The concept of "Hhaptic Tweezer", a non-contact object handling system using levitation techniques and haptics
Identifieur interne : 000A96 ( PascalFrancis/Corpus ); précédent : 000A95; suivant : 000A97The concept of "Hhaptic Tweezer", a non-contact object handling system using levitation techniques and haptics
Auteurs : Ewoud Van West ; Akio Yamamoto ; Toshiro HiguchiSource :
- Mechatronics : (Oxford) [ 0957-4158 ] ; 2007.
Descripteurs français
- Pascal (Inist)
English descriptors
- KwdEn :
Abstract
This paper proposes a new tool concept for object handling. The new tool, named "Haptic Tweezer", is a combination of a non-contact levitation system, such as magnetic- and electrostatic levitation, and a haptic device to realize intuitive object handling. Without mechanical contact, effects such as stiction, contamination or damage to fragile parts can be avoided. In this collaborative system, the haptic device assists the operator in real time to perform an object handling task, such as Pick and Place. By linking a haptic force to the levitation position error, instability of the levitation system during the Pick Up and Place task can be reduced. It realizes an additional stiffness between the tool and the object. Applications of the Haptic Tweezer concept could be the handling of micro-objects or handling fragile objects such as silicon wafers or thin glass plates of flat panel displays (FPD), where non-contact object handling is beneficial. This paper describes the concept of Haptic Tweezer and two realized prototypes, based on magnetic levitation, are shown. Experimental results showed unique characteristics in picking up and placing, which contribute to dexterous and intuitive object handling.
Notice en format standard (ISO 2709)
Pour connaître la documentation sur le format Inist Standard.
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Format Inist (serveur)
NO : | PASCAL 07-0496886 INIST |
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ET : | The concept of "Hhaptic Tweezer", a non-contact object handling system using levitation techniques and haptics |
AU : | VAN WEST (Ewoud); YAMAMOTO (Akio); HIGUCHI (Toshiro) |
AF : | The University of Tokyo, School of Engineering, Department of Precision Engineering, 7-3-1 Hongo/Bunkyo, Tokyo 113-8656/Japon (1 aut., 2 aut., 3 aut.) |
DT : | Publication en série; Niveau analytique |
SO : | Mechatronics : (Oxford); ISSN 0957-4158; Royaume-Uni; Da. 2007; Vol. 17; No. 7; Pp. 345-356; Bibl. 40 ref. |
LA : | Anglais |
EA : | This paper proposes a new tool concept for object handling. The new tool, named "Haptic Tweezer", is a combination of a non-contact levitation system, such as magnetic- and electrostatic levitation, and a haptic device to realize intuitive object handling. Without mechanical contact, effects such as stiction, contamination or damage to fragile parts can be avoided. In this collaborative system, the haptic device assists the operator in real time to perform an object handling task, such as Pick and Place. By linking a haptic force to the levitation position error, instability of the levitation system during the Pick Up and Place task can be reduced. It realizes an additional stiffness between the tool and the object. Applications of the Haptic Tweezer concept could be the handling of micro-objects or handling fragile objects such as silicon wafers or thin glass plates of flat panel displays (FPD), where non-contact object handling is beneficial. This paper describes the concept of Haptic Tweezer and two realized prototypes, based on magnetic levitation, are shown. Experimental results showed unique characteristics in picking up and placing, which contribute to dexterous and intuitive object handling. |
CC : | 001D12I |
FD : | Frottement statique; Lévitation magnétique; Sensibilité tactile; Suspension magnétique; Force électrostatique; Contact mécanique; Adhérence; Contamination; Endommagement; Temps réel; Etude expérimentale; Micromanipulation; Lévitation électrostatique |
ED : | Stiction; Magnetic levitation; Tactile sensitivity; Magnetic suspension; Electrostatic force; Mechanical contact; Adhesion; Contamination; Damaging; Real time; Experimental study; Micromanipulation; Electrostatical levitation |
SD : | Frotamiento estatico; Levitacíon magnetica; Sensibilidad tactil; Suspensión magnética; Fuerza electrostática; Contacto mecánico; Adherencia; Contaminación; Deterioración; Tiempo real; Estudio experimental; Micromanipulación; Levitación electrostática |
LO : | INIST-22113.354000146700960010 |
ID : | 07-0496886 |
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Pascal:07-0496886Le document en format XML
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<server><NO>PASCAL 07-0496886 INIST</NO>
<ET>The concept of "Hhaptic Tweezer", a non-contact object handling system using levitation techniques and haptics</ET>
<AU>VAN WEST (Ewoud); YAMAMOTO (Akio); HIGUCHI (Toshiro)</AU>
<AF>The University of Tokyo, School of Engineering, Department of Precision Engineering, 7-3-1 Hongo/Bunkyo, Tokyo 113-8656/Japon (1 aut., 2 aut., 3 aut.)</AF>
<DT>Publication en série; Niveau analytique</DT>
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<EA>This paper proposes a new tool concept for object handling. The new tool, named "Haptic Tweezer", is a combination of a non-contact levitation system, such as magnetic- and electrostatic levitation, and a haptic device to realize intuitive object handling. Without mechanical contact, effects such as stiction, contamination or damage to fragile parts can be avoided. In this collaborative system, the haptic device assists the operator in real time to perform an object handling task, such as Pick and Place. By linking a haptic force to the levitation position error, instability of the levitation system during the Pick Up and Place task can be reduced. It realizes an additional stiffness between the tool and the object. Applications of the Haptic Tweezer concept could be the handling of micro-objects or handling fragile objects such as silicon wafers or thin glass plates of flat panel displays (FPD), where non-contact object handling is beneficial. This paper describes the concept of Haptic Tweezer and two realized prototypes, based on magnetic levitation, are shown. Experimental results showed unique characteristics in picking up and placing, which contribute to dexterous and intuitive object handling.</EA>
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