UNIPACK

UNIPACK
Titre :	Universal Failsafe IGBT Package for robust power transmission
Budget :	1 499 k€
Subventions :	FP7-SME (1 087 k€)
Sous-programme :	SME-2011-1 Research for SMEs
Type de contrat :	Research for SMEs
Début :	1er décembre 2011
Fin :	30 novembre 2013
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UNIPACK est l'acronyme du projet européen Universal Failsafe IGBT Package for robust power transmission, qui a pour référence sur le service CORDIS 283857.

English description

Note : Les objectifs suivants sont repris de la fiche du projet sur Cordis

Objective

Through a mixture of applied research and development, the Uni-Pack project will deliver technologies to reduce the manufacturing costs and improve the performance of plastic packaged IGBT (Insulated gate bipolar transistor) modules, in particular those for use in Voltage Source Converters (VSC) for High Voltage Direct Current (HVDC) power transmission. VSC technology enables efficient access to renewable energy sources and economic connection to the electric utilities grid. Trade studies have identified target IGBT module performance parameters for the HVDC market sector and the need to address the influence of gate drive strategies on converter cell/ module performance. Tailoring of IGBT structures for on-state/ switching loss trade-off across each market sector will be demonstrated and applied to develop 4.5KV enhanced DMOS and /or trench IGBT die exhibiting optimum performance for HVDC transmission. Applied research into a high thermal performance low profile package, designed for low inductance and having fully bonded interconnects will deliver step improvements in performance / reliability and reduced manufacturing cost. An important characteristic of the package will be its capability to fail to short circuit, a feature which is highly beneficial in reducing the system costs. A VSC system is currently in the design stage using standard IGBT modules and this will be used as a benchmark to demonstrate and quantify the degree of success.

 

Les partenaires du projet

Coordinateur du projet

• Applied materials technology limited - Lincoln (Royaume-Uni)

Partenaires

• Nimesis technology - Metz (Lorraine, France) - Contact : Alain Hautcoeur
• Dynex semiconductor limited - Lincoln (Royaume-Uni) (Royaume-Uni)
• H V Wooding limited - Hythe (Kent) (Royaume-Uni)
• The UK materials technology research institute limited - Middle aston house, Oxfordshire (Royaume-Uni)
• Novamina centar inovativnih technologija doo - Zagreb (Croatie)
• Fundacion tecnalia research & innovation - Saint-Sébastien (Espagne) (Espagne)
• Microplast AS - Stjørdal (Norvège)

Financement

• Coût total du projet : 1 499 786 €
• Subvention de la Commission européenne (programme FP7-SME) : 1 087 003 €

Dates importantes

• Date de début : 1^er décembre 2011
• Date de fin : 30 novembre 2013

Voir aussi

Liens externes

• Le site officiel de Applied materials technology limited