greatly the resistivity of TCA under the condition of keeping enough adhesion strength. Antioxidized and mixed Cu particles were developed as conductive fillers in place of expensive Ag. The results showed that optimum conditions of conductive adhesive composed of 16 wt % of epoxy resin E-51, 8 wt % polyamide resin, 65 wt % of Cu microparticles and nanoparticles, 1.3 wt % of silane coupling agent, and 9 wt % of other additives with curing time for 4 h at 60°C. The adhesion strength reached 16.7 MPa and the bulk resistivity was lower than 3.7 x 10<sup>-4</sup>
 Ω cm. The variation of bulk resistivity was less than 15% at high temperature (100°C).</div>
</front>
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<fA08 i1="01" i2="1" l="ENG"><s1>Copper Particles/Epoxy Resin Thermosetting Conductive Adhesive Using Polyamide Resin as Curing Agent</s1>
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<fA11 i1="01" i2="1"><s1>DANG (Zhi-Min)</s1>
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<sZ>3 aut.</sZ>
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<sZ>2 aut.</sZ>
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<fC01 i1="01" l="ENG"><s0>Thermosetting conductive adhesive (TCA) comprised of epoxy resin E-51 as matrix, Cu microparticles and nanoparticles modified by silane coupling KH550 as conductive fillers, polyamide resin with low molecular weight as curing agent, and some other additives. It was reported creatively a new liquid curing agent, which solved successfully some difficult problems during preparation of TCA, such as limit of quantity of conductive fillers. Therefore, application of this liquid curing agent decreased greatly the resistivity of TCA under the condition of keeping enough adhesion strength. Antioxidized and mixed Cu particles were developed as conductive fillers in place of expensive Ag. The results showed that optimum conditions of conductive adhesive composed of 16 wt % of epoxy resin E-51, 8 wt % polyamide resin, 65 wt % of Cu microparticles and nanoparticles, 1.3 wt % of silane coupling agent, and 9 wt % of other additives with curing time for 4 h at 60°C. The adhesion strength reached 16.7 MPa and the bulk resistivity was lower than 3.7 x 10<sup>-4</sup>
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<s5>03</s5>
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<s5>04</s5>
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<s5>12</s5>
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<s5>12</s5>
</fC03>
<fC03 i1="12" i2="X" l="SPA"><s0>Adhesivo</s0>
<s5>12</s5>
</fC03>
<fC03 i1="13" i2="X" l="FRE"><s0>Relation formulation propriété</s0>
<s5>13</s5>
</fC03>
<fC03 i1="13" i2="X" l="ENG"><s0>Property formulation relationship</s0>
<s5>13</s5>
</fC03>
<fC03 i1="13" i2="X" l="SPA"><s0>Relación formulación propiedad</s0>
<s5>13</s5>
</fC03>
<fC03 i1="14" i2="X" l="FRE"><s0>Adhésivité</s0>
<s5>14</s5>
</fC03>
<fC03 i1="14" i2="X" l="ENG"><s0>Adhesivity</s0>
<s5>14</s5>
</fC03>
<fC03 i1="14" i2="X" l="SPA"><s0>Adhesividad</s0>
<s5>14</s5>
</fC03>
<fC03 i1="15" i2="X" l="FRE"><s0>Résistivité électrique</s0>
<s5>15</s5>
</fC03>
<fC03 i1="15" i2="X" l="ENG"><s0>Electric resistivity</s0>
<s5>15</s5>
</fC03>
<fC03 i1="15" i2="X" l="SPA"><s0>Resistividad eléctrica</s0>
<s5>15</s5>
</fC03>
<fC03 i1="16" i2="X" l="FRE"><s0>Effet température</s0>
<s5>16</s5>
</fC03>
<fC03 i1="16" i2="X" l="ENG"><s0>Temperature effect</s0>
<s5>16</s5>
</fC03>
<fC03 i1="16" i2="X" l="SPA"><s0>Efecto temperatura</s0>
<s5>16</s5>
</fC03>
<fC03 i1="17" i2="X" l="FRE"><s0>Etude expérimentale</s0>
<s5>17</s5>
</fC03>
<fC03 i1="17" i2="X" l="ENG"><s0>Experimental study</s0>
<s5>17</s5>
</fC03>
<fC03 i1="17" i2="X" l="SPA"><s0>Estudio experimental</s0>
<s5>17</s5>
</fC03>
<fC03 i1="18" i2="X" l="FRE"><s0>Matériau composite</s0>
<s5>31</s5>
</fC03>
<fC03 i1="18" i2="X" l="ENG"><s0>Composite material</s0>
<s5>31</s5>
</fC03>
<fC03 i1="18" i2="X" l="SPA"><s0>Material compuesto</s0>
<s5>31</s5>
</fC03>
<fC03 i1="19" i2="X" l="FRE"><s0>Propriété surface</s0>
<s5>32</s5>
</fC03>
<fC03 i1="19" i2="X" l="ENG"><s0>Surface properties</s0>
<s5>32</s5>
</fC03>
<fC03 i1="19" i2="X" l="SPA"><s0>Propiedad superficie</s0>
<s5>32</s5>
</fC03>
<fC03 i1="20" i2="X" l="FRE"><s0>Propriété électrique</s0>
<s5>33</s5>
</fC03>
<fC03 i1="20" i2="X" l="ENG"><s0>Electrical properties</s0>
<s5>33</s5>
</fC03>
<fC03 i1="20" i2="X" l="SPA"><s0>Propiedad eléctrica</s0>
<s5>33</s5>
</fC03>
<fC03 i1="21" i2="X" l="FRE"><s0>Adhésif conducteur</s0>
<s4>INC</s4>
<s5>41</s5>
</fC03>
<fN21><s1>105</s1>
</fN21>
</pA>
</standard>
</inist>
<affiliations><list><country><li>France</li>
<li>République populaire de Chine</li>
</country>
<region><li>Grand Est</li>
<li>Lorraine (région)</li>
</region>
<settlement><li>Nancy</li>
<li>Pékin</li>
</settlement>
<orgName><li>Centre national de la recherche scientifique</li>
<li>Laboratoire réactions et génie des procédés</li>
<li>Université de Lorraine</li>
</orgName>
</list>
<tree><country name="République populaire de Chine"><noRegion><name sortKey="Dang, Zhi Min" sort="Dang, Zhi Min" uniqKey="Dang Z" first="Zhi-Min" last="Dang">Zhi-Min Dang</name>
</noRegion>
<name sortKey="Bo Zhang" sort="Bo Zhang" uniqKey="Bo Zhang" last="Bo Zhang">BO ZHANG</name>
<name sortKey="Dang, Zhi Min" sort="Dang, Zhi Min" uniqKey="Dang Z" first="Zhi-Min" last="Dang">Zhi-Min Dang</name>
<name sortKey="Jinge Li" sort="Jinge Li" uniqKey="Jinge Li" last="Jinge Li">JINGE LI</name>
<name sortKey="Zha, Jun Wei" sort="Zha, Jun Wei" uniqKey="Zha J" first="Jun-Wei" last="Zha">Jun-Wei Zha</name>
</country>
<country name="France"><region name="Grand Est"><name sortKey="Hu, Guo Hua" sort="Hu, Guo Hua" uniqKey="Hu G" first="Guo-Hua" last="Hu">Guo-Hua Hu</name>
</region>
</country>
</tree>
</affiliations>
</record>

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   |texte=   Copper Particles/Epoxy Resin Thermosetting Conductive Adhesive Using Polyamide Resin as Curing Agent
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Copper Particles/Epoxy Resin Thermosetting Conductive Adhesive Using Polyamide Resin as Curing Agent

Copper Particles/Epoxy Resin Thermosetting Conductive Adhesive Using Polyamide Resin as Curing Agent

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