Mechanics of finger-tip electronics
Identifieur interne : 002B08 ( Ncbi/Merge ); précédent : 002B07; suivant : 002B09Mechanics of finger-tip electronics
Auteurs : Yewang Su [République populaire de Chine, États-Unis] ; Rui Li [République populaire de Chine] ; Huanyu Cheng [États-Unis] ; Ming Ying [États-Unis] ; Andrew P. Bonifas [États-Unis] ; Keh-Chih Hwang [République populaire de Chine] ; John A. Rogers [États-Unis] ; Yonggang Huang [États-Unis]Source :
- Journal of Applied Physics [ 0021-8979 ] ; 2013.
Abstract
Tactile sensors and electrotactile stimulators can provide important links between humans and virtual environments, through the sensation of touch. Soft materials, such as low modulus silicones, are attractive as platforms and support matrices for arrays sensors and actuators that laminate directly onto the fingertips. Analytic models for the mechanics of three dimensional, form-fitting finger cuffs based on such designs are presented here, along with quantitative validation using the finite element method. The results indicate that the maximum strains in the silicone and the embedded devices are inversely proportional to the square root of radius of curvature of the cuff. These and other findings can be useful in formulating designs for these and related classes of body-worn, three dimensional devices.
Url:
DOI: 10.1063/1.4828476
PubMed: 24273338
PubMed Central: 3829916
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<front><div type="abstract" xml:lang="en"><p>Tactile sensors and electrotactile stimulators can provide important links between humans and virtual environments, through the sensation of touch. Soft materials, such as low modulus silicones, are attractive as platforms and support matrices for arrays sensors and actuators that laminate directly onto the fingertips. Analytic models for the mechanics of three dimensional, form-fitting finger cuffs based on such designs are presented here, along with quantitative validation using the finite element method. The results indicate that the maximum strains in the silicone and the embedded devices are inversely proportional to the square root of radius of curvature of the cuff. These and other findings can be useful in formulating designs for these and related classes of body-worn, three dimensional devices.</p>
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Center for Mechanics and Materials, Tsinghua University, Beijing 100084, China</aff>
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Department of Civil and Environmental Engineering, Department of Mechanical Engineering, Center for Engineering and Health and Skin Disease Research Center, Northwestern University, Evanston, IL 60208</aff>
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State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian 116024, China</aff>
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Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA</aff>
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<p>Authors to whom correspondence should be addressed. Electronic addresses: <email>y-huang@northwestern.edu</email>
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<abstract><p>Tactile sensors and electrotactile stimulators can provide important links between humans and virtual environments, through the sensation of touch. Soft materials, such as low modulus silicones, are attractive as platforms and support matrices for arrays sensors and actuators that laminate directly onto the fingertips. Analytic models for the mechanics of three dimensional, form-fitting finger cuffs based on such designs are presented here, along with quantitative validation using the finite element method. The results indicate that the maximum strains in the silicone and the embedded devices are inversely proportional to the square root of radius of curvature of the cuff. These and other findings can be useful in formulating designs for these and related classes of body-worn, three dimensional devices.</p>
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