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Serveur d'exploration sur l'Indium - Analysis (Chine)

Index « Keywords » - entrée « Flip chip bonding »
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Flexible structure < Flip chip bonding < Flip-chip  Facettes :

List of bibliographic references

Number of relevant bibliographic references: 4.
Ident.Authors (with country if any)Title
000436 (2012) Preparation of Sn-Ag-In Solder Bumps by Electroplating of Sn-Ag and Indium in Sequence and the Effect of Indium Addition on Microstructure and Shear Strength
000480 (2012) Liquid-solid interfacial reactions of Sn-Ag and Sn-Ag-In solders with Cu under bump metallization : Lead-free solder and packaging
000560 (2012) Electrical, spectral and optical performance of yellow-green and amber micro-pixelated InGaN light-emitting diodes
000C10 (2010) Development of indium bumping technology through AZ9260 resist electroplating

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