Ultrafast Bessel beams for high aspect ratio taper free micromachining of glass
Identifieur interne :
003D80 ( PascalFrancis/Curation );
précédent :
003D79;
suivant :
003D81
Ultrafast Bessel beams for high aspect ratio taper free micromachining of glass
Auteurs : M. K. Bhuyan [
France] ;
F. Courvoisier [
France] ;
P.-A. Lacourt [
France] ;
M. Jacquot [
France] ;
L. Furfaro [
France] ;
M. J. Withford [
Australie] ;
J. M. Dudley [
France]
Source :
-
Proceedings of SPIE, the International Society for Optical Engineering [ 0277-786X ] ; 2010.
RBID : Pascal:11-0013881
Descripteurs français
- Pascal (Inist)
- Microusinage,
Optique ultrarapide,
Traitement par laser,
Modulateur optique spatial,
Application laser,
Optique non linéaire,
Positionnement,
Faisceau Bessel,
Faisceau gaussien,
Eau,
Verre,
Matériau diélectrique,
Microfluidique,
DNA,
0130C,
4265,
4279H,
4265R,
4785N,
8783,
4262C,
Laboratoire sur puce.
- Wicri :
English descriptors
- KwdEn :
- Bessel beam,
DNA,
Dielectric materials,
Gaussian beam,
Glass,
Lab-on-a-chip,
Laser assisted processing,
Laser beam applications,
Microfluidics,
Micromachining,
Nonlinear optics,
Positioning,
Spatial light modulators,
Ultrafast optics,
Water.
Abstract
Although ultrafast lasers have demonstrated much success in structuring and ablating dielectrics on the micrometer scale and below, high aspect ratio structuring remains a challenge. Specifically, microfluidics or lab-on-chip DNA sequencing systems require high aspect ratio sub-10 μm wide channels with no taper. Micro-dicing also requires machining with vertical walls. Backside water assisted ultrafast laser processing with Gaussian beams allows the production of high aspect ratio microchannels but requires sub-micron sample positioning and precise control of translation velocity. In this context, we propose a new approach based on Bessel beams that exhibit a focal range exceeding the Rayleigh range by over one order of magnitude. An SLM-based setup allows us to produce a Bessel beam with central core diameter of 1.5 μm FWHM extending over a longitudinal range of 150 μm. A working window in the parameter space has been identified that allows the reliable production of high aspect ratio taper-free microchannels without sample translation. We report a systematic investigation of the damage morphology dependence on focusing geometry and energy per pulse.
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A08 | 01 | 1 | ENG | @1 Ultrafast Bessel beams for high aspect ratio taper free micromachining of glass |
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A09 | 01 | 1 | ENG | @1 Nonlinear optics and applications IV : 12-15 April 2010, Brussels, Belgium |
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A11 | 01 | 1 | | @1 BHUYAN (M. K.) |
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A11 | 02 | 1 | | @1 COURVOISIER (F.) |
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A11 | 03 | 1 | | @1 LACOURT (P.-A.) |
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A11 | 04 | 1 | | @1 JACQUOT (M.) |
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A11 | 05 | 1 | | @1 FURFARO (L.) |
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A12 | 02 | 1 | | @1 GAETA (Alexander Luis) @9 ed. |
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A12 | 03 | 1 | | @1 BRODERICK (Neil G. R.) @9 ed. |
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A14 | 01 | | | @1 FEMTO-ST Institute, Department of Optics P.M. Duffieux, UMR CNRS 6174, Université de Franche-Comté @2 25030 Besançon @3 FRA @Z 1 aut. @Z 2 aut. @Z 3 aut. @Z 4 aut. @Z 5 aut. @Z 7 aut. |
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C01 | 01 | | ENG | @0 Although ultrafast lasers have demonstrated much success in structuring and ablating dielectrics on the micrometer scale and below, high aspect ratio structuring remains a challenge. Specifically, microfluidics or lab-on-chip DNA sequencing systems require high aspect ratio sub-10 μm wide channels with no taper. Micro-dicing also requires machining with vertical walls. Backside water assisted ultrafast laser processing with Gaussian beams allows the production of high aspect ratio microchannels but requires sub-micron sample positioning and precise control of translation velocity. In this context, we propose a new approach based on Bessel beams that exhibit a focal range exceeding the Rayleigh range by over one order of magnitude. An SLM-based setup allows us to produce a Bessel beam with central core diameter of 1.5 μm FWHM extending over a longitudinal range of 150 μm. A working window in the parameter space has been identified that allows the reliable production of high aspect ratio taper-free microchannels without sample translation. We report a systematic investigation of the damage morphology dependence on focusing geometry and energy per pulse. |
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C03 | 02 | 3 | FRE | @0 Optique ultrarapide @5 04 |
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C03 | 02 | 3 | ENG | @0 Ultrafast optics @5 04 |
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C03 | 03 | 3 | FRE | @0 Traitement par laser @5 05 |
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C03 | 03 | 3 | ENG | @0 Laser assisted processing @5 05 |
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C03 | 04 | 3 | FRE | @0 Modulateur optique spatial @5 11 |
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C03 | 04 | 3 | ENG | @0 Spatial light modulators @5 11 |
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C03 | 05 | 3 | FRE | @0 Application laser @5 17 |
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C03 | 05 | 3 | ENG | @0 Laser beam applications @5 17 |
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C03 | 06 | 3 | FRE | @0 Optique non linéaire @5 19 |
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C03 | 06 | 3 | ENG | @0 Nonlinear optics @5 19 |
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C03 | 07 | 3 | FRE | @0 Positionnement @5 30 |
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C03 | 07 | 3 | ENG | @0 Positioning @5 30 |
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C03 | 08 | 3 | FRE | @0 Faisceau Bessel @5 37 |
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C03 | 08 | 3 | ENG | @0 Bessel beam @5 37 |
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C03 | 09 | X | FRE | @0 Faisceau gaussien @5 38 |
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C03 | 09 | X | ENG | @0 Gaussian beam @5 38 |
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C03 | 09 | X | SPA | @0 Haz gaussiano @5 38 |
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C03 | 10 | 3 | FRE | @0 Eau @5 57 |
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C03 | 10 | 3 | ENG | @0 Water @5 57 |
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C03 | 11 | 3 | FRE | @0 Verre @5 61 |
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C03 | 11 | 3 | ENG | @0 Glass @5 61 |
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C03 | 12 | 3 | FRE | @0 Matériau diélectrique @5 62 |
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C03 | 12 | 3 | ENG | @0 Dielectric materials @5 62 |
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C03 | 13 | 3 | FRE | @0 Microfluidique @5 63 |
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C03 | 13 | 3 | ENG | @0 Microfluidics @5 63 |
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C03 | 14 | 3 | FRE | @0 DNA @5 64 |
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C03 | 14 | 3 | ENG | @0 DNA @5 64 |
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C03 | 16 | 3 | FRE | @0 4265 @4 INC @5 84 |
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C03 | 17 | 3 | FRE | @0 4279H @4 INC @5 85 |
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C03 | 18 | 3 | FRE | @0 4265R @4 INC @5 91 |
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C03 | 19 | 3 | FRE | @0 4785N @4 INC @5 92 |
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C03 | 20 | 3 | FRE | @0 8783 @4 INC @5 93 |
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C03 | 21 | 3 | FRE | @0 4262C @4 INC @5 94 |
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C03 | 22 | 3 | FRE | @0 Laboratoire sur puce @4 CD @5 96 |
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C03 | 22 | 3 | ENG | @0 Lab-on-a-chip @4 CD @5 96 |
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N44 | 01 | | | @1 OTO |
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N82 | | | | @1 OTO |
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|
pR |
A30 | 01 | 1 | ENG | @1 Nonlinear optics and applications @2 04 @3 Brussels BEL @4 2010 |
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|
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Le document en format XML
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<term>Glass</term>
<term>Lab-on-a-chip</term>
<term>Laser assisted processing</term>
<term>Laser beam applications</term>
<term>Microfluidics</term>
<term>Micromachining</term>
<term>Nonlinear optics</term>
<term>Positioning</term>
<term>Spatial light modulators</term>
<term>Ultrafast optics</term>
<term>Water</term>
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<term>Optique ultrarapide</term>
<term>Traitement par laser</term>
<term>Modulateur optique spatial</term>
<term>Application laser</term>
<term>Optique non linéaire</term>
<term>Positionnement</term>
<term>Faisceau Bessel</term>
<term>Faisceau gaussien</term>
<term>Eau</term>
<term>Verre</term>
<term>Matériau diélectrique</term>
<term>Microfluidique</term>
<term>DNA</term>
<term>0130C</term>
<term>4265</term>
<term>4279H</term>
<term>4265R</term>
<term>4785N</term>
<term>8783</term>
<term>4262C</term>
<term>Laboratoire sur puce</term>
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<front><div type="abstract" xml:lang="en">Although ultrafast lasers have demonstrated much success in structuring and ablating dielectrics on the micrometer scale and below, high aspect ratio structuring remains a challenge. Specifically, microfluidics or lab-on-chip DNA sequencing systems require high aspect ratio sub-10 μm wide channels with no taper. Micro-dicing also requires machining with vertical walls. Backside water assisted ultrafast laser processing with Gaussian beams allows the production of high aspect ratio microchannels but requires sub-micron sample positioning and precise control of translation velocity. In this context, we propose a new approach based on Bessel beams that exhibit a focal range exceeding the Rayleigh range by over one order of magnitude. An SLM-based setup allows us to produce a Bessel beam with central core diameter of 1.5 μm FWHM extending over a longitudinal range of 150 μm. A working window in the parameter space has been identified that allows the reliable production of high aspect ratio taper-free microchannels without sample translation. We report a systematic investigation of the damage morphology dependence on focusing geometry and energy per pulse.</div>
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<fA11 i1="01" i2="1"><s1>BHUYAN (M. K.)</s1>
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</fA11>
<fA11 i1="07" i2="1"><s1>DUDLEY (J. M.)</s1>
</fA11>
<fA12 i1="01" i2="1"><s1>EGGLETON (Benjamin J.)</s1>
<s9>ed.</s9>
</fA12>
<fA12 i1="02" i2="1"><s1>GAETA (Alexander Luis)</s1>
<s9>ed.</s9>
</fA12>
<fA12 i1="03" i2="1"><s1>BRODERICK (Neil G. R.)</s1>
<s9>ed.</s9>
</fA12>
<fA14 i1="01"><s1>FEMTO-ST Institute, Department of Optics P.M. Duffieux, UMR CNRS 6174, Université de Franche-Comté</s1>
<s2>25030 Besançon</s2>
<s3>FRA</s3>
<sZ>1 aut.</sZ>
<sZ>2 aut.</sZ>
<sZ>3 aut.</sZ>
<sZ>4 aut.</sZ>
<sZ>5 aut.</sZ>
<sZ>7 aut.</sZ>
</fA14>
<fA14 i1="02"><s1>CUDOS and MQ Photonics, Department of Physics, Macquarie University</s1>
<s2>New South Wales, 2109</s2>
<s3>AUS</s3>
<sZ>6 aut.</sZ>
</fA14>
<fA18 i1="01" i2="1"><s1>SPIE Photonics Europe</s1>
<s3>INC</s3>
<s9>org-cong.</s9>
</fA18>
<fA18 i1="02" i2="1"><s1>SPIE</s1>
<s3>USA</s3>
<s9>org-cong.</s9>
</fA18>
<fA20><s2>77281V.1-77281V.8</s2>
</fA20>
<fA21><s1>2010</s1>
</fA21>
<fA23 i1="01"><s0>ENG</s0>
</fA23>
<fA25 i1="01"><s1>SPIE</s1>
<s2>Bellingham, Wash.</s2>
</fA25>
<fA26 i1="01"><s0>0-8194-8201-3</s0>
</fA26>
<fA26 i1="02"><s0>978-0-8194-8201-3</s0>
</fA26>
<fA43 i1="01"><s1>INIST</s1>
<s2>21760</s2>
<s5>354000174705440400</s5>
</fA43>
<fA44><s0>0000</s0>
<s1>© 2011 INIST-CNRS. All rights reserved.</s1>
</fA44>
<fA45><s0>23 ref.</s0>
</fA45>
<fA47 i1="01" i2="1"><s0>11-0013881</s0>
</fA47>
<fA60><s1>P</s1>
<s2>C</s2>
</fA60>
<fA64 i1="01" i2="1"><s0>Proceedings of SPIE, the International Society for Optical Engineering</s0>
</fA64>
<fA66 i1="01"><s0>USA</s0>
</fA66>
<fC01 i1="01" l="ENG"><s0>Although ultrafast lasers have demonstrated much success in structuring and ablating dielectrics on the micrometer scale and below, high aspect ratio structuring remains a challenge. Specifically, microfluidics or lab-on-chip DNA sequencing systems require high aspect ratio sub-10 μm wide channels with no taper. Micro-dicing also requires machining with vertical walls. Backside water assisted ultrafast laser processing with Gaussian beams allows the production of high aspect ratio microchannels but requires sub-micron sample positioning and precise control of translation velocity. In this context, we propose a new approach based on Bessel beams that exhibit a focal range exceeding the Rayleigh range by over one order of magnitude. An SLM-based setup allows us to produce a Bessel beam with central core diameter of 1.5 μm FWHM extending over a longitudinal range of 150 μm. A working window in the parameter space has been identified that allows the reliable production of high aspect ratio taper-free microchannels without sample translation. We report a systematic investigation of the damage morphology dependence on focusing geometry and energy per pulse.</s0>
</fC01>
<fC02 i1="01" i2="3"><s0>001B00A30C</s0>
</fC02>
<fC02 i1="02" i2="3"><s0>001B40B65R</s0>
</fC02>
<fC02 i1="03" i2="3"><s0>001B40G85D</s0>
</fC02>
<fC02 i1="04" i2="X"><s0>002A31C09C</s0>
</fC02>
<fC02 i1="05" i2="X"><s0>215</s0>
</fC02>
<fC03 i1="01" i2="3" l="FRE"><s0>Microusinage</s0>
<s5>03</s5>
</fC03>
<fC03 i1="01" i2="3" l="ENG"><s0>Micromachining</s0>
<s5>03</s5>
</fC03>
<fC03 i1="02" i2="3" l="FRE"><s0>Optique ultrarapide</s0>
<s5>04</s5>
</fC03>
<fC03 i1="02" i2="3" l="ENG"><s0>Ultrafast optics</s0>
<s5>04</s5>
</fC03>
<fC03 i1="03" i2="3" l="FRE"><s0>Traitement par laser</s0>
<s5>05</s5>
</fC03>
<fC03 i1="03" i2="3" l="ENG"><s0>Laser assisted processing</s0>
<s5>05</s5>
</fC03>
<fC03 i1="04" i2="3" l="FRE"><s0>Modulateur optique spatial</s0>
<s5>11</s5>
</fC03>
<fC03 i1="04" i2="3" l="ENG"><s0>Spatial light modulators</s0>
<s5>11</s5>
</fC03>
<fC03 i1="05" i2="3" l="FRE"><s0>Application laser</s0>
<s5>17</s5>
</fC03>
<fC03 i1="05" i2="3" l="ENG"><s0>Laser beam applications</s0>
<s5>17</s5>
</fC03>
<fC03 i1="06" i2="3" l="FRE"><s0>Optique non linéaire</s0>
<s5>19</s5>
</fC03>
<fC03 i1="06" i2="3" l="ENG"><s0>Nonlinear optics</s0>
<s5>19</s5>
</fC03>
<fC03 i1="07" i2="3" l="FRE"><s0>Positionnement</s0>
<s5>30</s5>
</fC03>
<fC03 i1="07" i2="3" l="ENG"><s0>Positioning</s0>
<s5>30</s5>
</fC03>
<fC03 i1="08" i2="3" l="FRE"><s0>Faisceau Bessel</s0>
<s5>37</s5>
</fC03>
<fC03 i1="08" i2="3" l="ENG"><s0>Bessel beam</s0>
<s5>37</s5>
</fC03>
<fC03 i1="09" i2="X" l="FRE"><s0>Faisceau gaussien</s0>
<s5>38</s5>
</fC03>
<fC03 i1="09" i2="X" l="ENG"><s0>Gaussian beam</s0>
<s5>38</s5>
</fC03>
<fC03 i1="09" i2="X" l="SPA"><s0>Haz gaussiano</s0>
<s5>38</s5>
</fC03>
<fC03 i1="10" i2="3" l="FRE"><s0>Eau</s0>
<s5>57</s5>
</fC03>
<fC03 i1="10" i2="3" l="ENG"><s0>Water</s0>
<s5>57</s5>
</fC03>
<fC03 i1="11" i2="3" l="FRE"><s0>Verre</s0>
<s5>61</s5>
</fC03>
<fC03 i1="11" i2="3" l="ENG"><s0>Glass</s0>
<s5>61</s5>
</fC03>
<fC03 i1="12" i2="3" l="FRE"><s0>Matériau diélectrique</s0>
<s5>62</s5>
</fC03>
<fC03 i1="12" i2="3" l="ENG"><s0>Dielectric materials</s0>
<s5>62</s5>
</fC03>
<fC03 i1="13" i2="3" l="FRE"><s0>Microfluidique</s0>
<s5>63</s5>
</fC03>
<fC03 i1="13" i2="3" l="ENG"><s0>Microfluidics</s0>
<s5>63</s5>
</fC03>
<fC03 i1="14" i2="3" l="FRE"><s0>DNA</s0>
<s5>64</s5>
</fC03>
<fC03 i1="14" i2="3" l="ENG"><s0>DNA</s0>
<s5>64</s5>
</fC03>
<fC03 i1="15" i2="3" l="FRE"><s0>0130C</s0>
<s4>INC</s4>
<s5>83</s5>
</fC03>
<fC03 i1="16" i2="3" l="FRE"><s0>4265</s0>
<s4>INC</s4>
<s5>84</s5>
</fC03>
<fC03 i1="17" i2="3" l="FRE"><s0>4279H</s0>
<s4>INC</s4>
<s5>85</s5>
</fC03>
<fC03 i1="18" i2="3" l="FRE"><s0>4265R</s0>
<s4>INC</s4>
<s5>91</s5>
</fC03>
<fC03 i1="19" i2="3" l="FRE"><s0>4785N</s0>
<s4>INC</s4>
<s5>92</s5>
</fC03>
<fC03 i1="20" i2="3" l="FRE"><s0>8783</s0>
<s4>INC</s4>
<s5>93</s5>
</fC03>
<fC03 i1="21" i2="3" l="FRE"><s0>4262C</s0>
<s4>INC</s4>
<s5>94</s5>
</fC03>
<fC03 i1="22" i2="3" l="FRE"><s0>Laboratoire sur puce</s0>
<s4>CD</s4>
<s5>96</s5>
</fC03>
<fC03 i1="22" i2="3" l="ENG"><s0>Lab-on-a-chip</s0>
<s4>CD</s4>
<s5>96</s5>
</fC03>
<fN21><s1>003</s1>
</fN21>
<fN44 i1="01"><s1>OTO</s1>
</fN44>
<fN82><s1>OTO</s1>
</fN82>
</pA>
<pR><fA30 i1="01" i2="1" l="ENG"><s1>Nonlinear optics and applications</s1>
<s2>04</s2>
<s3>Brussels BEL</s3>
<s4>2010</s4>
</fA30>
</pR>
</standard>
</inist>
</record>
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