Flip chip < Flip chip bonding < Flip chip bonding (FCB)

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List of bibliographic references

Number of relevant bibliographic references: 36.
[0-20] [0 - 20][0 - 36][20-35][20-40]

Ident.	Authors (with country if any)	Title
000648 (2013)		Properties of electrodeposited Fe-Cu films grown on ITO coated glass substrates at different electrolyte temperatures
001658 (2012)		Preparation of Sn-Ag-In Solder Bumps by Electroplating of Sn-Ag and Indium in Sequence and the Effect of Indium Addition on Microstructure and Shear Strength
001788 (2012)		Numerical analysis of thermo-mechanical behavior of indium micro-joint at cryogenic temperatures
001899 (2012)		Liquid-solid interfacial reactions of Sn-Ag and Sn-Ag-In solders with Cu under bump metallization : Lead-free solder and packaging
001D11 (2012)		Electrical, spectral and optical performance of yellow-green and amber micro-pixelated InGaN light-emitting diodes
002151 (2011)		Wafer-scale 3D integration of InGaAs photodiode arrays with Si readout circuits by oxide bonding and through-oxide vias
002F08 (2011)		Fabrication and performance of bottom-emitting flip-chip bonded 980 nm vertical-cavity lasers with copper- and indium-plated heat-sinks
003579 (2010)		Wafer Level Packaging of Compound Semiconductors
003597 (2010)		Uncooled SWIR InGaAs/GaAsSb type II quantum wells focal plane array
003731 (2010)		The BOOM project: A new Generation of Photonic Routing Subsystems using Hybrid Integration on Silicon-on-insulator Waveguide Boards
003F31 (2010)		InGaAsSb LED arrays (λ = 3.7 μm) with Photonic Crystals
003F89 (2010)		Hybrid integration of InP photodetectors with SOI waveguides using thermocompression bonding
004465 (2010)		Development of indium bumping technology through AZ9260 resist electroplating
004579 (2010)		Cobalt: a universal barrier metal for solderable under bump metallisations
005142 (2009)		Integration of InP-based optoelectronics with silicon waveguides
005404 (2009)		Flip Chip Bonding of 68 x 68 MWIR LED Arrays
005625 (2009)		Effects of Indium Mole Fraction on LWIR Light Emitting Device Performance
005758 (2009)		Demonstration of a bias tunable quantum dots-in-a-well focal plane array
005D30 (2008)		Study of Ag-In solder as low temperature wafer bonding intermediate layer
006604 (2008)		High-Performance Focal Plane Array Based on InAs-GaSb Superlattices With a 10-μm Cutoff Wavelength
006612 (2008)		High performance focal plane array based on type-II InAs/GaSb superlattice heterostructures

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