Serveur d'exploration sur l'Indium - Analysis (Chine)

Index « Auteurs » - entrée « YUAN YUAN »
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YUAN YU < YUAN YUAN < YUAN-KUANG TU  Facettes :

List of bibliographic references

Number of relevant bibliographic references: 3.
Ident.Authors (with country if any)Title
000436 (2012) Preparation of Sn-Ag-In Solder Bumps by Electroplating of Sn-Ag and Indium in Sequence and the Effect of Indium Addition on Microstructure and Shear Strength
000480 (2012) Liquid-solid interfacial reactions of Sn-Ag and Sn-Ag-In solders with Cu under bump metallization : Lead-free solder and packaging
000C10 (2010) Development of indium bumping technology through AZ9260 resist electroplating

List of associated KwdEn.i

Nombre de
documents
Descripteur
3Electronic packaging
3Flip chip bonding
2Copper
2Doped materials
2Electrodeposition
2Indium addition
2Integrated circuit bonding
2Interface reaction
2Intermetallic compound
2Microstructure
2Solder bump
2Soldered joint
1Additive
1Ball grid arrays
1Contact surface
1Experimental study
1Feasibility
1Indium
1Integrated circuits
1Ion beam etching
1Kinetics
1Lift off
1Liquid solid interface
1Liquid solid reaction
1Microelectronic fabrication
1Reaction rate
1Reflow soldering
1Reliability
1Shear
1Shear strength
1Solder
1Surface mount technology
1Wetting

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HfdIndexSelect -h $EXPLOR_AREA/Data/Chine/Analysis/Author.i -k "YUAN YUAN" 
HfdIndexSelect -h $EXPLOR_AREA/Data/Chine/Analysis/Author.i  \
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   |area=    IndiumV3
   |flux=    Chine
   |étape=   Analysis
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   |index=    Author.i
   |clé=    YUAN YUAN
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