AustralieFrV1, PascalFrancis, Checkpoint, bibRecord, 005E47

Thermopiezoelectric interaction of crack-microcrack system in a piezoelectric plate

Identifieur interne : 005E47 ( PascalFrancis/Checkpoint ); précédent : 005E46; suivant : 005E48

Thermopiezoelectric interaction of crack-microcrack system in a piezoelectric plate

Auteurs : Q.-H. Qin [Australie]

Source :

Journal de physique. IV [ 1155-4339 ] ; 1999.

RBID : Pascal:00-0108580

Descripteurs français

Pascal (Inist)
- Propriété électromécanique, Propriété thermomécanique, Thermoélasticité, Piézoélectricité, Contrainte résiduelle, Plaque, Matériau anisotrope, Fissure, Microfissure, Interaction, Méthode numérique, Equation intégrale, Singularité, Principe superposition, Fonction Green, 4650.

English descriptors

KwdEn :
- Anisotropic material, Crack, Electromechanical properties, Green function, Integral equation, Interaction, Microcrack, Numerical method, Piezoelectricity, Plate, Residual stress, Singularity, Superposition principle, Thermoelasticity, Thermomechanical properties.

Abstract

'This paper treats the crack-microcrack interactions in an anisotropic piezoelectric solid. Based on the Green's function approach and the principle of superposition, a system of singular integral equations for the unknown temperature discontinuity and elastic displacement-electric potential(EDEP) defined on each crack trace is developed and solved numerically. In the analysis, the residual heat flux, stress and electric displacement (SED) on microcrack location to be released are evaluated directly from the near-tip fields of main crack. Numerical results for SED intensity factors in a three-crack system are presented to illustrate the application of the proposed formulation.

Affiliations:

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Le document en format XML

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<front><div type="abstract" xml:lang="en">'This paper treats the crack-microcrack interactions in an anisotropic piezoelectric solid. Based on the Green's function approach and the principle of superposition, a system of singular integral equations for the unknown temperature discontinuity and elastic displacement-electric potential(EDEP) defined on each crack trace is developed and solved numerically. In the analysis, the residual heat flux, stress and electric displacement (SED) on microcrack location to be released are evaluated directly from the near-tip fields of main crack. Numerical results for SED intensity factors in a three-crack system are presented to illustrate the application of the proposed formulation.</div>
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Thermopiezoelectric interaction of crack-microcrack system in a piezoelectric plate

Thermopiezoelectric interaction of crack-microcrack system in a piezoelectric plate

Source :

Descripteurs français

English descriptors

Abstract

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