AustralieFrV1, PascalFrancis, Corpus, bibRecord, 002147

Ultrafast Bessel beams for high aspect ratio taper free micromachining of glass

Identifieur interne : 002147 ( PascalFrancis/Corpus ); précédent : 002146; suivant : 002148

Ultrafast Bessel beams for high aspect ratio taper free micromachining of glass

Auteurs : M. K. Bhuyan ; F. Courvoisier ; P.-A. Lacourt ; M. Jacquot ; L. Furfaro ; M. J. Withford ; J. M. Dudley

Source :

Proceedings of SPIE, the International Society for Optical Engineering [ 0277-786X ] ; 2010.

RBID : Pascal:11-0013881

Descripteurs français

Pascal (Inist)
- Microusinage, Optique ultrarapide, Traitement par laser, Modulateur optique spatial, Application laser, Optique non linéaire, Positionnement, Faisceau Bessel, Faisceau gaussien, Eau, Verre, Matériau diélectrique, Microfluidique, DNA, 0130C, 4265, 4279H, 4265R, 4785N, 8783, 4262C, Laboratoire sur puce.

English descriptors

KwdEn :
- Bessel beam, DNA, Dielectric materials, Gaussian beam, Glass, Lab-on-a-chip, Laser assisted processing, Laser beam applications, Microfluidics, Micromachining, Nonlinear optics, Positioning, Spatial light modulators, Ultrafast optics, Water.

Abstract

Although ultrafast lasers have demonstrated much success in structuring and ablating dielectrics on the micrometer scale and below, high aspect ratio structuring remains a challenge. Specifically, microfluidics or lab-on-chip DNA sequencing systems require high aspect ratio sub-10 μm wide channels with no taper. Micro-dicing also requires machining with vertical walls. Backside water assisted ultrafast laser processing with Gaussian beams allows the production of high aspect ratio microchannels but requires sub-micron sample positioning and precise control of translation velocity. In this context, we propose a new approach based on Bessel beams that exhibit a focal range exceeding the Rayleigh range by over one order of magnitude. An SLM-based setup allows us to produce a Bessel beam with central core diameter of 1.5 μm FWHM extending over a longitudinal range of 150 μm. A working window in the parameter space has been identified that allows the reliable production of high aspect ratio taper-free microchannels without sample translation. We report a systematic investigation of the damage morphology dependence on focusing geometry and energy per pulse.

Notice en format standard (ISO 2709)

Pour connaître la documentation sur le format Inist Standard.

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A08	`01`	`1`	`ENG`	`@1 Ultrafast Bessel beams for high aspect ratio taper free micromachining of glass`
A09	`01`	`1`	`ENG`	`@1 Nonlinear optics and applications IV : 12-15 April 2010, Brussels, Belgium`
A11	`01`	`1`		`@1 BHUYAN (M. K.)`
A11	`02`	`1`		`@1 COURVOISIER (F.)`
A11	`03`	`1`		`@1 LACOURT (P.-A.)`
A11	`04`	`1`		`@1 JACQUOT (M.)`
A11	`05`	`1`		`@1 FURFARO (L.)`
A11	`06`	`1`		`@1 WITHFORD (M. J.)`
A11	`07`	`1`		`@1 DUDLEY (J. M.)`
A12	`01`	`1`		`@1 EGGLETON (Benjamin J.) @9 ed.`
A12	`02`	`1`		`@1 GAETA (Alexander Luis) @9 ed.`
A12	`03`	`1`		`@1 BRODERICK (Neil G. R.) @9 ed.`
A14	`01`			`@1 FEMTO-ST Institute, Department of Optics P.M. Duffieux, UMR CNRS 6174, Université de Franche-Comté @2 25030 Besançon @3 FRA @Z 1 aut. @Z 2 aut. @Z 3 aut. @Z 4 aut. @Z 5 aut. @Z 7 aut.`
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C01	`01`		`ENG`	@0 Although ultrafast lasers have demonstrated much success in structuring and ablating dielectrics on the micrometer scale and below, high aspect ratio structuring remains a challenge. Specifically, microfluidics or lab-on-chip DNA sequencing systems require high aspect ratio sub-10 μm wide channels with no taper. Micro-dicing also requires machining with vertical walls. Backside water assisted ultrafast laser processing with Gaussian beams allows the production of high aspect ratio microchannels but requires sub-micron sample positioning and precise control of translation velocity. In this context, we propose a new approach based on Bessel beams that exhibit a focal range exceeding the Rayleigh range by over one order of magnitude. An SLM-based setup allows us to produce a Bessel beam with central core diameter of 1.5 μm FWHM extending over a longitudinal range of 150 μm. A working window in the parameter space has been identified that allows the reliable production of high aspect ratio taper-free microchannels without sample translation. We report a systematic investigation of the damage morphology dependence on focusing geometry and energy per pulse.
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C03	`04`	`3`	`FRE`	`@0 Modulateur optique spatial @5 11`
C03	`04`	`3`	`ENG`	`@0 Spatial light modulators @5 11`
C03	`05`	`3`	`FRE`	`@0 Application laser @5 17`
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C03	`21`	`3`	`FRE`	`@0 4262C @4 INC @5 94`
C03	`22`	`3`	`FRE`	`@0 Laboratoire sur puce @4 CD @5 96`
C03	`22`	`3`	`ENG`	`@0 Lab-on-a-chip @4 CD @5 96`
N21				`@1 003`
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A30	`01`	`1`	`ENG`	`@1 Nonlinear optics and applications @2 04 @3 Brussels BEL @4 2010`

Format Inist (serveur)

NO :	PASCAL 11-0013881 INIST
ET :	Ultrafast Bessel beams for high aspect ratio taper free micromachining of glass
AU :	BHUYAN (M. K.); COURVOISIER (F.); LACOURT (P.-A.); JACQUOT (M.); FURFARO (L.); WITHFORD (M. J.); DUDLEY (J. M.); EGGLETON (Benjamin J.); GAETA (Alexander Luis); BRODERICK (Neil G. R.)
AF :	FEMTO-ST Institute, Department of Optics P.M. Duffieux, UMR CNRS 6174, Université de Franche-Comté/25030 Besançon/France (1 aut., 2 aut., 3 aut., 4 aut., 5 aut., 7 aut.); CUDOS and MQ Photonics, Department of Physics, Macquarie University/New South Wales, 2109/Australie (6 aut.)
DT :	Publication en série; Congrès; Niveau analytique
SO :	Proceedings of SPIE, the International Society for Optical Engineering; ISSN 0277-786X; Coden PSISDG; Etats-Unis; Da. 2010; Vol. 7728; 77281V.1-77281V.8; Bibl. 23 ref.
LA :	Anglais
EA :	Although ultrafast lasers have demonstrated much success in structuring and ablating dielectrics on the micrometer scale and below, high aspect ratio structuring remains a challenge. Specifically, microfluidics or lab-on-chip DNA sequencing systems require high aspect ratio sub-10 μm wide channels with no taper. Micro-dicing also requires machining with vertical walls. Backside water assisted ultrafast laser processing with Gaussian beams allows the production of high aspect ratio microchannels but requires sub-micron sample positioning and precise control of translation velocity. In this context, we propose a new approach based on Bessel beams that exhibit a focal range exceeding the Rayleigh range by over one order of magnitude. An SLM-based setup allows us to produce a Bessel beam with central core diameter of 1.5 μm FWHM extending over a longitudinal range of 150 μm. A working window in the parameter space has been identified that allows the reliable production of high aspect ratio taper-free microchannels without sample translation. We report a systematic investigation of the damage morphology dependence on focusing geometry and energy per pulse.
CC :	001B00A30C; 001B40B65R; 001B40G85D; 002A31C09C; 215
FD :	Microusinage; Optique ultrarapide; Traitement par laser; Modulateur optique spatial; Application laser; Optique non linéaire; Positionnement; Faisceau Bessel; Faisceau gaussien; Eau; Verre; Matériau diélectrique; Microfluidique; DNA; 0130C; 4265; 4279H; 4265R; 4785N; 8783; 4262C; Laboratoire sur puce
ED :	Micromachining; Ultrafast optics; Laser assisted processing; Spatial light modulators; Laser beam applications; Nonlinear optics; Positioning; Bessel beam; Gaussian beam; Water; Glass; Dielectric materials; Microfluidics; DNA; Lab-on-a-chip
SD :	Haz gaussiano
LO :	INIST-21760.354000174705440400
ID :	11-0013881

Links to Exploration step

Pascal:11-0013881

Le document en format XML

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<front><div type="abstract" xml:lang="en">Although ultrafast lasers have demonstrated much success in structuring and ablating dielectrics on the micrometer scale and below, high aspect ratio structuring remains a challenge. Specifically, microfluidics or lab-on-chip DNA sequencing systems require high aspect ratio sub-10 μm wide channels with no taper. Micro-dicing also requires machining with vertical walls. Backside water assisted ultrafast laser processing with Gaussian beams allows the production of high aspect ratio microchannels but requires sub-micron sample positioning and precise control of translation velocity. In this context, we propose a new approach based on Bessel beams that exhibit a focal range exceeding the Rayleigh range by over one order of magnitude. An SLM-based setup allows us to produce a Bessel beam with central core diameter of 1.5 μm FWHM extending over a longitudinal range of 150 μm. A working window in the parameter space has been identified that allows the reliable production of high aspect ratio taper-free microchannels without sample translation. We report a systematic investigation of the damage morphology dependence on focusing geometry and energy per pulse.</div>
</front>
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</fA02>
<fA03 i2="1"><s0>Proc. SPIE Int. Soc. Opt. Eng.</s0>
</fA03>
<fA05><s2>7728</s2>
</fA05>
<fA08 i1="01" i2="1" l="ENG"><s1>Ultrafast Bessel beams for high aspect ratio taper free micromachining of glass</s1>
</fA08>
<fA09 i1="01" i2="1" l="ENG"><s1>Nonlinear optics and applications IV : 12-15 April 2010, Brussels, Belgium</s1>
</fA09>
<fA11 i1="01" i2="1"><s1>BHUYAN (M. K.)</s1>
</fA11>
<fA11 i1="02" i2="1"><s1>COURVOISIER (F.)</s1>
</fA11>
<fA11 i1="03" i2="1"><s1>LACOURT (P.-A.)</s1>
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<fA11 i1="04" i2="1"><s1>JACQUOT (M.)</s1>
</fA11>
<fA11 i1="05" i2="1"><s1>FURFARO (L.)</s1>
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<fA11 i1="06" i2="1"><s1>WITHFORD (M. J.)</s1>
</fA11>
<fA11 i1="07" i2="1"><s1>DUDLEY (J. M.)</s1>
</fA11>
<fA12 i1="01" i2="1"><s1>EGGLETON (Benjamin J.)</s1>
<s9>ed.</s9>
</fA12>
<fA12 i1="02" i2="1"><s1>GAETA (Alexander Luis)</s1>
<s9>ed.</s9>
</fA12>
<fA12 i1="03" i2="1"><s1>BRODERICK (Neil G. R.)</s1>
<s9>ed.</s9>
</fA12>
<fA14 i1="01"><s1>FEMTO-ST Institute, Department of Optics P.M. Duffieux, UMR CNRS 6174, Université de Franche-Comté</s1>
<s2>25030 Besançon</s2>
<s3>FRA</s3>
<sZ>1 aut.</sZ>
<sZ>2 aut.</sZ>
<sZ>3 aut.</sZ>
<sZ>4 aut.</sZ>
<sZ>5 aut.</sZ>
<sZ>7 aut.</sZ>
</fA14>
<fA14 i1="02"><s1>CUDOS and MQ Photonics, Department of Physics, Macquarie University</s1>
<s2>New South Wales, 2109</s2>
<s3>AUS</s3>
<sZ>6 aut.</sZ>
</fA14>
<fA18 i1="01" i2="1"><s1>SPIE Photonics Europe</s1>
<s3>INC</s3>
<s9>org-cong.</s9>
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<s9>org-cong.</s9>
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<fA20><s2>77281V.1-77281V.8</s2>
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<fA21><s1>2010</s1>
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<fA23 i1="01"><s0>ENG</s0>
</fA23>
<fA25 i1="01"><s1>SPIE</s1>
<s2>Bellingham, Wash.</s2>
</fA25>
<fA26 i1="01"><s0>0-8194-8201-3</s0>
</fA26>
<fA26 i1="02"><s0>978-0-8194-8201-3</s0>
</fA26>
<fA43 i1="01"><s1>INIST</s1>
<s2>21760</s2>
<s5>354000174705440400</s5>
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<fA44><s0>0000</s0>
<s1>© 2011 INIST-CNRS. All rights reserved.</s1>
</fA44>
<fA45><s0>23 ref.</s0>
</fA45>
<fA47 i1="01" i2="1"><s0>11-0013881</s0>
</fA47>
<fA60><s1>P</s1>
<s2>C</s2>
</fA60>
<fA61><s0>A</s0>
</fA61>
<fA64 i1="01" i2="1"><s0>Proceedings of SPIE, the International Society for Optical Engineering</s0>
</fA64>
<fA66 i1="01"><s0>USA</s0>
</fA66>
<fC01 i1="01" l="ENG"><s0>Although ultrafast lasers have demonstrated much success in structuring and ablating dielectrics on the micrometer scale and below, high aspect ratio structuring remains a challenge. Specifically, microfluidics or lab-on-chip DNA sequencing systems require high aspect ratio sub-10 μm wide channels with no taper. Micro-dicing also requires machining with vertical walls. Backside water assisted ultrafast laser processing with Gaussian beams allows the production of high aspect ratio microchannels but requires sub-micron sample positioning and precise control of translation velocity. In this context, we propose a new approach based on Bessel beams that exhibit a focal range exceeding the Rayleigh range by over one order of magnitude. An SLM-based setup allows us to produce a Bessel beam with central core diameter of 1.5 μm FWHM extending over a longitudinal range of 150 μm. A working window in the parameter space has been identified that allows the reliable production of high aspect ratio taper-free microchannels without sample translation. We report a systematic investigation of the damage morphology dependence on focusing geometry and energy per pulse.</s0>
</fC01>
<fC02 i1="01" i2="3"><s0>001B00A30C</s0>
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<fC02 i1="02" i2="3"><s0>001B40B65R</s0>
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<fC02 i1="03" i2="3"><s0>001B40G85D</s0>
</fC02>
<fC02 i1="04" i2="X"><s0>002A31C09C</s0>
</fC02>
<fC02 i1="05" i2="X"><s0>215</s0>
</fC02>
<fC03 i1="01" i2="3" l="FRE"><s0>Microusinage</s0>
<s5>03</s5>
</fC03>
<fC03 i1="01" i2="3" l="ENG"><s0>Micromachining</s0>
<s5>03</s5>
</fC03>
<fC03 i1="02" i2="3" l="FRE"><s0>Optique ultrarapide</s0>
<s5>04</s5>
</fC03>
<fC03 i1="02" i2="3" l="ENG"><s0>Ultrafast optics</s0>
<s5>04</s5>
</fC03>
<fC03 i1="03" i2="3" l="FRE"><s0>Traitement par laser</s0>
<s5>05</s5>
</fC03>
<fC03 i1="03" i2="3" l="ENG"><s0>Laser assisted processing</s0>
<s5>05</s5>
</fC03>
<fC03 i1="04" i2="3" l="FRE"><s0>Modulateur optique spatial</s0>
<s5>11</s5>
</fC03>
<fC03 i1="04" i2="3" l="ENG"><s0>Spatial light modulators</s0>
<s5>11</s5>
</fC03>
<fC03 i1="05" i2="3" l="FRE"><s0>Application laser</s0>
<s5>17</s5>
</fC03>
<fC03 i1="05" i2="3" l="ENG"><s0>Laser beam applications</s0>
<s5>17</s5>
</fC03>
<fC03 i1="06" i2="3" l="FRE"><s0>Optique non linéaire</s0>
<s5>19</s5>
</fC03>
<fC03 i1="06" i2="3" l="ENG"><s0>Nonlinear optics</s0>
<s5>19</s5>
</fC03>
<fC03 i1="07" i2="3" l="FRE"><s0>Positionnement</s0>
<s5>30</s5>
</fC03>
<fC03 i1="07" i2="3" l="ENG"><s0>Positioning</s0>
<s5>30</s5>
</fC03>
<fC03 i1="08" i2="3" l="FRE"><s0>Faisceau Bessel</s0>
<s5>37</s5>
</fC03>
<fC03 i1="08" i2="3" l="ENG"><s0>Bessel beam</s0>
<s5>37</s5>
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<fC03 i1="09" i2="X" l="FRE"><s0>Faisceau gaussien</s0>
<s5>38</s5>
</fC03>
<fC03 i1="09" i2="X" l="ENG"><s0>Gaussian beam</s0>
<s5>38</s5>
</fC03>
<fC03 i1="09" i2="X" l="SPA"><s0>Haz gaussiano</s0>
<s5>38</s5>
</fC03>
<fC03 i1="10" i2="3" l="FRE"><s0>Eau</s0>
<s5>57</s5>
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<fC03 i1="10" i2="3" l="ENG"><s0>Water</s0>
<s5>57</s5>
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<fC03 i1="11" i2="3" l="FRE"><s0>Verre</s0>
<s5>61</s5>
</fC03>
<fC03 i1="11" i2="3" l="ENG"><s0>Glass</s0>
<s5>61</s5>
</fC03>
<fC03 i1="12" i2="3" l="FRE"><s0>Matériau diélectrique</s0>
<s5>62</s5>
</fC03>
<fC03 i1="12" i2="3" l="ENG"><s0>Dielectric materials</s0>
<s5>62</s5>
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<fC03 i1="13" i2="3" l="FRE"><s0>Microfluidique</s0>
<s5>63</s5>
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<fC03 i1="13" i2="3" l="ENG"><s0>Microfluidics</s0>
<s5>63</s5>
</fC03>
<fC03 i1="14" i2="3" l="FRE"><s0>DNA</s0>
<s5>64</s5>
</fC03>
<fC03 i1="14" i2="3" l="ENG"><s0>DNA</s0>
<s5>64</s5>
</fC03>
<fC03 i1="15" i2="3" l="FRE"><s0>0130C</s0>
<s4>INC</s4>
<s5>83</s5>
</fC03>
<fC03 i1="16" i2="3" l="FRE"><s0>4265</s0>
<s4>INC</s4>
<s5>84</s5>
</fC03>
<fC03 i1="17" i2="3" l="FRE"><s0>4279H</s0>
<s4>INC</s4>
<s5>85</s5>
</fC03>
<fC03 i1="18" i2="3" l="FRE"><s0>4265R</s0>
<s4>INC</s4>
<s5>91</s5>
</fC03>
<fC03 i1="19" i2="3" l="FRE"><s0>4785N</s0>
<s4>INC</s4>
<s5>92</s5>
</fC03>
<fC03 i1="20" i2="3" l="FRE"><s0>8783</s0>
<s4>INC</s4>
<s5>93</s5>
</fC03>
<fC03 i1="21" i2="3" l="FRE"><s0>4262C</s0>
<s4>INC</s4>
<s5>94</s5>
</fC03>
<fC03 i1="22" i2="3" l="FRE"><s0>Laboratoire sur puce</s0>
<s4>CD</s4>
<s5>96</s5>
</fC03>
<fC03 i1="22" i2="3" l="ENG"><s0>Lab-on-a-chip</s0>
<s4>CD</s4>
<s5>96</s5>
</fC03>
<fN21><s1>003</s1>
</fN21>
<fN44 i1="01"><s1>OTO</s1>
</fN44>
<fN82><s1>OTO</s1>
</fN82>
</pA>
<pR><fA30 i1="01" i2="1" l="ENG"><s1>Nonlinear optics and applications</s1>
<s2>04</s2>
<s3>Brussels BEL</s3>
<s4>2010</s4>
</fA30>
</pR>
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<server><NO>PASCAL 11-0013881 INIST</NO>
<ET>Ultrafast Bessel beams for high aspect ratio taper free micromachining of glass</ET>
<AU>BHUYAN (M. K.); COURVOISIER (F.); LACOURT (P.-A.); JACQUOT (M.); FURFARO (L.); WITHFORD (M. J.); DUDLEY (J. M.); EGGLETON (Benjamin J.); GAETA (Alexander Luis); BRODERICK (Neil G. R.)</AU>
<AF>FEMTO-ST Institute, Department of Optics P.M. Duffieux, UMR CNRS 6174, Université de Franche-Comté/25030 Besançon/France (1 aut., 2 aut., 3 aut., 4 aut., 5 aut., 7 aut.); CUDOS and MQ Photonics, Department of Physics, Macquarie University/New South Wales, 2109/Australie (6 aut.)</AF>
<DT>Publication en série; Congrès; Niveau analytique</DT>
<SO>Proceedings of SPIE, the International Society for Optical Engineering; ISSN 0277-786X; Coden PSISDG; Etats-Unis; Da. 2010; Vol. 7728; 77281V.1-77281V.8; Bibl. 23 ref.</SO>
<LA>Anglais</LA>
<EA>Although ultrafast lasers have demonstrated much success in structuring and ablating dielectrics on the micrometer scale and below, high aspect ratio structuring remains a challenge. Specifically, microfluidics or lab-on-chip DNA sequencing systems require high aspect ratio sub-10 μm wide channels with no taper. Micro-dicing also requires machining with vertical walls. Backside water assisted ultrafast laser processing with Gaussian beams allows the production of high aspect ratio microchannels but requires sub-micron sample positioning and precise control of translation velocity. In this context, we propose a new approach based on Bessel beams that exhibit a focal range exceeding the Rayleigh range by over one order of magnitude. An SLM-based setup allows us to produce a Bessel beam with central core diameter of 1.5 μm FWHM extending over a longitudinal range of 150 μm. A working window in the parameter space has been identified that allows the reliable production of high aspect ratio taper-free microchannels without sample translation. We report a systematic investigation of the damage morphology dependence on focusing geometry and energy per pulse.</EA>
<CC>001B00A30C; 001B40B65R; 001B40G85D; 002A31C09C; 215</CC>
<FD>Microusinage; Optique ultrarapide; Traitement par laser; Modulateur optique spatial; Application laser; Optique non linéaire; Positionnement; Faisceau Bessel; Faisceau gaussien; Eau; Verre; Matériau diélectrique; Microfluidique; DNA; 0130C; 4265; 4279H; 4265R; 4785N; 8783; 4262C; Laboratoire sur puce</FD>
<ED>Micromachining; Ultrafast optics; Laser assisted processing; Spatial light modulators; Laser beam applications; Nonlinear optics; Positioning; Bessel beam; Gaussian beam; Water; Glass; Dielectric materials; Microfluidics; DNA; Lab-on-a-chip</ED>
<SD>Haz gaussiano</SD>
<LO>INIST-21760.354000174705440400</LO>
<ID>11-0013881</ID>
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Ultrafast Bessel beams for high aspect ratio taper free micromachining of glass

Ultrafast Bessel beams for high aspect ratio taper free micromachining of glass

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