Serveur d'exploration sur les dispositifs haptiques

Attention, ce site est en cours de développement !
Attention, site généré par des moyens informatiques à partir de corpus bruts.
Les informations ne sont donc pas validées.

The concept of "Hhaptic Tweezer", a non-contact object handling system using levitation techniques and haptics

Identifieur interne : 000A96 ( PascalFrancis/Corpus ); précédent : 000A95; suivant : 000A97

The concept of "Hhaptic Tweezer", a non-contact object handling system using levitation techniques and haptics

Auteurs : Ewoud Van West ; Akio Yamamoto ; Toshiro Higuchi

Source :

RBID : Pascal:07-0496886

Descripteurs français

English descriptors

Abstract

This paper proposes a new tool concept for object handling. The new tool, named "Haptic Tweezer", is a combination of a non-contact levitation system, such as magnetic- and electrostatic levitation, and a haptic device to realize intuitive object handling. Without mechanical contact, effects such as stiction, contamination or damage to fragile parts can be avoided. In this collaborative system, the haptic device assists the operator in real time to perform an object handling task, such as Pick and Place. By linking a haptic force to the levitation position error, instability of the levitation system during the Pick Up and Place task can be reduced. It realizes an additional stiffness between the tool and the object. Applications of the Haptic Tweezer concept could be the handling of micro-objects or handling fragile objects such as silicon wafers or thin glass plates of flat panel displays (FPD), where non-contact object handling is beneficial. This paper describes the concept of Haptic Tweezer and two realized prototypes, based on magnetic levitation, are shown. Experimental results showed unique characteristics in picking up and placing, which contribute to dexterous and intuitive object handling.

Notice en format standard (ISO 2709)

Pour connaître la documentation sur le format Inist Standard.

pA  
A01 01  1    @0 0957-4158
A03   1    @0 Mechatronics : (Oxf.)
A05       @2 17
A06       @2 7
A08 01  1  ENG  @1 The concept of "Hhaptic Tweezer", a non-contact object handling system using levitation techniques and haptics
A11 01  1    @1 VAN WEST (Ewoud)
A11 02  1    @1 YAMAMOTO (Akio)
A11 03  1    @1 HIGUCHI (Toshiro)
A14 01      @1 The University of Tokyo, School of Engineering, Department of Precision Engineering, 7-3-1 Hongo @2 Bunkyo, Tokyo 113-8656 @3 JPN @Z 1 aut. @Z 2 aut. @Z 3 aut.
A20       @1 345-356
A21       @1 2007
A23 01      @0 ENG
A43 01      @1 INIST @2 22113 @5 354000146700960010
A44       @0 0000 @1 © 2007 INIST-CNRS. All rights reserved.
A45       @0 40 ref.
A47 01  1    @0 07-0496886
A60       @1 P
A61       @0 A
A64 01  1    @0 Mechatronics : (Oxford)
A66 01      @0 GBR
C01 01    ENG  @0 This paper proposes a new tool concept for object handling. The new tool, named "Haptic Tweezer", is a combination of a non-contact levitation system, such as magnetic- and electrostatic levitation, and a haptic device to realize intuitive object handling. Without mechanical contact, effects such as stiction, contamination or damage to fragile parts can be avoided. In this collaborative system, the haptic device assists the operator in real time to perform an object handling task, such as Pick and Place. By linking a haptic force to the levitation position error, instability of the levitation system during the Pick Up and Place task can be reduced. It realizes an additional stiffness between the tool and the object. Applications of the Haptic Tweezer concept could be the handling of micro-objects or handling fragile objects such as silicon wafers or thin glass plates of flat panel displays (FPD), where non-contact object handling is beneficial. This paper describes the concept of Haptic Tweezer and two realized prototypes, based on magnetic levitation, are shown. Experimental results showed unique characteristics in picking up and placing, which contribute to dexterous and intuitive object handling.
C02 01  X    @0 001D12I
C03 01  X  FRE  @0 Frottement statique @5 06
C03 01  X  ENG  @0 Stiction @5 06
C03 01  X  SPA  @0 Frotamiento estatico @5 06
C03 02  X  FRE  @0 Lévitation magnétique @5 18
C03 02  X  ENG  @0 Magnetic levitation @5 18
C03 02  X  SPA  @0 Levitacíon magnetica @5 18
C03 03  X  FRE  @0 Sensibilité tactile @5 19
C03 03  X  ENG  @0 Tactile sensitivity @5 19
C03 03  X  SPA  @0 Sensibilidad tactil @5 19
C03 04  X  FRE  @0 Suspension magnétique @5 20
C03 04  X  ENG  @0 Magnetic suspension @5 20
C03 04  X  SPA  @0 Suspensión magnética @5 20
C03 05  X  FRE  @0 Force électrostatique @5 21
C03 05  X  ENG  @0 Electrostatic force @5 21
C03 05  X  SPA  @0 Fuerza electrostática @5 21
C03 06  X  FRE  @0 Contact mécanique @5 22
C03 06  X  ENG  @0 Mechanical contact @5 22
C03 06  X  SPA  @0 Contacto mecánico @5 22
C03 07  X  FRE  @0 Adhérence @5 23
C03 07  X  ENG  @0 Adhesion @5 23
C03 07  X  SPA  @0 Adherencia @5 23
C03 08  X  FRE  @0 Contamination @5 24
C03 08  X  ENG  @0 Contamination @5 24
C03 08  X  SPA  @0 Contaminación @5 24
C03 09  X  FRE  @0 Endommagement @5 25
C03 09  X  ENG  @0 Damaging @5 25
C03 09  X  SPA  @0 Deterioración @5 25
C03 10  X  FRE  @0 Temps réel @5 26
C03 10  X  ENG  @0 Real time @5 26
C03 10  X  SPA  @0 Tiempo real @5 26
C03 11  X  FRE  @0 Etude expérimentale @5 33
C03 11  X  ENG  @0 Experimental study @5 33
C03 11  X  SPA  @0 Estudio experimental @5 33
C03 12  X  FRE  @0 Micromanipulation @5 41
C03 12  X  ENG  @0 Micromanipulation @5 41
C03 12  X  SPA  @0 Micromanipulación @5 41
C03 13  X  FRE  @0 Lévitation électrostatique @4 CD @5 96
C03 13  X  ENG  @0 Electrostatical levitation @4 CD @5 96
C03 13  X  SPA  @0 Levitación electrostática @4 CD @5 96
N21       @1 323
N44 01      @1 OTO
N82       @1 OTO

Format Inist (serveur)

NO : PASCAL 07-0496886 INIST
ET : The concept of "Hhaptic Tweezer", a non-contact object handling system using levitation techniques and haptics
AU : VAN WEST (Ewoud); YAMAMOTO (Akio); HIGUCHI (Toshiro)
AF : The University of Tokyo, School of Engineering, Department of Precision Engineering, 7-3-1 Hongo/Bunkyo, Tokyo 113-8656/Japon (1 aut., 2 aut., 3 aut.)
DT : Publication en série; Niveau analytique
SO : Mechatronics : (Oxford); ISSN 0957-4158; Royaume-Uni; Da. 2007; Vol. 17; No. 7; Pp. 345-356; Bibl. 40 ref.
LA : Anglais
EA : This paper proposes a new tool concept for object handling. The new tool, named "Haptic Tweezer", is a combination of a non-contact levitation system, such as magnetic- and electrostatic levitation, and a haptic device to realize intuitive object handling. Without mechanical contact, effects such as stiction, contamination or damage to fragile parts can be avoided. In this collaborative system, the haptic device assists the operator in real time to perform an object handling task, such as Pick and Place. By linking a haptic force to the levitation position error, instability of the levitation system during the Pick Up and Place task can be reduced. It realizes an additional stiffness between the tool and the object. Applications of the Haptic Tweezer concept could be the handling of micro-objects or handling fragile objects such as silicon wafers or thin glass plates of flat panel displays (FPD), where non-contact object handling is beneficial. This paper describes the concept of Haptic Tweezer and two realized prototypes, based on magnetic levitation, are shown. Experimental results showed unique characteristics in picking up and placing, which contribute to dexterous and intuitive object handling.
CC : 001D12I
FD : Frottement statique; Lévitation magnétique; Sensibilité tactile; Suspension magnétique; Force électrostatique; Contact mécanique; Adhérence; Contamination; Endommagement; Temps réel; Etude expérimentale; Micromanipulation; Lévitation électrostatique
ED : Stiction; Magnetic levitation; Tactile sensitivity; Magnetic suspension; Electrostatic force; Mechanical contact; Adhesion; Contamination; Damaging; Real time; Experimental study; Micromanipulation; Electrostatical levitation
SD : Frotamiento estatico; Levitacíon magnetica; Sensibilidad tactil; Suspensión magnética; Fuerza electrostática; Contacto mecánico; Adherencia; Contaminación; Deterioración; Tiempo real; Estudio experimental; Micromanipulación; Levitación electrostática
LO : INIST-22113.354000146700960010
ID : 07-0496886

Links to Exploration step

Pascal:07-0496886

Le document en format XML

<record>
<TEI>
<teiHeader>
<fileDesc>
<titleStmt>
<title xml:lang="en" level="a">The concept of "Hhaptic Tweezer", a non-contact object handling system using levitation techniques and haptics</title>
<author>
<name sortKey="Van West, Ewoud" sort="Van West, Ewoud" uniqKey="Van West E" first="Ewoud" last="Van West">Ewoud Van West</name>
<affiliation>
<inist:fA14 i1="01">
<s1>The University of Tokyo, School of Engineering, Department of Precision Engineering, 7-3-1 Hongo</s1>
<s2>Bunkyo, Tokyo 113-8656</s2>
<s3>JPN</s3>
<sZ>1 aut.</sZ>
<sZ>2 aut.</sZ>
<sZ>3 aut.</sZ>
</inist:fA14>
</affiliation>
</author>
<author>
<name sortKey="Yamamoto, Akio" sort="Yamamoto, Akio" uniqKey="Yamamoto A" first="Akio" last="Yamamoto">Akio Yamamoto</name>
<affiliation>
<inist:fA14 i1="01">
<s1>The University of Tokyo, School of Engineering, Department of Precision Engineering, 7-3-1 Hongo</s1>
<s2>Bunkyo, Tokyo 113-8656</s2>
<s3>JPN</s3>
<sZ>1 aut.</sZ>
<sZ>2 aut.</sZ>
<sZ>3 aut.</sZ>
</inist:fA14>
</affiliation>
</author>
<author>
<name sortKey="Higuchi, Toshiro" sort="Higuchi, Toshiro" uniqKey="Higuchi T" first="Toshiro" last="Higuchi">Toshiro Higuchi</name>
<affiliation>
<inist:fA14 i1="01">
<s1>The University of Tokyo, School of Engineering, Department of Precision Engineering, 7-3-1 Hongo</s1>
<s2>Bunkyo, Tokyo 113-8656</s2>
<s3>JPN</s3>
<sZ>1 aut.</sZ>
<sZ>2 aut.</sZ>
<sZ>3 aut.</sZ>
</inist:fA14>
</affiliation>
</author>
</titleStmt>
<publicationStmt>
<idno type="wicri:source">INIST</idno>
<idno type="inist">07-0496886</idno>
<date when="2007">2007</date>
<idno type="stanalyst">PASCAL 07-0496886 INIST</idno>
<idno type="RBID">Pascal:07-0496886</idno>
<idno type="wicri:Area/PascalFrancis/Corpus">000A96</idno>
</publicationStmt>
<sourceDesc>
<biblStruct>
<analytic>
<title xml:lang="en" level="a">The concept of "Hhaptic Tweezer", a non-contact object handling system using levitation techniques and haptics</title>
<author>
<name sortKey="Van West, Ewoud" sort="Van West, Ewoud" uniqKey="Van West E" first="Ewoud" last="Van West">Ewoud Van West</name>
<affiliation>
<inist:fA14 i1="01">
<s1>The University of Tokyo, School of Engineering, Department of Precision Engineering, 7-3-1 Hongo</s1>
<s2>Bunkyo, Tokyo 113-8656</s2>
<s3>JPN</s3>
<sZ>1 aut.</sZ>
<sZ>2 aut.</sZ>
<sZ>3 aut.</sZ>
</inist:fA14>
</affiliation>
</author>
<author>
<name sortKey="Yamamoto, Akio" sort="Yamamoto, Akio" uniqKey="Yamamoto A" first="Akio" last="Yamamoto">Akio Yamamoto</name>
<affiliation>
<inist:fA14 i1="01">
<s1>The University of Tokyo, School of Engineering, Department of Precision Engineering, 7-3-1 Hongo</s1>
<s2>Bunkyo, Tokyo 113-8656</s2>
<s3>JPN</s3>
<sZ>1 aut.</sZ>
<sZ>2 aut.</sZ>
<sZ>3 aut.</sZ>
</inist:fA14>
</affiliation>
</author>
<author>
<name sortKey="Higuchi, Toshiro" sort="Higuchi, Toshiro" uniqKey="Higuchi T" first="Toshiro" last="Higuchi">Toshiro Higuchi</name>
<affiliation>
<inist:fA14 i1="01">
<s1>The University of Tokyo, School of Engineering, Department of Precision Engineering, 7-3-1 Hongo</s1>
<s2>Bunkyo, Tokyo 113-8656</s2>
<s3>JPN</s3>
<sZ>1 aut.</sZ>
<sZ>2 aut.</sZ>
<sZ>3 aut.</sZ>
</inist:fA14>
</affiliation>
</author>
</analytic>
<series>
<title level="j" type="main">Mechatronics : (Oxford)</title>
<title level="j" type="abbreviated">Mechatronics : (Oxf.)</title>
<idno type="ISSN">0957-4158</idno>
<imprint>
<date when="2007">2007</date>
</imprint>
</series>
</biblStruct>
</sourceDesc>
<seriesStmt>
<title level="j" type="main">Mechatronics : (Oxford)</title>
<title level="j" type="abbreviated">Mechatronics : (Oxf.)</title>
<idno type="ISSN">0957-4158</idno>
</seriesStmt>
</fileDesc>
<profileDesc>
<textClass>
<keywords scheme="KwdEn" xml:lang="en">
<term>Adhesion</term>
<term>Contamination</term>
<term>Damaging</term>
<term>Electrostatic force</term>
<term>Electrostatical levitation</term>
<term>Experimental study</term>
<term>Magnetic levitation</term>
<term>Magnetic suspension</term>
<term>Mechanical contact</term>
<term>Micromanipulation</term>
<term>Real time</term>
<term>Stiction</term>
<term>Tactile sensitivity</term>
</keywords>
<keywords scheme="Pascal" xml:lang="fr">
<term>Frottement statique</term>
<term>Lévitation magnétique</term>
<term>Sensibilité tactile</term>
<term>Suspension magnétique</term>
<term>Force électrostatique</term>
<term>Contact mécanique</term>
<term>Adhérence</term>
<term>Contamination</term>
<term>Endommagement</term>
<term>Temps réel</term>
<term>Etude expérimentale</term>
<term>Micromanipulation</term>
<term>Lévitation électrostatique</term>
</keywords>
</textClass>
</profileDesc>
</teiHeader>
<front>
<div type="abstract" xml:lang="en">This paper proposes a new tool concept for object handling. The new tool, named "Haptic Tweezer", is a combination of a non-contact levitation system, such as magnetic- and electrostatic levitation, and a haptic device to realize intuitive object handling. Without mechanical contact, effects such as stiction, contamination or damage to fragile parts can be avoided. In this collaborative system, the haptic device assists the operator in real time to perform an object handling task, such as Pick and Place. By linking a haptic force to the levitation position error, instability of the levitation system during the Pick Up and Place task can be reduced. It realizes an additional stiffness between the tool and the object. Applications of the Haptic Tweezer concept could be the handling of micro-objects or handling fragile objects such as silicon wafers or thin glass plates of flat panel displays (FPD), where non-contact object handling is beneficial. This paper describes the concept of Haptic Tweezer and two realized prototypes, based on magnetic levitation, are shown. Experimental results showed unique characteristics in picking up and placing, which contribute to dexterous and intuitive object handling.</div>
</front>
</TEI>
<inist>
<standard h6="B">
<pA>
<fA01 i1="01" i2="1">
<s0>0957-4158</s0>
</fA01>
<fA03 i2="1">
<s0>Mechatronics : (Oxf.)</s0>
</fA03>
<fA05>
<s2>17</s2>
</fA05>
<fA06>
<s2>7</s2>
</fA06>
<fA08 i1="01" i2="1" l="ENG">
<s1>The concept of "Hhaptic Tweezer", a non-contact object handling system using levitation techniques and haptics</s1>
</fA08>
<fA11 i1="01" i2="1">
<s1>VAN WEST (Ewoud)</s1>
</fA11>
<fA11 i1="02" i2="1">
<s1>YAMAMOTO (Akio)</s1>
</fA11>
<fA11 i1="03" i2="1">
<s1>HIGUCHI (Toshiro)</s1>
</fA11>
<fA14 i1="01">
<s1>The University of Tokyo, School of Engineering, Department of Precision Engineering, 7-3-1 Hongo</s1>
<s2>Bunkyo, Tokyo 113-8656</s2>
<s3>JPN</s3>
<sZ>1 aut.</sZ>
<sZ>2 aut.</sZ>
<sZ>3 aut.</sZ>
</fA14>
<fA20>
<s1>345-356</s1>
</fA20>
<fA21>
<s1>2007</s1>
</fA21>
<fA23 i1="01">
<s0>ENG</s0>
</fA23>
<fA43 i1="01">
<s1>INIST</s1>
<s2>22113</s2>
<s5>354000146700960010</s5>
</fA43>
<fA44>
<s0>0000</s0>
<s1>© 2007 INIST-CNRS. All rights reserved.</s1>
</fA44>
<fA45>
<s0>40 ref.</s0>
</fA45>
<fA47 i1="01" i2="1">
<s0>07-0496886</s0>
</fA47>
<fA60>
<s1>P</s1>
</fA60>
<fA61>
<s0>A</s0>
</fA61>
<fA64 i1="01" i2="1">
<s0>Mechatronics : (Oxford)</s0>
</fA64>
<fA66 i1="01">
<s0>GBR</s0>
</fA66>
<fC01 i1="01" l="ENG">
<s0>This paper proposes a new tool concept for object handling. The new tool, named "Haptic Tweezer", is a combination of a non-contact levitation system, such as magnetic- and electrostatic levitation, and a haptic device to realize intuitive object handling. Without mechanical contact, effects such as stiction, contamination or damage to fragile parts can be avoided. In this collaborative system, the haptic device assists the operator in real time to perform an object handling task, such as Pick and Place. By linking a haptic force to the levitation position error, instability of the levitation system during the Pick Up and Place task can be reduced. It realizes an additional stiffness between the tool and the object. Applications of the Haptic Tweezer concept could be the handling of micro-objects or handling fragile objects such as silicon wafers or thin glass plates of flat panel displays (FPD), where non-contact object handling is beneficial. This paper describes the concept of Haptic Tweezer and two realized prototypes, based on magnetic levitation, are shown. Experimental results showed unique characteristics in picking up and placing, which contribute to dexterous and intuitive object handling.</s0>
</fC01>
<fC02 i1="01" i2="X">
<s0>001D12I</s0>
</fC02>
<fC03 i1="01" i2="X" l="FRE">
<s0>Frottement statique</s0>
<s5>06</s5>
</fC03>
<fC03 i1="01" i2="X" l="ENG">
<s0>Stiction</s0>
<s5>06</s5>
</fC03>
<fC03 i1="01" i2="X" l="SPA">
<s0>Frotamiento estatico</s0>
<s5>06</s5>
</fC03>
<fC03 i1="02" i2="X" l="FRE">
<s0>Lévitation magnétique</s0>
<s5>18</s5>
</fC03>
<fC03 i1="02" i2="X" l="ENG">
<s0>Magnetic levitation</s0>
<s5>18</s5>
</fC03>
<fC03 i1="02" i2="X" l="SPA">
<s0>Levitacíon magnetica</s0>
<s5>18</s5>
</fC03>
<fC03 i1="03" i2="X" l="FRE">
<s0>Sensibilité tactile</s0>
<s5>19</s5>
</fC03>
<fC03 i1="03" i2="X" l="ENG">
<s0>Tactile sensitivity</s0>
<s5>19</s5>
</fC03>
<fC03 i1="03" i2="X" l="SPA">
<s0>Sensibilidad tactil</s0>
<s5>19</s5>
</fC03>
<fC03 i1="04" i2="X" l="FRE">
<s0>Suspension magnétique</s0>
<s5>20</s5>
</fC03>
<fC03 i1="04" i2="X" l="ENG">
<s0>Magnetic suspension</s0>
<s5>20</s5>
</fC03>
<fC03 i1="04" i2="X" l="SPA">
<s0>Suspensión magnética</s0>
<s5>20</s5>
</fC03>
<fC03 i1="05" i2="X" l="FRE">
<s0>Force électrostatique</s0>
<s5>21</s5>
</fC03>
<fC03 i1="05" i2="X" l="ENG">
<s0>Electrostatic force</s0>
<s5>21</s5>
</fC03>
<fC03 i1="05" i2="X" l="SPA">
<s0>Fuerza electrostática</s0>
<s5>21</s5>
</fC03>
<fC03 i1="06" i2="X" l="FRE">
<s0>Contact mécanique</s0>
<s5>22</s5>
</fC03>
<fC03 i1="06" i2="X" l="ENG">
<s0>Mechanical contact</s0>
<s5>22</s5>
</fC03>
<fC03 i1="06" i2="X" l="SPA">
<s0>Contacto mecánico</s0>
<s5>22</s5>
</fC03>
<fC03 i1="07" i2="X" l="FRE">
<s0>Adhérence</s0>
<s5>23</s5>
</fC03>
<fC03 i1="07" i2="X" l="ENG">
<s0>Adhesion</s0>
<s5>23</s5>
</fC03>
<fC03 i1="07" i2="X" l="SPA">
<s0>Adherencia</s0>
<s5>23</s5>
</fC03>
<fC03 i1="08" i2="X" l="FRE">
<s0>Contamination</s0>
<s5>24</s5>
</fC03>
<fC03 i1="08" i2="X" l="ENG">
<s0>Contamination</s0>
<s5>24</s5>
</fC03>
<fC03 i1="08" i2="X" l="SPA">
<s0>Contaminación</s0>
<s5>24</s5>
</fC03>
<fC03 i1="09" i2="X" l="FRE">
<s0>Endommagement</s0>
<s5>25</s5>
</fC03>
<fC03 i1="09" i2="X" l="ENG">
<s0>Damaging</s0>
<s5>25</s5>
</fC03>
<fC03 i1="09" i2="X" l="SPA">
<s0>Deterioración</s0>
<s5>25</s5>
</fC03>
<fC03 i1="10" i2="X" l="FRE">
<s0>Temps réel</s0>
<s5>26</s5>
</fC03>
<fC03 i1="10" i2="X" l="ENG">
<s0>Real time</s0>
<s5>26</s5>
</fC03>
<fC03 i1="10" i2="X" l="SPA">
<s0>Tiempo real</s0>
<s5>26</s5>
</fC03>
<fC03 i1="11" i2="X" l="FRE">
<s0>Etude expérimentale</s0>
<s5>33</s5>
</fC03>
<fC03 i1="11" i2="X" l="ENG">
<s0>Experimental study</s0>
<s5>33</s5>
</fC03>
<fC03 i1="11" i2="X" l="SPA">
<s0>Estudio experimental</s0>
<s5>33</s5>
</fC03>
<fC03 i1="12" i2="X" l="FRE">
<s0>Micromanipulation</s0>
<s5>41</s5>
</fC03>
<fC03 i1="12" i2="X" l="ENG">
<s0>Micromanipulation</s0>
<s5>41</s5>
</fC03>
<fC03 i1="12" i2="X" l="SPA">
<s0>Micromanipulación</s0>
<s5>41</s5>
</fC03>
<fC03 i1="13" i2="X" l="FRE">
<s0>Lévitation électrostatique</s0>
<s4>CD</s4>
<s5>96</s5>
</fC03>
<fC03 i1="13" i2="X" l="ENG">
<s0>Electrostatical levitation</s0>
<s4>CD</s4>
<s5>96</s5>
</fC03>
<fC03 i1="13" i2="X" l="SPA">
<s0>Levitación electrostática</s0>
<s4>CD</s4>
<s5>96</s5>
</fC03>
<fN21>
<s1>323</s1>
</fN21>
<fN44 i1="01">
<s1>OTO</s1>
</fN44>
<fN82>
<s1>OTO</s1>
</fN82>
</pA>
</standard>
<server>
<NO>PASCAL 07-0496886 INIST</NO>
<ET>The concept of "Hhaptic Tweezer", a non-contact object handling system using levitation techniques and haptics</ET>
<AU>VAN WEST (Ewoud); YAMAMOTO (Akio); HIGUCHI (Toshiro)</AU>
<AF>The University of Tokyo, School of Engineering, Department of Precision Engineering, 7-3-1 Hongo/Bunkyo, Tokyo 113-8656/Japon (1 aut., 2 aut., 3 aut.)</AF>
<DT>Publication en série; Niveau analytique</DT>
<SO>Mechatronics : (Oxford); ISSN 0957-4158; Royaume-Uni; Da. 2007; Vol. 17; No. 7; Pp. 345-356; Bibl. 40 ref.</SO>
<LA>Anglais</LA>
<EA>This paper proposes a new tool concept for object handling. The new tool, named "Haptic Tweezer", is a combination of a non-contact levitation system, such as magnetic- and electrostatic levitation, and a haptic device to realize intuitive object handling. Without mechanical contact, effects such as stiction, contamination or damage to fragile parts can be avoided. In this collaborative system, the haptic device assists the operator in real time to perform an object handling task, such as Pick and Place. By linking a haptic force to the levitation position error, instability of the levitation system during the Pick Up and Place task can be reduced. It realizes an additional stiffness between the tool and the object. Applications of the Haptic Tweezer concept could be the handling of micro-objects or handling fragile objects such as silicon wafers or thin glass plates of flat panel displays (FPD), where non-contact object handling is beneficial. This paper describes the concept of Haptic Tweezer and two realized prototypes, based on magnetic levitation, are shown. Experimental results showed unique characteristics in picking up and placing, which contribute to dexterous and intuitive object handling.</EA>
<CC>001D12I</CC>
<FD>Frottement statique; Lévitation magnétique; Sensibilité tactile; Suspension magnétique; Force électrostatique; Contact mécanique; Adhérence; Contamination; Endommagement; Temps réel; Etude expérimentale; Micromanipulation; Lévitation électrostatique</FD>
<ED>Stiction; Magnetic levitation; Tactile sensitivity; Magnetic suspension; Electrostatic force; Mechanical contact; Adhesion; Contamination; Damaging; Real time; Experimental study; Micromanipulation; Electrostatical levitation</ED>
<SD>Frotamiento estatico; Levitacíon magnetica; Sensibilidad tactil; Suspensión magnética; Fuerza electrostática; Contacto mecánico; Adherencia; Contaminación; Deterioración; Tiempo real; Estudio experimental; Micromanipulación; Levitación electrostática</SD>
<LO>INIST-22113.354000146700960010</LO>
<ID>07-0496886</ID>
</server>
</inist>
</record>

Pour manipuler ce document sous Unix (Dilib)

EXPLOR_STEP=$WICRI_ROOT/Ticri/CIDE/explor/HapticV1/Data/PascalFrancis/Corpus
HfdSelect -h $EXPLOR_STEP/biblio.hfd -nk 000A96 | SxmlIndent | more

Ou

HfdSelect -h $EXPLOR_AREA/Data/PascalFrancis/Corpus/biblio.hfd -nk 000A96 | SxmlIndent | more

Pour mettre un lien sur cette page dans le réseau Wicri

{{Explor lien
   |wiki=    Ticri/CIDE
   |area=    HapticV1
   |flux=    PascalFrancis
   |étape=   Corpus
   |type=    RBID
   |clé=     Pascal:07-0496886
   |texte=   The concept of "Hhaptic Tweezer", a non-contact object handling system using levitation techniques and haptics
}}

Wicri

This area was generated with Dilib version V0.6.23.
Data generation: Mon Jun 13 01:09:46 2016. Site generation: Wed Mar 6 09:54:07 2024