Solder flow on narrow copper strips
Identifieur interne : 000603 ( Main/Exploration ); précédent : 000602; suivant : 000604Solder flow on narrow copper strips
Auteurs : F. M. Hosking [États-Unis] ; F. G. Yost [États-Unis] ; E. A. Holm [États-Unis] ; J. R. Michael [États-Unis]Source :
- Journal of Electronic Materials [ 0361-5235 ] ; 1996-07-01.
Abstract
Abstract: Various solderability tests have been developed over the years to quantify the wetting behavior of solder on metallic surfaces. None offer an exact measure of capillary flow normally associated with conventional plated-through-hole and surface mount soldering. With shrinking package designs, increasing reliability requirements, and the emergence of new soldering technologies, there is a growing need to better understand and predict the flow of solder on printed wiring board (PWB) surfaces. Sandia National Laboratories has developed a capillary flow solderability test, through a joint effort with the National Center for Manufacturing Sciences, that considers this fundamental wetting issue for surface mount technology. The test geometry consists of a metal strip (width, 8) connected to a circular metal pad (radius, rc). Solder flow from the pad onto the strip depends on the geometric relationship between 8 and rc. Test methodology, experimental results, and validation of a flow model are presented in this paper.
Url:
DOI: 10.1007/BF02659910
Affiliations:
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M." last="Hosking">F. M. Hosking</name><affiliation wicri:level="2"><country xml:lang="fr">États-Unis</country><placeName><region type="state">Nouveau-Mexique</region></placeName><wicri:cityArea>Sandia National Laboratories, MS/1411, 87185, Albuquerque</wicri:cityArea></affiliation></author><author><name sortKey="Yost, F G" sort="Yost, F G" uniqKey="Yost F" first="F. G." last="Yost">F. G. Yost</name><affiliation wicri:level="2"><country xml:lang="fr">États-Unis</country><placeName><region type="state">Nouveau-Mexique</region></placeName><wicri:cityArea>Sandia National Laboratories, MS/1411, 87185, Albuquerque</wicri:cityArea></affiliation></author><author><name sortKey="Holm, E A" sort="Holm, E A" uniqKey="Holm E" first="E. A." last="Holm">E. A. 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None offer an exact measure of capillary flow normally associated with conventional plated-through-hole and surface mount soldering. With shrinking package designs, increasing reliability requirements, and the emergence of new soldering technologies, there is a growing need to better understand and predict the flow of solder on printed wiring board (PWB) surfaces. Sandia National Laboratories has developed a capillary flow solderability test, through a joint effort with the National Center for Manufacturing Sciences, that considers this fundamental wetting issue for surface mount technology. The test geometry consists of a metal strip (width, 8) connected to a circular metal pad (radius, rc). Solder flow from the pad onto the strip depends on the geometric relationship between 8 and rc. Test methodology, experimental results, and validation of a flow model are presented in this paper.</div></front></TEI><affiliations><list><country><li>États-Unis</li></country><region><li>Nouveau-Mexique</li></region></list><tree><country name="États-Unis"><region name="Nouveau-Mexique"><name sortKey="Hosking, F M" sort="Hosking, F M" uniqKey="Hosking F" first="F. M." last="Hosking">F. M. Hosking</name></region><name sortKey="Holm, E A" sort="Holm, E A" uniqKey="Holm E" first="E. A." last="Holm">E. A. Holm</name><name sortKey="Michael, J R" sort="Michael, J R" uniqKey="Michael J" first="J. R." last="Michael">J. R. Michael</name><name sortKey="Yost, F G" sort="Yost, F G" uniqKey="Yost F" first="F. G." last="Yost">F. G. Yost</name></country></tree></affiliations></record>Pour manipuler ce document sous Unix (Dilib)
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