Density of states-based design of metal oxide thin-film transistors for high mobility and superior photostability.
Identifieur interne : 000F17 ( Main/Exploration ); précédent : 000F16; suivant : 000F18Density of states-based design of metal oxide thin-film transistors for high mobility and superior photostability.
Auteurs : RBID : pubmed:22957907Abstract
A novel method to design metal oxide thin-film transistor (TFT) devices with high performance and high photostability for next-generation flat-panel displays is reported. Here, we developed bilayer metal oxide TFTs, where the front channel consists of indium-zinc-oxide (IZO) and the back channel material on top of it is hafnium-indium-zinc-oxide (HIZO). Density-of-states (DOS)-based modeling and device simulation were performed in order to determine the optimum thickness ratio within the IZO/HIZO stack that results in the best balance between device performance and stability. As a result, respective values of 5 and 40 nm for the IZO and HIZO layers were determined. The TFT devices that were fabricated accordingly exhibited mobility values up to 48 cm(2)/(V s), which is much elevated compared to pure HIZO TFTs (∼13 cm(2)/(V s)) but comparable to pure IZO TFTs (∼59 cm(2)/(V s)). Also, the stability of the bilayer device (-1.18 V) was significantly enhanced compared to the pure IZO device (-9.08 V). Our methodology based on the subgap DOS model and simulation provides an effective way to enhance the device stability while retaining a relatively high mobility, which makes the corresponding devices suitable for ultradefinition, large-area, and high-frame-rate display applications.
DOI: 10.1021/am301342x
PubMed: 22957907
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<author><name sortKey="Kim, Hyun Suk" uniqKey="Kim H">Hyun-Suk Kim</name>
<affiliation wicri:level="1"><nlm:affiliation>Display Device Lab, Samsung Advanced Institute of Technology, Yongin, 446-712, Republic of Korea.</nlm:affiliation>
<country xml:lang="fr">Corée du Sud</country>
<wicri:regionArea>Display Device Lab, Samsung Advanced Institute of Technology, Yongin, 446-712</wicri:regionArea>
</affiliation>
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<author><name sortKey="Park, Joon Seok" uniqKey="Park J">Joon Seok Park</name>
</author>
<author><name sortKey="Jeong, Hyun Kwang" uniqKey="Jeong H">Hyun-Kwang Jeong</name>
</author>
<author><name sortKey="Son, Kyoung Seok" uniqKey="Son K">Kyoung Seok Son</name>
</author>
<author><name sortKey="Kim, Tae Sang" uniqKey="Kim T">Tae Sang Kim</name>
</author>
<author><name sortKey="Seon, Jong Baek" uniqKey="Seon J">Jong-Baek Seon</name>
</author>
<author><name sortKey="Lee, Eunha" uniqKey="Lee E">Eunha Lee</name>
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<author><name sortKey="Chung, Jae Gwan" uniqKey="Chung J">Jae Gwan Chung</name>
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<author><name sortKey="Kim, Dae Hwan" uniqKey="Kim D">Dae Hwan Kim</name>
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<author><name sortKey="Ryu, Myungkwan" uniqKey="Ryu M">Myungkwan Ryu</name>
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<author><name sortKey="Lee, Sang Yoon" uniqKey="Lee S">Sang Yoon Lee</name>
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<front><div type="abstract" xml:lang="en">A novel method to design metal oxide thin-film transistor (TFT) devices with high performance and high photostability for next-generation flat-panel displays is reported. Here, we developed bilayer metal oxide TFTs, where the front channel consists of indium-zinc-oxide (IZO) and the back channel material on top of it is hafnium-indium-zinc-oxide (HIZO). Density-of-states (DOS)-based modeling and device simulation were performed in order to determine the optimum thickness ratio within the IZO/HIZO stack that results in the best balance between device performance and stability. As a result, respective values of 5 and 40 nm for the IZO and HIZO layers were determined. The TFT devices that were fabricated accordingly exhibited mobility values up to 48 cm(2)/(V s), which is much elevated compared to pure HIZO TFTs (∼13 cm(2)/(V s)) but comparable to pure IZO TFTs (∼59 cm(2)/(V s)). Also, the stability of the bilayer device (-1.18 V) was significantly enhanced compared to the pure IZO device (-9.08 V). Our methodology based on the subgap DOS model and simulation provides an effective way to enhance the device stability while retaining a relatively high mobility, which makes the corresponding devices suitable for ultradefinition, large-area, and high-frame-rate display applications.</div>
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<Abstract><AbstractText>A novel method to design metal oxide thin-film transistor (TFT) devices with high performance and high photostability for next-generation flat-panel displays is reported. Here, we developed bilayer metal oxide TFTs, where the front channel consists of indium-zinc-oxide (IZO) and the back channel material on top of it is hafnium-indium-zinc-oxide (HIZO). Density-of-states (DOS)-based modeling and device simulation were performed in order to determine the optimum thickness ratio within the IZO/HIZO stack that results in the best balance between device performance and stability. As a result, respective values of 5 and 40 nm for the IZO and HIZO layers were determined. The TFT devices that were fabricated accordingly exhibited mobility values up to 48 cm(2)/(V s), which is much elevated compared to pure HIZO TFTs (∼13 cm(2)/(V s)) but comparable to pure IZO TFTs (∼59 cm(2)/(V s)). Also, the stability of the bilayer device (-1.18 V) was significantly enhanced compared to the pure IZO device (-9.08 V). Our methodology based on the subgap DOS model and simulation provides an effective way to enhance the device stability while retaining a relatively high mobility, which makes the corresponding devices suitable for ultradefinition, large-area, and high-frame-rate display applications.</AbstractText>
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<Affiliation>Display Device Lab, Samsung Advanced Institute of Technology, Yongin, 446-712, Republic of Korea.</Affiliation>
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