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Hydrogen interaction on metal/hydrogenated amorphous silicon schottky structures: adsorption/desorption effects

Identifieur interne : 000412 ( PascalFrancis/Corpus ); précédent : 000411; suivant : 000413

Hydrogen interaction on metal/hydrogenated amorphous silicon schottky structures: adsorption/desorption effects

Auteurs : K. Laïhem ; R. Cherfi ; M. Aoucher

Source :

RBID : Pascal:01-0325373

Descripteurs français

English descriptors

Abstract

In this work we study metal/hydrogenated amorphous silicon structures (metal/a-Si:H). The a-Si:H is deposited at a high rate by DC magnetron sputtering on N-type doped silicon substrate. The metal is deposited by DC sputtering on the a-Si:H. Nickel, magnesium and platinum are used. The current-voltage (I-V) curves show a rectifying contact. The hydrogen is injected in the vacuum chamber at low pressure (1 mbar) to interact with the metal/a-Si:H structure. The interaction effect is observed on the I-V characteristics and on the complex impedance behavior. These effects may be explained by a thermal activation of hydrogen adsorption/desorption phenomena which is localized in the interfacial zone. The hydrogen is chemisorbed in the interfacial zone and modifies its electrical charge.

Notice en format standard (ISO 2709)

Pour connaître la documentation sur le format Inist Standard.

pA  
A01 01  1    @0 0040-6090
A02 01      @0 THSFAP
A03   1    @0 Thin solid films
A05       @2 383
A06       @2 1-2
A08 01  1  ENG  @1 Hydrogen interaction on metal/hydrogenated amorphous silicon schottky structures: adsorption/desorption effects
A09 01  1  ENG  @1 Proceedings of Symposium O on Thin Film Materials for Large Area Electronics of the E-MRS 2000 Spring Conference, Strasbourg, France, May 30-June 2, 2000
A11 01  1    @1 LAÏHEM (K.)
A11 02  1    @1 CHERFI (R.)
A11 03  1    @1 AOUCHER (M.)
A12 01  1    @1 EQUER (Bernard) @9 ed.
A12 02  1    @1 ROCA I CABARROCAS (Pere) @9 ed.
A12 03  1    @1 FORTUNATO (G.) @9 ed.
A12 04  1    @1 ROBERTSON (J.) @9 ed.
A12 05  1    @1 BUERKLE (R.) @9 ed.
A14 01      @1 Laboratoire des Couches Minces et des Semiconducteurs, Institut de Physique, USTHB, BP 32 El Alia @2 16111 Bab-Ezzouar, Alger @3 DZA @Z 1 aut. @Z 2 aut. @Z 3 aut.
A15 01      @1 LPICM, Ecole Polytechnique @2 91128 Palaiseau @3 FRA @Z 1 aut. @Z 2 aut.
A18 01  1    @1 European Material Research Society @3 EUR @9 patr.
A20       @1 264-266
A21       @1 2001
A23 01      @0 ENG
A43 01      @1 INIST @2 13597 @5 354000098676400660
A44       @0 0000 @1 © 2001 INIST-CNRS. All rights reserved.
A45       @0 11 ref.
A47 01  1    @0 01-0325373
A60       @1 P @2 C
A61       @0 A
A64 01  1    @0 Thin solid films
A66 01      @0 CHE
C01 01    ENG  @0 In this work we study metal/hydrogenated amorphous silicon structures (metal/a-Si:H). The a-Si:H is deposited at a high rate by DC magnetron sputtering on N-type doped silicon substrate. The metal is deposited by DC sputtering on the a-Si:H. Nickel, magnesium and platinum are used. The current-voltage (I-V) curves show a rectifying contact. The hydrogen is injected in the vacuum chamber at low pressure (1 mbar) to interact with the metal/a-Si:H structure. The interaction effect is observed on the I-V characteristics and on the complex impedance behavior. These effects may be explained by a thermal activation of hydrogen adsorption/desorption phenomena which is localized in the interfacial zone. The hydrogen is chemisorbed in the interfacial zone and modifies its electrical charge.
C02 01  3    @0 001B70C30
C02 02  3    @0 001B70C40E
C03 01  3  FRE  @0 Etude expérimentale @5 01
C03 01  3  ENG  @0 Experimental study @5 01
C03 02  3  FRE  @0 Contact métal semiconducteur @5 02
C03 02  3  ENG  @0 Metal-semiconductor contacts @5 02
C03 03  3  FRE  @0 Caractéristique courant tension @5 03
C03 03  3  ENG  @0 IV characteristic @5 03
C03 04  3  FRE  @0 Effet redresseur @5 04
C03 04  3  ENG  @0 Rectification @5 04
C03 05  3  FRE  @0 Matériau amorphe hydrogéné @5 05
C03 05  3  ENG  @0 Amorphous hydrogenated material @5 05
C03 06  3  FRE  @0 Nickel @2 NC @5 06
C03 06  3  ENG  @0 Nickel @2 NC @5 06
C03 07  3  FRE  @0 Magnésium @2 NC @5 07
C03 07  3  ENG  @0 Magnesium @2 NC @5 07
C03 08  3  FRE  @0 Platine @2 NC @5 08
C03 08  3  ENG  @0 Platinum @2 NC @5 08
C03 09  3  FRE  @0 Diode barrière Schottky @5 09
C03 09  3  ENG  @0 Schottky barrier diodes @5 09
C03 10  3  FRE  @0 Adsorption @5 10
C03 10  3  ENG  @0 Adsorption @5 10
C03 11  3  FRE  @0 Désorption @5 11
C03 11  3  ENG  @0 Desorption @5 11
C03 12  3  FRE  @0 Hydrogène @2 NC @5 12
C03 12  3  ENG  @0 Hydrogen @2 NC @5 12
C03 13  3  FRE  @0 7330 @2 PAC @4 INC @5 56
C03 14  3  FRE  @0 7340E @2 PAC @4 INC @5 57
C03 15  3  FRE  @0 Ni @4 INC @5 92
C03 16  3  FRE  @0 Mg @4 INC @5 93
C03 17  3  FRE  @0 Pt @4 INC @5 94
C03 18  3  FRE  @0 a-Si:H @4 INC @5 95
C07 01  3  FRE  @0 Métal transition @5 16
C07 01  3  ENG  @0 Transition elements @5 16
N21       @1 225
pR  
A30 01  1  ENG  @1 Symposium on Thin Films for Large Area Electronics (LAE) @2 3 @3 Strasbourg FRA @4 2000-06

Format Inist (serveur)

NO : PASCAL 01-0325373 INIST
ET : Hydrogen interaction on metal/hydrogenated amorphous silicon schottky structures: adsorption/desorption effects
AU : LAÏHEM (K.); CHERFI (R.); AOUCHER (M.); EQUER (Bernard); ROCA I CABARROCAS (Pere); FORTUNATO (G.); ROBERTSON (J.); BUERKLE (R.)
AF : Laboratoire des Couches Minces et des Semiconducteurs, Institut de Physique, USTHB, BP 32 El Alia/16111 Bab-Ezzouar, Alger/Algérie (1 aut., 2 aut., 3 aut.); LPICM, Ecole Polytechnique/91128 Palaiseau/France (1 aut., 2 aut.)
DT : Publication en série; Congrès; Niveau analytique
SO : Thin solid films; ISSN 0040-6090; Coden THSFAP; Suisse; Da. 2001; Vol. 383; No. 1-2; Pp. 264-266; Bibl. 11 ref.
LA : Anglais
EA : In this work we study metal/hydrogenated amorphous silicon structures (metal/a-Si:H). The a-Si:H is deposited at a high rate by DC magnetron sputtering on N-type doped silicon substrate. The metal is deposited by DC sputtering on the a-Si:H. Nickel, magnesium and platinum are used. The current-voltage (I-V) curves show a rectifying contact. The hydrogen is injected in the vacuum chamber at low pressure (1 mbar) to interact with the metal/a-Si:H structure. The interaction effect is observed on the I-V characteristics and on the complex impedance behavior. These effects may be explained by a thermal activation of hydrogen adsorption/desorption phenomena which is localized in the interfacial zone. The hydrogen is chemisorbed in the interfacial zone and modifies its electrical charge.
CC : 001B70C30; 001B70C40E
FD : Etude expérimentale; Contact métal semiconducteur; Caractéristique courant tension; Effet redresseur; Matériau amorphe hydrogéné; Nickel; Magnésium; Platine; Diode barrière Schottky; Adsorption; Désorption; Hydrogène; 7330; 7340E; Ni; Mg; Pt; a-Si:H
FG : Métal transition
ED : Experimental study; Metal-semiconductor contacts; IV characteristic; Rectification; Amorphous hydrogenated material; Nickel; Magnesium; Platinum; Schottky barrier diodes; Adsorption; Desorption; Hydrogen
EG : Transition elements
LO : INIST-13597.354000098676400660
ID : 01-0325373

Links to Exploration step

Pascal:01-0325373

Le document en format XML

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<term>IV characteristic</term>
<term>Magnesium</term>
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<div type="abstract" xml:lang="en">In this work we study metal/hydrogenated amorphous silicon structures (metal/a-Si:H). The a-Si:H is deposited at a high rate by DC magnetron sputtering on N-type doped silicon substrate. The metal is deposited by DC sputtering on the a-Si:H. Nickel, magnesium and platinum are used. The current-voltage (I-V) curves show a rectifying contact. The hydrogen is injected in the vacuum chamber at low pressure (1 mbar) to interact with the metal/a-Si:H structure. The interaction effect is observed on the I-V characteristics and on the complex impedance behavior. These effects may be explained by a thermal activation of hydrogen adsorption/desorption phenomena which is localized in the interfacial zone. The hydrogen is chemisorbed in the interfacial zone and modifies its electrical charge.</div>
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<s0>In this work we study metal/hydrogenated amorphous silicon structures (metal/a-Si:H). The a-Si:H is deposited at a high rate by DC magnetron sputtering on N-type doped silicon substrate. The metal is deposited by DC sputtering on the a-Si:H. Nickel, magnesium and platinum are used. The current-voltage (I-V) curves show a rectifying contact. The hydrogen is injected in the vacuum chamber at low pressure (1 mbar) to interact with the metal/a-Si:H structure. The interaction effect is observed on the I-V characteristics and on the complex impedance behavior. These effects may be explained by a thermal activation of hydrogen adsorption/desorption phenomena which is localized in the interfacial zone. The hydrogen is chemisorbed in the interfacial zone and modifies its electrical charge.</s0>
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<s5>04</s5>
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<s5>04</s5>
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<s0>Nickel</s0>
<s2>NC</s2>
<s5>06</s5>
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<s0>Magnésium</s0>
<s2>NC</s2>
<s5>07</s5>
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<s0>Magnesium</s0>
<s2>NC</s2>
<s5>07</s5>
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<s0>Platine</s0>
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<s5>08</s5>
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<s0>Diode barrière Schottky</s0>
<s5>09</s5>
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<fC03 i1="09" i2="3" l="ENG">
<s0>Schottky barrier diodes</s0>
<s5>09</s5>
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<fC03 i1="10" i2="3" l="FRE">
<s0>Adsorption</s0>
<s5>10</s5>
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<s0>Adsorption</s0>
<s5>10</s5>
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<fC03 i1="11" i2="3" l="FRE">
<s0>Désorption</s0>
<s5>11</s5>
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<s0>Desorption</s0>
<s5>11</s5>
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<s0>Hydrogène</s0>
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<s0>7330</s0>
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<s0>7340E</s0>
<s2>PAC</s2>
<s4>INC</s4>
<s5>57</s5>
</fC03>
<fC03 i1="15" i2="3" l="FRE">
<s0>Ni</s0>
<s4>INC</s4>
<s5>92</s5>
</fC03>
<fC03 i1="16" i2="3" l="FRE">
<s0>Mg</s0>
<s4>INC</s4>
<s5>93</s5>
</fC03>
<fC03 i1="17" i2="3" l="FRE">
<s0>Pt</s0>
<s4>INC</s4>
<s5>94</s5>
</fC03>
<fC03 i1="18" i2="3" l="FRE">
<s0>a-Si:H</s0>
<s4>INC</s4>
<s5>95</s5>
</fC03>
<fC07 i1="01" i2="3" l="FRE">
<s0>Métal transition</s0>
<s5>16</s5>
</fC07>
<fC07 i1="01" i2="3" l="ENG">
<s0>Transition elements</s0>
<s5>16</s5>
</fC07>
<fN21>
<s1>225</s1>
</fN21>
</pA>
<pR>
<fA30 i1="01" i2="1" l="ENG">
<s1>Symposium on Thin Films for Large Area Electronics (LAE)</s1>
<s2>3</s2>
<s3>Strasbourg FRA</s3>
<s4>2000-06</s4>
</fA30>
</pR>
</standard>
<server>
<NO>PASCAL 01-0325373 INIST</NO>
<ET>Hydrogen interaction on metal/hydrogenated amorphous silicon schottky structures: adsorption/desorption effects</ET>
<AU>LAÏHEM (K.); CHERFI (R.); AOUCHER (M.); EQUER (Bernard); ROCA I CABARROCAS (Pere); FORTUNATO (G.); ROBERTSON (J.); BUERKLE (R.)</AU>
<AF>Laboratoire des Couches Minces et des Semiconducteurs, Institut de Physique, USTHB, BP 32 El Alia/16111 Bab-Ezzouar, Alger/Algérie (1 aut., 2 aut., 3 aut.); LPICM, Ecole Polytechnique/91128 Palaiseau/France (1 aut., 2 aut.)</AF>
<DT>Publication en série; Congrès; Niveau analytique</DT>
<SO>Thin solid films; ISSN 0040-6090; Coden THSFAP; Suisse; Da. 2001; Vol. 383; No. 1-2; Pp. 264-266; Bibl. 11 ref.</SO>
<LA>Anglais</LA>
<EA>In this work we study metal/hydrogenated amorphous silicon structures (metal/a-Si:H). The a-Si:H is deposited at a high rate by DC magnetron sputtering on N-type doped silicon substrate. The metal is deposited by DC sputtering on the a-Si:H. Nickel, magnesium and platinum are used. The current-voltage (I-V) curves show a rectifying contact. The hydrogen is injected in the vacuum chamber at low pressure (1 mbar) to interact with the metal/a-Si:H structure. The interaction effect is observed on the I-V characteristics and on the complex impedance behavior. These effects may be explained by a thermal activation of hydrogen adsorption/desorption phenomena which is localized in the interfacial zone. The hydrogen is chemisorbed in the interfacial zone and modifies its electrical charge.</EA>
<CC>001B70C30; 001B70C40E</CC>
<FD>Etude expérimentale; Contact métal semiconducteur; Caractéristique courant tension; Effet redresseur; Matériau amorphe hydrogéné; Nickel; Magnésium; Platine; Diode barrière Schottky; Adsorption; Désorption; Hydrogène; 7330; 7340E; Ni; Mg; Pt; a-Si:H</FD>
<FG>Métal transition</FG>
<ED>Experimental study; Metal-semiconductor contacts; IV characteristic; Rectification; Amorphous hydrogenated material; Nickel; Magnesium; Platinum; Schottky barrier diodes; Adsorption; Desorption; Hydrogen</ED>
<EG>Transition elements</EG>
<LO>INIST-13597.354000098676400660</LO>
<ID>01-0325373</ID>
</server>
</inist>
</record>

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