Thermal cracking < Thermal cycle < Thermal cycling

Facettes :

List of bibliographic references

Number of relevant bibliographic references: 42.
[0-20] [0 - 20][0 - 42][20-40]

Ident.	Authors (with country if any)	Title
001612 (2012)		Reliability of Sputtered Aluminum Thin Film on Flexible Substrate Under High Cyclic Bending Fatigue Conditions
002D18 (2011)		Highly reliable, fine pitch chip on glass (COG) joints fabricated using Sn/Cu bumps and non-conductive adhesives
002F58 (2011)		Enhanced thermal fatigue endurance and lifetime prediction of lead-free LGA joints in LTCC modules
003640 (2010)		Ti/Au Die Backside Metallization for Flip Chip Heat Spreader Attachment
003668 (2010)		Thermal Stability of Barium and Indium Double-Filled Skutterudite Ba0.3In0.2Co3.95Ni0.05Sb12 Coated by SiO2 Nanoparticles
003724 (2010)		The characteristics of chemical and heat stability properties of chromium-vanadium-aluminum co-doped zinc oxide films for dye-sensitized solar cells
004940 (2009)		Theoretical and experimental analysis of the vacuum pressure in a vacuum glazing after extreme thermal cycling
005757 (2009)		Densification study of ITO films during high temperature annealing by GISAXS
005E37 (2008)		Silicon-on-lnsulator-Based Radio Frequency Single-Electron Transistors Operating at Temperatures above 4.2 K
006441 (2008)		Influence of thermal cycling on shear strength of Cu-Sn3.5AgIn-Cu joints with various content of indium
006608 (2008)		High temperature assessment of nitride-based devices
006B48 (2008)		Characterization of Sn71n4.1Ag0.5Cu solder in lead-free composite solder joints of LTCC/PWB assembly
007C35 (2007)		Dissolution of oxygen precipitates in germanium-doped Czochralski silicon during rapid thermal annealing
008837 (2006)		Metallurgical reactions in composite 90Pb10Sn/lead-free solder joints and their effect on reliability of LTCC/PWB assembly
008D75 (2006)		Effects of thermal cycle annealing on reduction of defect density in lattice-mismatched InGaAs solar cells
008D96 (2006)		Effect of thermal cycling on the growth of intermetallic compounds at the Sn-Zn-Bi-In-P lead-free solder/Cu interface
009464 (2005)		Study of intermetallic crystal growth between Nb and molten 52ln-48Sn solder
009505 (2005)		Stability behaviour of Cd-free Cu(In,Ga)Se2 solar modules with In2S3 buffer layer prepared by atomic layer deposition
009778 (2005)		Passivation of III/V-based compound semiconductor devices using high-density plasma deposited silicon nitride films
00A203 (2005)		Cadmium sulfide passivation of InTaAs/InP mesa p-i-n photodiodes
00AA38 (2004)		Thermal cycling reliability of lead-free chip resistor solder joints

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