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Serveur d'exploration sur l'Indium - Analysis (Chine)

Index « Keywords » - entrée « Wafer bonding »
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Wafer < Wafer bonding < Wafers  Facettes :

List of bibliographic references

Number of relevant bibliographic references: 8.
Ident.Authors (with country if any)Title
001662 (2006) Direct wafer bonding technology employing vacuum-cavity pre-bonding
001906 (2004-03-15) High-power AlGaInP light-emitting diodes with metal substrates fabricated by wafer bonding
001B11 (2003-02-15) Comparison of p-Side Down and p-Side Up GaN Light-Emitting Diodes Fabricated by Laser Lift-Off
001C62 (2002-10-01) Metallic wafer bonding for the fabrication of long-wavelength vertical-cavity surface-emitting lasers
002126 (2000) Die bonding with Au/In isothermal solidification technique
002158 (1999-11-15) AlGaInP light-emitting diodes with mirror substrates fabricated by wafer bonding
002180 (1999-07-12) AlGaInP/AuBe/glass light-emitting diodes fabricated by wafer bonding technology
002475 (1997) Wafer direct bonding of compound semiconductors and silicon at room temperature by the surface activated bonding method

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