Development of a piezoelectric polymer-based sensorized microgripper for microassembly and micromanipulation
Identifieur interne : 006C43 ( Main/Exploration ); précédent : 006C42; suivant : 006C44Development of a piezoelectric polymer-based sensorized microgripper for microassembly and micromanipulation
Auteurs : D.-H. Kim [Corée du Sud] ; B. Kim [Corée du Sud] ; H. Kang [Corée du Sud]Source :
- Microsystem technologies [ 0946-7076 ] ; 2004.
Descripteurs français
- Pascal (Inist)
- Propriété électromécanique, Etalonnage, Capteur force, Mesure force, Capteur mesure, Transducteur enfoui, Optique intégrée, Piézoélectrique, Piézoélectricité, Matière plastique, Préhenseur, Microassemblage, Micromanipulation, Usinage électroérosion, Alliage mémoire forme, Film polymère, Etude expérimentale, 0710C, 8540H.
- Wicri :
- topic : Matière plastique.
English descriptors
- KwdEn :
- Calibration, Electrical discharge machining, Electromechanical properties, Embedded transducer, Experimental study, Force measurement, Force transducer, Gripper, Integrated optics, Measurement sensor, Microassembling, Micromanipulation, Piezoelectric materials, Piezoelectricity, Plastics, Polymer films, Shape memory alloy.
Abstract
This paper presents the design, fabrication, and calibration of a piezoelectric polymer-based sensorized microgripper. Electro discharge machining technology is employed to fabricate the superelastic alloy-based microgripper. It was experimentally tested to show the improvement of mechanical performance. For integration of force sensor in the microgripper, the sensor design based on the piezoelectric polymer polyvinylidene fluoride (PVDF) film and fabrication process are presented. The calibration and performance test of the force sensor-integrated microgripper are experimentally carried out. The force sensor-integrated microgripper is applied to fine alignment tasks of micro opto-electrical components. Experimental results show that it can successfully provide force feedback to the operator through the haptic device and play a main role in preventing damage of assembly parts by adjusting the teaching command.
Affiliations:
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Le document en format XML
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Box 131, Cheongryang</s1><s2>Seoul, 130-650</s2><s3>KOR</s3><sZ>1 aut.</sZ><sZ>2 aut.</sZ><sZ>3 aut.</sZ></inist:fA14><country>Corée du Sud</country><wicri:noRegion>Seoul, 130-650</wicri:noRegion></affiliation></author><author><name sortKey="Kang, H" sort="Kang, H" uniqKey="Kang H" first="H." last="Kang">H. Kang</name><affiliation wicri:level="1"><inist:fA14 i1="01"><s1>Microsystems Research Center, Korea Institute of Science and Technology, P. O. Box 131, Cheongryang</s1><s2>Seoul, 130-650</s2><s3>KOR</s3><sZ>1 aut.</sZ><sZ>2 aut.</sZ><sZ>3 aut.</sZ></inist:fA14><country>Corée du Sud</country><wicri:noRegion>Seoul, 130-650</wicri:noRegion></affiliation></author></titleStmt><publicationStmt><idno type="wicri:source">INIST</idno><idno type="inist">04-0311018</idno><date when="2004">2004</date><idno type="stanalyst">PASCAL 04-0311018 INIST</idno><idno type="RBID">Pascal:04-0311018</idno><idno type="wicri:Area/PascalFrancis/Corpus">000F87</idno><idno type="wicri:Area/PascalFrancis/Curation">000522</idno><idno type="wicri:Area/PascalFrancis/Checkpoint">000D44</idno><idno type="wicri:doubleKey">0946-7076:2004:Kim D:development:of:a</idno><idno type="wicri:Area/Main/Merge">007066</idno><idno type="wicri:Area/Main/Curation">006C43</idno><idno type="wicri:Area/Main/Exploration">006C43</idno></publicationStmt><sourceDesc><biblStruct><analytic><title xml:lang="en" level="a">Development of a piezoelectric polymer-based sensorized microgripper for microassembly and micromanipulation</title><author><name sortKey="Kim, D H" sort="Kim, D H" uniqKey="Kim D" first="D.-H." last="Kim">D.-H. Kim</name><affiliation wicri:level="1"><inist:fA14 i1="01"><s1>Microsystems Research Center, Korea Institute of Science and Technology, P. O. Box 131, Cheongryang</s1><s2>Seoul, 130-650</s2><s3>KOR</s3><sZ>1 aut.</sZ><sZ>2 aut.</sZ><sZ>3 aut.</sZ></inist:fA14><country>Corée du Sud</country><wicri:noRegion>Seoul, 130-650</wicri:noRegion></affiliation></author><author><name sortKey="Kim, B" sort="Kim, B" uniqKey="Kim B" first="B." last="Kim">B. Kim</name><affiliation wicri:level="1"><inist:fA14 i1="01"><s1>Microsystems Research Center, Korea Institute of Science and Technology, P. O. Box 131, Cheongryang</s1><s2>Seoul, 130-650</s2><s3>KOR</s3><sZ>1 aut.</sZ><sZ>2 aut.</sZ><sZ>3 aut.</sZ></inist:fA14><country>Corée du Sud</country><wicri:noRegion>Seoul, 130-650</wicri:noRegion></affiliation></author><author><name sortKey="Kang, H" sort="Kang, H" uniqKey="Kang H" first="H." last="Kang">H. Kang</name><affiliation wicri:level="1"><inist:fA14 i1="01"><s1>Microsystems Research Center, Korea Institute of Science and Technology, P. O. Box 131, Cheongryang</s1><s2>Seoul, 130-650</s2><s3>KOR</s3><sZ>1 aut.</sZ><sZ>2 aut.</sZ><sZ>3 aut.</sZ></inist:fA14><country>Corée du Sud</country><wicri:noRegion>Seoul, 130-650</wicri:noRegion></affiliation></author></analytic><series><title level="j" type="main">Microsystem technologies</title><title level="j" type="abbreviated">Microsyst. technol.</title><idno type="ISSN">0946-7076</idno><imprint><date when="2004">2004</date></imprint></series></biblStruct></sourceDesc><seriesStmt><title level="j" type="main">Microsystem technologies</title><title level="j" type="abbreviated">Microsyst. technol.</title><idno type="ISSN">0946-7076</idno></seriesStmt></fileDesc><profileDesc><textClass><keywords scheme="KwdEn" xml:lang="en"><term>Calibration</term><term>Electrical discharge machining</term><term>Electromechanical properties</term><term>Embedded transducer</term><term>Experimental study</term><term>Force measurement</term><term>Force transducer</term><term>Gripper</term><term>Integrated optics</term><term>Measurement sensor</term><term>Microassembling</term><term>Micromanipulation</term><term>Piezoelectric materials</term><term>Piezoelectricity</term><term>Plastics</term><term>Polymer films</term><term>Shape memory alloy</term></keywords><keywords scheme="Pascal" xml:lang="fr"><term>Propriété électromécanique</term><term>Etalonnage</term><term>Capteur force</term><term>Mesure force</term><term>Capteur mesure</term><term>Transducteur enfoui</term><term>Optique intégrée</term><term>Piézoélectrique</term><term>Piézoélectricité</term><term>Matière plastique</term><term>Préhenseur</term><term>Microassemblage</term><term>Micromanipulation</term><term>Usinage électroérosion</term><term>Alliage mémoire forme</term><term>Film polymère</term><term>Etude expérimentale</term><term>0710C</term><term>8540H</term></keywords><keywords scheme="Wicri" type="topic" xml:lang="fr"><term>Matière plastique</term></keywords></textClass></profileDesc></teiHeader><front><div type="abstract" xml:lang="en">This paper presents the design, fabrication, and calibration of a piezoelectric polymer-based sensorized microgripper. Electro discharge machining technology is employed to fabricate the superelastic alloy-based microgripper. It was experimentally tested to show the improvement of mechanical performance. For integration of force sensor in the microgripper, the sensor design based on the piezoelectric polymer polyvinylidene fluoride (PVDF) film and fabrication process are presented. The calibration and performance test of the force sensor-integrated microgripper are experimentally carried out. The force sensor-integrated microgripper is applied to fine alignment tasks of micro opto-electrical components. Experimental results show that it can successfully provide force feedback to the operator through the haptic device and play a main role in preventing damage of assembly parts by adjusting the teaching command.</div></front></TEI><affiliations><list><country><li>Corée du Sud</li></country></list><tree><country name="Corée du Sud"><noRegion><name sortKey="Kim, D H" sort="Kim, D H" uniqKey="Kim D" first="D.-H." last="Kim">D.-H. Kim</name></noRegion><name sortKey="Kang, H" sort="Kang, H" uniqKey="Kang H" first="H." last="Kang">H. Kang</name><name sortKey="Kim, B" sort="Kim, B" uniqKey="Kim B" first="B." last="Kim">B. Kim</name></country></tree></affiliations></record>Pour manipuler ce document sous Unix (Dilib)
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