AustralieFrV1, PascalFrancis, Corpus, bibRecord, 005504

Characterization of micromachining processes during KrF excimer laser ablation of TiNi shape memory alloy thin sheets and films

Identifieur interne : 005504 ( PascalFrancis/Corpus ); précédent : 005503; suivant : 005505

Characterization of micromachining processes during KrF excimer laser ablation of TiNi shape memory alloy thin sheets and films

Auteurs : S. T. Davies ; E. C. Harvey ; H. Jin ; J. P. Hayes ; M. K. Ghantasala ; I. Roch ; L. Buchaillot

Source :

Smart materials and structures [ 0964-1726 ] ; 2002.

RBID : Pascal:03-0039964

Descripteurs français

Pascal (Inist)
- Dispositif microélectromécanique, Microusinage, Gravure faisceau laser, Méthode ablation laser, Laser excimère, Feuille métallique, Couche mince, Alliage mémoire forme, Alliage base titane, Nickel alliage, Etude expérimentale, 0710C, 8165C.

English descriptors

KwdEn :
- Excimer lasers, Experimental study, Laser ablation technique, Laser beam etching, Metal foil, Microelectromechanical device, Micromachining, Nickel alloys, Shape memory alloy, Thin films, Titanium base alloys.

Abstract

We investigate excimer laser ablation of TiNi shape memory alloy thin sheets and films using an image projection system as a tool for micromachining and patterning. Characteristics of material removal by KrF excimer laser induced ablation at 248 nm and the dependence of material removal rates on laser parameters such as fluence and pulse frequency are explored. Fluences at the workpiece using a 10 × projection lens were up to 2.5 J cm^-2 with pulse repetition rates up to 100 Hz. Conventional chrome-on-quartz masks were used for pattern transfer. Material removal mechanisms and rates of material removal were investigated for thin film samples and thin sheet samples having thicknesses of 3 and 150 μm respectively.

Notice en format standard (ISO 2709)

Pour connaître la documentation sur le format Inist Standard.

A01	`01`	`1`		`@0 0964-1726`
A03		`1`		`@0 Smart mater. struc.`
A05				`@2 11`
A06				`@2 5`
A08	`01`	`1`	`ENG`	`@1 Characterization of micromachining processes during KrF excimer laser ablation of TiNi shape memory alloy thin sheets and films`
A09	`01`	`1`	`ENG`	`@1 BioMEMS and smart nanostructures`
A11	`01`	`1`		`@1 DAVIES (S. T.)`
A11	`02`	`1`		`@1 HARVEY (E. C.)`
A11	`03`	`1`		`@1 JIN (H.)`
A11	`04`	`1`		`@1 HAYES (J. P.)`
A11	`05`	`1`		`@1 GHANTASALA (M. K.)`
A11	`06`	`1`		`@1 ROCH (I.)`
A11	`07`	`1`		`@1 BUCHAILLOT (L.)`
A12	`01`	`1`		`@1 KISH (L. B.) @9 ed.`
A14	`01`			`@1 Centre for Nanotechnology and Microengineering, School of Engineering, University of Warwick @2 Coventry CV4 7AL @3 GBR @Z 1 aut.`
A14	`02`			`@1 Industrial Research Institute Swinburne (IRIS), Swinburne University of Technology, 533-545 Burwood Road @2 Hawthorn, Melbourne 3122 @3 AUS @Z 2 aut. @Z 3 aut. @Z 4 aut. @Z 5 aut.`
A14	`03`			`@1 Institut d'Electronique et de Microelectronique du Nord, Cite Scientifique, Av H Poincare, B P 69 @2 59652 Villeneuve d'Ascq @3 FRA @Z 6 aut. @Z 7 aut.`
A15	`01`			`@1 Department of Electrical Engineering, Texas A&M University @2 College Station TX 77843-3128 @3 USA @Z 1 aut.`
A20				`@1 708-714`
A21				`@1 2002`
A23	`01`			`@0 ENG`
A43	`01`			`@1 INIST @2 26248 @5 354000109358240130`
A44				`@0 0000 @1 © 2003 INIST-CNRS. All rights reserved.`
A45				`@0 18 ref.`
A47	`01`	`1`		`@0 03-0039964`
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A64	`01`	`1`		`@0 Smart materials and structures`
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C01	`01`		`ENG`	@0 We investigate excimer laser ablation of TiNi shape memory alloy thin sheets and films using an image projection system as a tool for micromachining and patterning. Characteristics of material removal by KrF excimer laser induced ablation at 248 nm and the dependence of material removal rates on laser parameters such as fluence and pulse frequency are explored. Fluences at the workpiece using a 10 × projection lens were up to 2.5 J cm^-2 with pulse repetition rates up to 100 Hz. Conventional chrome-on-quartz masks were used for pattern transfer. Material removal mechanisms and rates of material removal were investigated for thin film samples and thin sheet samples having thicknesses of 3 and 150 μm respectively.
C02	`01`	`3`		`@0 001B00G10C`
C02	`02`	`3`		`@0 001B80A65`
C03	`01`	`X`	`FRE`	`@0 Dispositif microélectromécanique @5 01`
C03	`01`	`X`	`ENG`	`@0 Microelectromechanical device @5 01`
C03	`01`	`X`	`SPA`	`@0 Dispositivo microelectromecánico @5 01`
C03	`02`	`3`	`FRE`	`@0 Microusinage @5 02`
C03	`02`	`3`	`ENG`	`@0 Micromachining @5 02`
C03	`03`	`3`	`FRE`	`@0 Gravure faisceau laser @5 03`
C03	`03`	`3`	`ENG`	`@0 Laser beam etching @5 03`
C03	`04`	`3`	`FRE`	`@0 Méthode ablation laser @5 04`
C03	`04`	`3`	`ENG`	`@0 Laser ablation technique @5 04`
C03	`05`	`3`	`FRE`	`@0 Laser excimère @5 05`
C03	`05`	`3`	`ENG`	`@0 Excimer lasers @5 05`
C03	`06`	`X`	`FRE`	`@0 Feuille métallique @5 06`
C03	`06`	`X`	`ENG`	`@0 Metal foil @5 06`
C03	`06`	`X`	`SPA`	`@0 Hoja metálica @5 06`
C03	`07`	`3`	`FRE`	`@0 Couche mince @5 07`
C03	`07`	`3`	`ENG`	`@0 Thin films @5 07`
C03	`08`	`X`	`FRE`	`@0 Alliage mémoire forme @5 09`
C03	`08`	`X`	`ENG`	`@0 Shape memory alloy @5 09`
C03	`08`	`X`	`SPA`	`@0 Aleación memoria forma @5 09`
C03	`09`	`3`	`FRE`	`@0 Alliage base titane @2 NK @5 10`
C03	`09`	`3`	`ENG`	`@0 Titanium base alloys @2 NK @5 10`
C03	`10`	`3`	`FRE`	`@0 Nickel alliage @5 11`
C03	`10`	`3`	`ENG`	`@0 Nickel alloys @5 11`
C03	`11`	`3`	`FRE`	`@0 Etude expérimentale @5 22`
C03	`11`	`3`	`ENG`	`@0 Experimental study @5 22`
C03	`12`	`3`	`FRE`	`@0 0710C @2 PAC @4 INC @5 56`
C03	`13`	`3`	`FRE`	`@0 8165C @2 PAC @4 INC @5 57`
N21				`@1 020`
N82				`@1 PSI`

Format Inist (serveur)

NO :	PASCAL 03-0039964 INIST
ET :	Characterization of micromachining processes during KrF excimer laser ablation of TiNi shape memory alloy thin sheets and films
AU :	DAVIES (S. T.); HARVEY (E. C.); JIN (H.); HAYES (J. P.); GHANTASALA (M. K.); ROCH (I.); BUCHAILLOT (L.); KISH (L. B.)
AF :	Centre for Nanotechnology and Microengineering, School of Engineering, University of Warwick/Coventry CV4 7AL/Royaume-Uni (1 aut.); Industrial Research Institute Swinburne (IRIS), Swinburne University of Technology, 533-545 Burwood Road/Hawthorn, Melbourne 3122/Australie (2 aut., 3 aut., 4 aut., 5 aut.); Institut d'Electronique et de Microelectronique du Nord, Cite Scientifique, Av H Poincare, B P 69/59652 Villeneuve d'Ascq/France (6 aut., 7 aut.); Department of Electrical Engineering, Texas A&M University/College Station TX 77843-3128/Etats-Unis (1 aut.)
DT :	Publication en série; Niveau analytique
SO :	Smart materials and structures; ISSN 0964-1726; Royaume-Uni; Da. 2002; Vol. 11; No. 5; Pp. 708-714; Bibl. 18 ref.
LA :	Anglais
EA :	We investigate excimer laser ablation of TiNi shape memory alloy thin sheets and films using an image projection system as a tool for micromachining and patterning. Characteristics of material removal by KrF excimer laser induced ablation at 248 nm and the dependence of material removal rates on laser parameters such as fluence and pulse frequency are explored. Fluences at the workpiece using a 10 × projection lens were up to 2.5 J cm^-2 with pulse repetition rates up to 100 Hz. Conventional chrome-on-quartz masks were used for pattern transfer. Material removal mechanisms and rates of material removal were investigated for thin film samples and thin sheet samples having thicknesses of 3 and 150 μm respectively.
CC :	001B00G10C; 001B80A65
FD :	Dispositif microélectromécanique; Microusinage; Gravure faisceau laser; Méthode ablation laser; Laser excimère; Feuille métallique; Couche mince; Alliage mémoire forme; Alliage base titane; Nickel alliage; Etude expérimentale; 0710C; 8165C
ED :	Microelectromechanical device; Micromachining; Laser beam etching; Laser ablation technique; Excimer lasers; Metal foil; Thin films; Shape memory alloy; Titanium base alloys; Nickel alloys; Experimental study
SD :	Dispositivo microelectromecánico; Hoja metálica; Aleación memoria forma
LO :	INIST-26248.354000109358240130
ID :	03-0039964

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Pascal:03-0039964

Le document en format XML

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<front><div type="abstract" xml:lang="en">We investigate excimer laser ablation of TiNi shape memory alloy thin sheets and films using an image projection system as a tool for micromachining and patterning. Characteristics of material removal by KrF excimer laser induced ablation at 248 nm and the dependence of material removal rates on laser parameters such as fluence and pulse frequency are explored. Fluences at the workpiece using a 10 × projection lens were up to 2.5 J cm<sup>-2</sup>
 with pulse repetition rates up to 100 Hz. Conventional chrome-on-quartz masks were used for pattern transfer. Material removal mechanisms and rates of material removal were investigated for thin film samples and thin sheet samples having thicknesses of 3 and 150 μm respectively.</div>
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<server><NO>PASCAL 03-0039964 INIST</NO>
<ET>Characterization of micromachining processes during KrF excimer laser ablation of TiNi shape memory alloy thin sheets and films</ET>
<AU>DAVIES (S. T.); HARVEY (E. C.); JIN (H.); HAYES (J. P.); GHANTASALA (M. K.); ROCH (I.); BUCHAILLOT (L.); KISH (L. B.)</AU>
<AF>Centre for Nanotechnology and Microengineering, School of Engineering, University of Warwick/Coventry CV4 7AL/Royaume-Uni (1 aut.); Industrial Research Institute Swinburne (IRIS), Swinburne University of Technology, 533-545 Burwood Road/Hawthorn, Melbourne 3122/Australie (2 aut., 3 aut., 4 aut., 5 aut.); Institut d'Electronique et de Microelectronique du Nord, Cite Scientifique, Av H Poincare, B P 69/59652 Villeneuve d'Ascq/France (6 aut., 7 aut.); Department of Electrical Engineering, Texas A&M University/College Station TX 77843-3128/Etats-Unis (1 aut.)</AF>
<DT>Publication en série; Niveau analytique</DT>
<SO>Smart materials and structures; ISSN 0964-1726; Royaume-Uni; Da. 2002; Vol. 11; No. 5; Pp. 708-714; Bibl. 18 ref.</SO>
<LA>Anglais</LA>
<EA>We investigate excimer laser ablation of TiNi shape memory alloy thin sheets and films using an image projection system as a tool for micromachining and patterning. Characteristics of material removal by KrF excimer laser induced ablation at 248 nm and the dependence of material removal rates on laser parameters such as fluence and pulse frequency are explored. Fluences at the workpiece using a 10 × projection lens were up to 2.5 J cm<sup>-2</sup>
 with pulse repetition rates up to 100 Hz. Conventional chrome-on-quartz masks were used for pattern transfer. Material removal mechanisms and rates of material removal were investigated for thin film samples and thin sheet samples having thicknesses of 3 and 150 μm respectively.</EA>
<CC>001B00G10C; 001B80A65</CC>
<FD>Dispositif microélectromécanique; Microusinage; Gravure faisceau laser; Méthode ablation laser; Laser excimère; Feuille métallique; Couche mince; Alliage mémoire forme; Alliage base titane; Nickel alliage; Etude expérimentale; 0710C; 8165C</FD>
<ED>Microelectromechanical device; Micromachining; Laser beam etching; Laser ablation technique; Excimer lasers; Metal foil; Thin films; Shape memory alloy; Titanium base alloys; Nickel alloys; Experimental study</ED>
<SD>Dispositivo microelectromecánico; Hoja metálica; Aleación memoria forma</SD>
<LO>INIST-26248.354000109358240130</LO>
<ID>03-0039964</ID>
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Characterization of micromachining processes during KrF excimer laser ablation of TiNi shape memory alloy thin sheets and films

Characterization of micromachining processes during KrF excimer laser ablation of TiNi shape memory alloy thin sheets and films

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