Mechanics of finger-tip electronics
Identifieur interne : 002B08 ( Ncbi/Merge ); précédent : 002B07; suivant : 002B09Mechanics of finger-tip electronics
Auteurs : Yewang Su [République populaire de Chine, États-Unis] ; Rui Li [République populaire de Chine] ; Huanyu Cheng [États-Unis] ; Ming Ying [États-Unis] ; Andrew P. Bonifas [États-Unis] ; Keh-Chih Hwang [République populaire de Chine] ; John A. Rogers [États-Unis] ; Yonggang Huang [États-Unis]Source :
- Journal of Applied Physics [ 0021-8979 ] ; 2013.
Abstract
Tactile sensors and electrotactile stimulators can provide important links between humans and virtual environments, through the sensation of touch. Soft materials, such as low modulus silicones, are attractive as platforms and support matrices for arrays sensors and actuators that laminate directly onto the fingertips. Analytic models for the mechanics of three dimensional, form-fitting finger cuffs based on such designs are presented here, along with quantitative validation using the finite element method. The results indicate that the maximum strains in the silicone and the embedded devices are inversely proportional to the square root of radius of curvature of the cuff. These and other findings can be useful in formulating designs for these and related classes of body-worn, three dimensional devices.
Url:
DOI: 10.1063/1.4828476
PubMed: 24273338
PubMed Central: 3829916
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Bonifas</name><affiliation wicri:level="2"><nlm:aff id="a4">Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA</nlm:aff><country xml:lang="fr">États-Unis</country><wicri:regionArea>Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801</wicri:regionArea><placeName><region type="state">Illinois</region></placeName></affiliation></author><author><name sortKey="Hwang, Keh Chih" sort="Hwang, Keh Chih" uniqKey="Hwang K" first="Keh-Chih" last="Hwang">Keh-Chih Hwang</name><affiliation wicri:level="1"><nlm:aff id="a1">Center for Mechanics and Materials, Tsinghua University, Beijing 100084, China</nlm:aff><country xml:lang="fr">République populaire de Chine</country><wicri:regionArea>Center for Mechanics and Materials, Tsinghua University, Beijing 100084</wicri:regionArea><placeName><settlement type="city">Pékin</settlement></placeName></affiliation></author><author><name sortKey="Rogers, John A" sort="Rogers, John A" uniqKey="Rogers J" first="John A." last="Rogers">John A. Rogers</name><affiliation wicri:level="2"><nlm:aff id="a4">Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA</nlm:aff><country xml:lang="fr">États-Unis</country><wicri:regionArea>Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801</wicri:regionArea><placeName><region type="state">Illinois</region></placeName></affiliation></author><author><name sortKey="Huang, Yonggang" sort="Huang, Yonggang" uniqKey="Huang Y" first="Yonggang" last="Huang">Yonggang Huang</name><affiliation wicri:level="2"><nlm:aff id="a2">Department of Civil and Environmental Engineering, Department of Mechanical Engineering, Center for Engineering and Health and Skin Disease Research Center, Northwestern University, Evanston, IL 60208</nlm:aff><country xml:lang="fr">États-Unis</country><placeName><region type="state">Illinois</region></placeName><wicri:cityArea>Department of Civil and Environmental Engineering, Department of Mechanical Engineering, Center for Engineering and Health and Skin Disease Research Center, Northwestern University, Evanston</wicri:cityArea></affiliation></author></titleStmt><publicationStmt><idno type="wicri:source">PMC</idno><idno type="pmid">24273338</idno><idno type="pmc">3829916</idno><idno type="url">http://www.ncbi.nlm.nih.gov/pmc/articles/PMC3829916</idno><idno type="RBID">PMC:3829916</idno><idno type="doi">10.1063/1.4828476</idno><date when="2013">2013</date><idno type="wicri:Area/Pmc/Corpus">000619</idno><idno type="wicri:Area/Pmc/Curation">000619</idno><idno type="wicri:Area/Pmc/Checkpoint">001157</idno><idno type="wicri:Area/Ncbi/Merge">002B08</idno></publicationStmt><sourceDesc><biblStruct><analytic><title xml:lang="en" level="a" type="main">Mechanics of finger-tip electronics</title><author><name sortKey="Su, Yewang" sort="Su, Yewang" uniqKey="Su Y" first="Yewang" last="Su">Yewang Su</name><affiliation wicri:level="1"><nlm:aff id="a1">Center for Mechanics and Materials, Tsinghua University, Beijing 100084, China</nlm:aff><country xml:lang="fr">République populaire de Chine</country><wicri:regionArea>Center for Mechanics and Materials, Tsinghua University, Beijing 100084</wicri:regionArea><placeName><settlement type="city">Pékin</settlement></placeName></affiliation><affiliation wicri:level="2"><nlm:aff id="a2">Department of Civil and Environmental Engineering, Department of Mechanical Engineering, Center for Engineering and Health and Skin Disease Research Center, Northwestern University, Evanston, IL 60208</nlm:aff><country xml:lang="fr">États-Unis</country><placeName><region type="state">Illinois</region></placeName><wicri:cityArea>Department of Civil and Environmental Engineering, Department of Mechanical Engineering, Center for Engineering and Health and Skin Disease Research Center, Northwestern University, Evanston</wicri:cityArea></affiliation></author><author><name sortKey="Li, Rui" sort="Li, Rui" uniqKey="Li R" first="Rui" last="Li">Rui Li</name><affiliation wicri:level="1"><nlm:aff id="a3">State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian 116024, China</nlm:aff><country xml:lang="fr">République populaire de Chine</country><wicri:regionArea>State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian 116024</wicri:regionArea><wicri:noRegion>Dalian 116024</wicri:noRegion></affiliation></author><author><name sortKey="Cheng, Huanyu" sort="Cheng, Huanyu" uniqKey="Cheng H" first="Huanyu" last="Cheng">Huanyu Cheng</name><affiliation wicri:level="2"><nlm:aff id="a2">Department of Civil and Environmental Engineering, Department of Mechanical Engineering, Center for Engineering and Health and Skin Disease Research Center, Northwestern University, Evanston, IL 60208</nlm:aff><country xml:lang="fr">États-Unis</country><placeName><region type="state">Illinois</region></placeName><wicri:cityArea>Department of Civil and Environmental Engineering, Department of Mechanical Engineering, Center for Engineering and Health and Skin Disease Research Center, Northwestern University, Evanston</wicri:cityArea></affiliation></author><author><name sortKey="Ying, Ming" sort="Ying, Ming" uniqKey="Ying M" first="Ming" last="Ying">Ming Ying</name><affiliation wicri:level="2"><nlm:aff id="a4">Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA</nlm:aff><country xml:lang="fr">États-Unis</country><wicri:regionArea>Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801</wicri:regionArea><placeName><region type="state">Illinois</region></placeName></affiliation></author><author><name sortKey="Bonifas, Andrew P" sort="Bonifas, Andrew P" uniqKey="Bonifas A" first="Andrew P." last="Bonifas">Andrew P. Bonifas</name><affiliation wicri:level="2"><nlm:aff id="a4">Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA</nlm:aff><country xml:lang="fr">États-Unis</country><wicri:regionArea>Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801</wicri:regionArea><placeName><region type="state">Illinois</region></placeName></affiliation></author><author><name sortKey="Hwang, Keh Chih" sort="Hwang, Keh Chih" uniqKey="Hwang K" first="Keh-Chih" last="Hwang">Keh-Chih Hwang</name><affiliation wicri:level="1"><nlm:aff id="a1">Center for Mechanics and Materials, Tsinghua University, Beijing 100084, China</nlm:aff><country xml:lang="fr">République populaire de Chine</country><wicri:regionArea>Center for Mechanics and Materials, Tsinghua University, Beijing 100084</wicri:regionArea><placeName><settlement type="city">Pékin</settlement></placeName></affiliation></author><author><name sortKey="Rogers, John A" sort="Rogers, John A" uniqKey="Rogers J" first="John A." last="Rogers">John A. Rogers</name><affiliation wicri:level="2"><nlm:aff id="a4">Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA</nlm:aff><country xml:lang="fr">États-Unis</country><wicri:regionArea>Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801</wicri:regionArea><placeName><region type="state">Illinois</region></placeName></affiliation></author><author><name sortKey="Huang, Yonggang" sort="Huang, Yonggang" uniqKey="Huang Y" first="Yonggang" last="Huang">Yonggang Huang</name><affiliation wicri:level="2"><nlm:aff id="a2">Department of Civil and Environmental Engineering, Department of Mechanical Engineering, Center for Engineering and Health and Skin Disease Research Center, Northwestern University, Evanston, IL 60208</nlm:aff><country xml:lang="fr">États-Unis</country><placeName><region type="state">Illinois</region></placeName><wicri:cityArea>Department of Civil and Environmental Engineering, Department of Mechanical Engineering, Center for Engineering and Health and Skin Disease Research Center, Northwestern University, Evanston</wicri:cityArea></affiliation></author></analytic><series><title level="j">Journal of Applied Physics</title><idno type="ISSN">0021-8979</idno><idno type="eISSN">0021-8979</idno><imprint><date when="2013">2013</date></imprint></series></biblStruct></sourceDesc></fileDesc><profileDesc><textClass></textClass></profileDesc></teiHeader><front><div type="abstract" xml:lang="en"><p>Tactile sensors and electrotactile stimulators can provide important links between humans and virtual environments, through the sensation of touch. Soft materials, such as low modulus silicones, are attractive as platforms and support matrices for arrays sensors and actuators that laminate directly onto the fingertips. Analytic models for the mechanics of three dimensional, form-fitting finger cuffs based on such designs are presented here, along with quantitative validation using the finite element method. The results indicate that the maximum strains in the silicone and the embedded devices are inversely proportional to the square root of radius of curvature of the cuff. These and other findings can be useful in formulating designs for these and related classes of body-worn, three dimensional devices.</p></div></front></TEI><pmc article-type="research-article"><pmc-comment>The publisher of this article does not allow downloading of the full text in XML form.</pmc-comment>
<front><journal-meta><journal-id journal-id-type="nlm-ta">J Appl Phys</journal-id><journal-id journal-id-type="iso-abbrev">J Appl Phys</journal-id><journal-title-group><journal-title>Journal of Applied Physics</journal-title></journal-title-group><issn pub-type="ppub">0021-8979</issn><issn pub-type="epub">0021-8979</issn><publisher><publisher-name>AIP Publishing LLC</publisher-name></publisher></journal-meta><article-meta><article-id pub-id-type="pmid">24273338</article-id><article-id pub-id-type="pmc">3829916</article-id><article-id pub-id-type="publisher-id">018342JAP</article-id><article-id pub-id-type="doi">10.1063/1.4828476</article-id><article-categories><subj-group subj-group-type="heading"><subject>Device Physics</subject></subj-group></article-categories><title-group><article-title>Mechanics of finger-tip electronics</article-title></title-group><contrib-group><contrib contrib-type="author"><name><surname>Su</surname><given-names>Yewang</given-names></name><xref ref-type="aff" rid="a1">1</xref><xref ref-type="aff" rid="a2">2</xref><xref ref-type="author-notes" rid="n1">a)</xref></contrib><contrib contrib-type="author"><name><surname>Li</surname><given-names>Rui</given-names></name><xref ref-type="aff" rid="a3">3</xref><xref ref-type="author-notes" rid="n1">a)</xref></contrib><contrib contrib-type="author"><name><surname>Cheng</surname><given-names>Huanyu</given-names></name><xref ref-type="aff" rid="a2">2</xref></contrib><contrib contrib-type="author"><name><surname>Ying</surname><given-names>Ming</given-names></name><xref ref-type="aff" rid="a4">4</xref></contrib><contrib contrib-type="author"><name><surname>Bonifas</surname><given-names>Andrew P.</given-names></name><xref ref-type="aff" rid="a4">4</xref></contrib><contrib contrib-type="author"><name><surname>Hwang</surname><given-names>Keh-Chih</given-names></name><xref ref-type="aff" rid="a1">1</xref></contrib><contrib contrib-type="author"><name><surname>Rogers</surname><given-names>John A.</given-names></name><xref ref-type="aff" rid="a4">4</xref><xref ref-type="author-notes" rid="n2">b)</xref></contrib><contrib contrib-type="author"><name><surname>Huang</surname><given-names>Yonggang</given-names></name><xref ref-type="aff" rid="a2">2</xref><xref ref-type="author-notes" rid="n2">b)</xref></contrib><aff id="a1"><label>1</label>Center for Mechanics and Materials, Tsinghua University, Beijing 100084, China</aff><aff id="a2"><label>2</label>Department of Civil and Environmental Engineering, Department of Mechanical Engineering, Center for Engineering and Health and Skin Disease Research Center, Northwestern University, Evanston, IL 60208</aff><aff id="a3"><label>3</label>State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian 116024, China</aff><aff id="a4"><label>4</label>Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA</aff></contrib-group><author-notes><fn id="n1"><label>a)</label><p>Y. Su and R. Li contributed equally to this work.</p></fn><fn id="n2"><label>b)</label><p>Authors to whom correspondence should be addressed. Electronic addresses: <email>y-huang@northwestern.edu</email> and <email>jrogers@illinois.edu</email>.</p></fn></author-notes><pub-date pub-type="ppub"><day>28</day><month>10</month><year>2013</year></pub-date><pub-date pub-type="epub"><day>31</day><month>10</month><year>2013</year></pub-date><volume>114</volume><issue>16</issue><elocation-id>164511</elocation-id><history><date date-type="received"><day>09</day><month>9</month><year>2013</year></date><date date-type="accepted"><day>14</day><month>10</month><year>2013</year></date></history><permissions><copyright-statement>Copyright © 2013 AIP Publishing LLC</copyright-statement><copyright-year>2013</copyright-year><copyright-holder>AIP Publishing LLC</copyright-holder></permissions><abstract><p>Tactile sensors and electrotactile stimulators can provide important links between humans and virtual environments, through the sensation of touch. Soft materials, such as low modulus silicones, are attractive as platforms and support matrices for arrays sensors and actuators that laminate directly onto the fingertips. Analytic models for the mechanics of three dimensional, form-fitting finger cuffs based on such designs are presented here, along with quantitative validation using the finite element method. The results indicate that the maximum strains in the silicone and the embedded devices are inversely proportional to the square root of radius of curvature of the cuff. These and other findings can be useful in formulating designs for these and related classes of body-worn, three dimensional devices.</p></abstract><custom-meta-group><custom-meta><meta-name>CCC information</meta-name><meta-value>0021-8979/2013/114(16)/164511/6/$30.00</meta-value></custom-meta><custom-meta><meta-name>sisac</meta-name><meta-value>0021-8979()114:16L.164511;1</meta-value></custom-meta><custom-meta><meta-name>edcode</meta-name><meta-value>JR13-8179</meta-value></custom-meta><custom-meta><meta-name>aipkey</meta-name><meta-value>1.4828476</meta-value></custom-meta><custom-meta><meta-name>spin</meta-name><meta-value><named-content content-type="el-docanal"><named-content content-type="el-pacs"><named-content content-type="att-pacsyr">2012</named-content><named-content content-type="el-pacscode">0707Df</named-content><named-content content-type="el-pacscode">0270Dh</named-content></named-content></named-content><named-content content-type="el-jouidx"><named-content content-type="el-country">CN</named-content><named-content content-type="el-totalidx">3</named-content><named-content content-type="el-addidx">finite element analysis</named-content><named-content content-type="el-addidx">silicones</named-content><named-content content-type="el-addidx">tactile sensors</named-content></named-content></meta-value></custom-meta></custom-meta-group></article-meta></front></pmc><affiliations><list><country><li>République populaire de Chine</li><li>États-Unis</li></country><region><li>Illinois</li></region><settlement><li>Pékin</li></settlement></list><tree><country name="République populaire de Chine"><noRegion><name sortKey="Su, Yewang" sort="Su, Yewang" uniqKey="Su Y" first="Yewang" last="Su">Yewang Su</name></noRegion><name sortKey="Hwang, Keh Chih" sort="Hwang, Keh Chih" uniqKey="Hwang K" first="Keh-Chih" last="Hwang">Keh-Chih Hwang</name><name sortKey="Li, Rui" sort="Li, Rui" uniqKey="Li R" first="Rui" last="Li">Rui Li</name></country><country name="États-Unis"><region name="Illinois"><name sortKey="Su, Yewang" sort="Su, Yewang" uniqKey="Su Y" first="Yewang" last="Su">Yewang Su</name></region><name sortKey="Bonifas, Andrew P" sort="Bonifas, Andrew P" uniqKey="Bonifas A" first="Andrew P." last="Bonifas">Andrew P. Bonifas</name><name sortKey="Cheng, Huanyu" sort="Cheng, Huanyu" uniqKey="Cheng H" first="Huanyu" last="Cheng">Huanyu Cheng</name><name sortKey="Huang, Yonggang" sort="Huang, Yonggang" uniqKey="Huang Y" first="Yonggang" last="Huang">Yonggang Huang</name><name sortKey="Rogers, John A" sort="Rogers, John A" uniqKey="Rogers J" first="John A." last="Rogers">John A. Rogers</name><name sortKey="Ying, Ming" sort="Ying, Ming" uniqKey="Ying M" first="Ming" last="Ying">Ming Ying</name></country></tree></affiliations></record>Pour manipuler ce document sous Unix (Dilib)
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