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Dynamic Processes of Resistive Switching in Metallic Filament-Based Organic Memory Devices

Identifieur interne : 001E09 ( Main/Repository ); précédent : 001E08; suivant : 001E10

Dynamic Processes of Resistive Switching in Metallic Filament-Based Organic Memory Devices

Auteurs : RBID : Pascal:12-0397823

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English descriptors

Abstract

Dynamic formation/rupture processes of metallic filament have been clarified in solid electrolyte- and oxide-based resistive memory devices, whereas they remain exclusive in organic ones. Here we report these dynamic processes in Cu/poly (3-hexylthiophene):[6,6]-phenyl C61-butyric acid methyl ester/indium-tin oxide (ITO) structure, which exhibits a typical bipolar resistive switching effect. Under illumination, an open circuit voltage of -0.15 V exists in high-resistance state, yet it vanishes in low-resistance state owing to the emergence of Cu filament. By combining the symmetry of current-voltage curves with corresponding energy band diagrams in different resistance states, it is demonstrated that the Cu filament grows from Cu/organics interface, ends at organics/ITO interface, and ruptures near organics/ITO interface. This work might advance the insight into resistive switching mechanisms in organic-based resistive memories.

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Pascal:12-0397823

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<div type="abstract" xml:lang="en">Dynamic formation/rupture processes of metallic filament have been clarified in solid electrolyte- and oxide-based resistive memory devices, whereas they remain exclusive in organic ones. Here we report these dynamic processes in Cu/poly (3-hexylthiophene):[6,6]-phenyl C61-butyric acid methyl ester/indium-tin oxide (ITO) structure, which exhibits a typical bipolar resistive switching effect. Under illumination, an open circuit voltage of -0.15 V exists in high-resistance state, yet it vanishes in low-resistance state owing to the emergence of Cu filament. By combining the symmetry of current-voltage curves with corresponding energy band diagrams in different resistance states, it is demonstrated that the Cu filament grows from Cu/organics interface, ends at organics/ITO interface, and ruptures near organics/ITO interface. This work might advance the insight into resistive switching mechanisms in organic-based resistive memories.</div>
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