HapticV1, Ncbi, Curation, bibRecord, 002B08

Mechanics of finger-tip electronics

Identifieur interne : 002B08 ( Ncbi/Curation ); précédent : 002B07; suivant : 002B09

Mechanics of finger-tip electronics

Auteurs : Yewang Su [République populaire de Chine, États-Unis] ; Rui Li [République populaire de Chine] ; Huanyu Cheng [États-Unis] ; Ming Ying [États-Unis] ; Andrew P. Bonifas [États-Unis] ; Keh-Chih Hwang [République populaire de Chine] ; John A. Rogers [États-Unis] ; Yonggang Huang [États-Unis]

Source :

Journal of Applied Physics [ 0021-8979 ] ; 2013.

RBID : PMC:3829916

Abstract

Tactile sensors and electrotactile stimulators can provide important links between humans and virtual environments, through the sensation of touch. Soft materials, such as low modulus silicones, are attractive as platforms and support matrices for arrays sensors and actuators that laminate directly onto the fingertips. Analytic models for the mechanics of three dimensional, form-fitting finger cuffs based on such designs are presented here, along with quantitative validation using the finite element method. The results indicate that the maximum strains in the silicone and the embedded devices are inversely proportional to the square root of radius of curvature of the cuff. These and other findings can be useful in formulating designs for these and related classes of body-worn, three dimensional devices.

Url:

http://www.ncbi.nlm.nih.gov/pmc/articles/PMC3829916

DOI: 10.1063/1.4828476
PubMed: 24273338
PubMed Central: 3829916

Links toward previous steps (curation, corpus...)

to stream Pmc, to step Corpus: Pour aller vers cette notice dans l'étape Curation :000619
to stream Pmc, to step Curation: Pour aller vers cette notice dans l'étape Curation :000619
to stream Pmc, to step Checkpoint: Pour aller vers cette notice dans l'étape Curation :001157
to stream Ncbi, to step Merge: Pour aller vers cette notice dans l'étape Curation :002B08

Links to Exploration step

PMC:3829916

Le document en format XML

<record><TEI><teiHeader><fileDesc><titleStmt><title xml:lang="en">Mechanics of finger-tip electronics</title>
<author><name sortKey="Su, Yewang" sort="Su, Yewang" uniqKey="Su Y" first="Yewang" last="Su">Yewang Su</name>
<affiliation wicri:level="1"><nlm:aff id="a1">Center for Mechanics and Materials, Tsinghua University, Beijing 100084, China</nlm:aff>
<country xml:lang="fr">République populaire de Chine</country>
<wicri:regionArea>Center for Mechanics and Materials, Tsinghua University, Beijing 100084</wicri:regionArea>
<placeName><settlement type="city">Pékin</settlement>
</placeName>
</affiliation>
<affiliation wicri:level="2"><nlm:aff id="a2">Department of Civil and Environmental Engineering, Department of Mechanical Engineering, Center for Engineering and Health and Skin Disease Research Center, Northwestern University, Evanston, IL 60208</nlm:aff>
<country xml:lang="fr">États-Unis</country>
<placeName><region type="state">Illinois</region>
</placeName>
<wicri:cityArea>Department of Civil and Environmental Engineering, Department of Mechanical Engineering, Center for Engineering and Health and Skin Disease Research Center, Northwestern University, Evanston</wicri:cityArea>
</affiliation>
</author>
<author><name sortKey="Li, Rui" sort="Li, Rui" uniqKey="Li R" first="Rui" last="Li">Rui Li</name>
<affiliation wicri:level="1"><nlm:aff id="a3">State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian 116024, China</nlm:aff>
<country xml:lang="fr">République populaire de Chine</country>
<wicri:regionArea>State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian 116024</wicri:regionArea>
<wicri:noRegion>Dalian 116024</wicri:noRegion>
</affiliation>
</author>
<author><name sortKey="Cheng, Huanyu" sort="Cheng, Huanyu" uniqKey="Cheng H" first="Huanyu" last="Cheng">Huanyu Cheng</name>
<affiliation wicri:level="2"><nlm:aff id="a2">Department of Civil and Environmental Engineering, Department of Mechanical Engineering, Center for Engineering and Health and Skin Disease Research Center, Northwestern University, Evanston, IL 60208</nlm:aff>
<country xml:lang="fr">États-Unis</country>
<placeName><region type="state">Illinois</region>
</placeName>
<wicri:cityArea>Department of Civil and Environmental Engineering, Department of Mechanical Engineering, Center for Engineering and Health and Skin Disease Research Center, Northwestern University, Evanston</wicri:cityArea>
</affiliation>
</author>
<author><name sortKey="Ying, Ming" sort="Ying, Ming" uniqKey="Ying M" first="Ming" last="Ying">Ming Ying</name>
<affiliation wicri:level="2"><nlm:aff id="a4">Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA</nlm:aff>
<country xml:lang="fr">États-Unis</country>
<wicri:regionArea>Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801</wicri:regionArea>
<placeName><region type="state">Illinois</region>
</placeName>
</affiliation>
</author>
<author><name sortKey="Bonifas, Andrew P" sort="Bonifas, Andrew P" uniqKey="Bonifas A" first="Andrew P." last="Bonifas">Andrew P. Bonifas</name>
<affiliation wicri:level="2"><nlm:aff id="a4">Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA</nlm:aff>
<country xml:lang="fr">États-Unis</country>
<wicri:regionArea>Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801</wicri:regionArea>
<placeName><region type="state">Illinois</region>
</placeName>
</affiliation>
</author>
<author><name sortKey="Hwang, Keh Chih" sort="Hwang, Keh Chih" uniqKey="Hwang K" first="Keh-Chih" last="Hwang">Keh-Chih Hwang</name>
<affiliation wicri:level="1"><nlm:aff id="a1">Center for Mechanics and Materials, Tsinghua University, Beijing 100084, China</nlm:aff>
<country xml:lang="fr">République populaire de Chine</country>
<wicri:regionArea>Center for Mechanics and Materials, Tsinghua University, Beijing 100084</wicri:regionArea>
<placeName><settlement type="city">Pékin</settlement>
</placeName>
</affiliation>
</author>
<author><name sortKey="Rogers, John A" sort="Rogers, John A" uniqKey="Rogers J" first="John A." last="Rogers">John A. Rogers</name>
<affiliation wicri:level="2"><nlm:aff id="a4">Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA</nlm:aff>
<country xml:lang="fr">États-Unis</country>
<wicri:regionArea>Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801</wicri:regionArea>
<placeName><region type="state">Illinois</region>
</placeName>
</affiliation>
</author>
<author><name sortKey="Huang, Yonggang" sort="Huang, Yonggang" uniqKey="Huang Y" first="Yonggang" last="Huang">Yonggang Huang</name>
<affiliation wicri:level="2"><nlm:aff id="a2">Department of Civil and Environmental Engineering, Department of Mechanical Engineering, Center for Engineering and Health and Skin Disease Research Center, Northwestern University, Evanston, IL 60208</nlm:aff>
<country xml:lang="fr">États-Unis</country>
<placeName><region type="state">Illinois</region>
</placeName>
<wicri:cityArea>Department of Civil and Environmental Engineering, Department of Mechanical Engineering, Center for Engineering and Health and Skin Disease Research Center, Northwestern University, Evanston</wicri:cityArea>
</affiliation>
</author>
</titleStmt>
<publicationStmt><idno type="wicri:source">PMC</idno>
<idno type="pmid">24273338</idno>
<idno type="pmc">3829916</idno>
<idno type="url">http://www.ncbi.nlm.nih.gov/pmc/articles/PMC3829916</idno>
<idno type="RBID">PMC:3829916</idno>
<idno type="doi">10.1063/1.4828476</idno>
<date when="2013">2013</date>
<idno type="wicri:Area/Pmc/Corpus">000619</idno>
<idno type="wicri:Area/Pmc/Curation">000619</idno>
<idno type="wicri:Area/Pmc/Checkpoint">001157</idno>
<idno type="wicri:Area/Ncbi/Merge">002B08</idno>
<idno type="wicri:Area/Ncbi/Curation">002B08</idno>
</publicationStmt>
<sourceDesc><biblStruct><analytic><title xml:lang="en" level="a" type="main">Mechanics of finger-tip electronics</title>
<author><name sortKey="Su, Yewang" sort="Su, Yewang" uniqKey="Su Y" first="Yewang" last="Su">Yewang Su</name>
<affiliation wicri:level="1"><nlm:aff id="a1">Center for Mechanics and Materials, Tsinghua University, Beijing 100084, China</nlm:aff>
<country xml:lang="fr">République populaire de Chine</country>
<wicri:regionArea>Center for Mechanics and Materials, Tsinghua University, Beijing 100084</wicri:regionArea>
<placeName><settlement type="city">Pékin</settlement>
</placeName>
</affiliation>
<affiliation wicri:level="2"><nlm:aff id="a2">Department of Civil and Environmental Engineering, Department of Mechanical Engineering, Center for Engineering and Health and Skin Disease Research Center, Northwestern University, Evanston, IL 60208</nlm:aff>
<country xml:lang="fr">États-Unis</country>
<placeName><region type="state">Illinois</region>
</placeName>
<wicri:cityArea>Department of Civil and Environmental Engineering, Department of Mechanical Engineering, Center for Engineering and Health and Skin Disease Research Center, Northwestern University, Evanston</wicri:cityArea>
</affiliation>
</author>
<author><name sortKey="Li, Rui" sort="Li, Rui" uniqKey="Li R" first="Rui" last="Li">Rui Li</name>
<affiliation wicri:level="1"><nlm:aff id="a3">State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian 116024, China</nlm:aff>
<country xml:lang="fr">République populaire de Chine</country>
<wicri:regionArea>State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian 116024</wicri:regionArea>
<wicri:noRegion>Dalian 116024</wicri:noRegion>
</affiliation>
</author>
<author><name sortKey="Cheng, Huanyu" sort="Cheng, Huanyu" uniqKey="Cheng H" first="Huanyu" last="Cheng">Huanyu Cheng</name>
<affiliation wicri:level="2"><nlm:aff id="a2">Department of Civil and Environmental Engineering, Department of Mechanical Engineering, Center for Engineering and Health and Skin Disease Research Center, Northwestern University, Evanston, IL 60208</nlm:aff>
<country xml:lang="fr">États-Unis</country>
<placeName><region type="state">Illinois</region>
</placeName>
<wicri:cityArea>Department of Civil and Environmental Engineering, Department of Mechanical Engineering, Center for Engineering and Health and Skin Disease Research Center, Northwestern University, Evanston</wicri:cityArea>
</affiliation>
</author>
<author><name sortKey="Ying, Ming" sort="Ying, Ming" uniqKey="Ying M" first="Ming" last="Ying">Ming Ying</name>
<affiliation wicri:level="2"><nlm:aff id="a4">Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA</nlm:aff>
<country xml:lang="fr">États-Unis</country>
<wicri:regionArea>Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801</wicri:regionArea>
<placeName><region type="state">Illinois</region>
</placeName>
</affiliation>
</author>
<author><name sortKey="Bonifas, Andrew P" sort="Bonifas, Andrew P" uniqKey="Bonifas A" first="Andrew P." last="Bonifas">Andrew P. Bonifas</name>
<affiliation wicri:level="2"><nlm:aff id="a4">Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA</nlm:aff>
<country xml:lang="fr">États-Unis</country>
<wicri:regionArea>Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801</wicri:regionArea>
<placeName><region type="state">Illinois</region>
</placeName>
</affiliation>
</author>
<author><name sortKey="Hwang, Keh Chih" sort="Hwang, Keh Chih" uniqKey="Hwang K" first="Keh-Chih" last="Hwang">Keh-Chih Hwang</name>
<affiliation wicri:level="1"><nlm:aff id="a1">Center for Mechanics and Materials, Tsinghua University, Beijing 100084, China</nlm:aff>
<country xml:lang="fr">République populaire de Chine</country>
<wicri:regionArea>Center for Mechanics and Materials, Tsinghua University, Beijing 100084</wicri:regionArea>
<placeName><settlement type="city">Pékin</settlement>
</placeName>
</affiliation>
</author>
<author><name sortKey="Rogers, John A" sort="Rogers, John A" uniqKey="Rogers J" first="John A." last="Rogers">John A. Rogers</name>
<affiliation wicri:level="2"><nlm:aff id="a4">Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA</nlm:aff>
<country xml:lang="fr">États-Unis</country>
<wicri:regionArea>Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801</wicri:regionArea>
<placeName><region type="state">Illinois</region>
</placeName>
</affiliation>
</author>
<author><name sortKey="Huang, Yonggang" sort="Huang, Yonggang" uniqKey="Huang Y" first="Yonggang" last="Huang">Yonggang Huang</name>
<affiliation wicri:level="2"><nlm:aff id="a2">Department of Civil and Environmental Engineering, Department of Mechanical Engineering, Center for Engineering and Health and Skin Disease Research Center, Northwestern University, Evanston, IL 60208</nlm:aff>
<country xml:lang="fr">États-Unis</country>
<placeName><region type="state">Illinois</region>
</placeName>
<wicri:cityArea>Department of Civil and Environmental Engineering, Department of Mechanical Engineering, Center for Engineering and Health and Skin Disease Research Center, Northwestern University, Evanston</wicri:cityArea>
</affiliation>
</author>
</analytic>
<series><title level="j">Journal of Applied Physics</title>
<idno type="ISSN">0021-8979</idno>
<idno type="eISSN">0021-8979</idno>
<imprint><date when="2013">2013</date>
</imprint>
</series>
</biblStruct>
</sourceDesc>
</fileDesc>
<profileDesc><textClass></textClass>
</profileDesc>
</teiHeader>
<front><div type="abstract" xml:lang="en"><p>Tactile sensors and electrotactile stimulators can provide important links between humans and virtual environments, through the sensation of touch. Soft materials, such as low modulus silicones, are attractive as platforms and support matrices for arrays sensors and actuators that laminate directly onto the fingertips. Analytic models for the mechanics of three dimensional, form-fitting finger cuffs based on such designs are presented here, along with quantitative validation using the finite element method. The results indicate that the maximum strains in the silicone and the embedded devices are inversely proportional to the square root of radius of curvature of the cuff. These and other findings can be useful in formulating designs for these and related classes of body-worn, three dimensional devices.</p>
</div>
</front>
</TEI>
</record>

Pour manipuler ce document sous Unix (Dilib)

EXPLOR_STEP=$WICRI_ROOT/Ticri/CIDE/explor/HapticV1/Data/Ncbi/Curation

HfdSelect -h $EXPLOR_STEP/biblio.hfd -nk 002B08 | SxmlIndent | more

HfdSelect -h $EXPLOR_AREA/Data/Ncbi/Curation/biblio.hfd -nk 002B08 | SxmlIndent | more

Pour mettre un lien sur cette page dans le réseau Wicri

{{Explor lien
   |wiki=    Ticri/CIDE
   |area=    HapticV1
   |flux=    Ncbi
   |étape=   Curation
   |type=    RBID
   |clé=     PMC:3829916
   |texte=   Mechanics of finger-tip electronics
}}

Pour générer des pages wiki

HfdIndexSelect -h $EXPLOR_AREA/Data/Ncbi/Curation/RBID.i   -Sk "pubmed:24273338" \
       | HfdSelect -Kh $EXPLOR_AREA/Data/Ncbi/Curation/biblio.hfd   \
       | NlmPubMed2Wicri -a HapticV1

This area was generated with Dilib version V0.6.23.
Data generation: Mon Jun 13 01:09:46 2016. Site generation: Wed Mar 6 09:54:07 2024

	Serveur d'exploration sur les dispositifs haptiques
	Attention, ce site est en cours de développement ! Attention, site généré par des moyens informatiques à partir de corpus bruts. Les informations ne sont donc pas validées.

Serveur d'exploration sur les dispositifs haptiques

Mechanics of finger-tip electronics

Mechanics of finger-tip electronics

Source :

Abstract

Links toward previous steps (curation, corpus...)

Links to Exploration step

Le document en format XML

Pour manipuler ce document sous Unix (Dilib)

Pour mettre un lien sur cette page dans le réseau Wicri

Pour générer des pages wiki