Eléments de l'association
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List of bibliographic references
Number of relevant bibliographic references: 2.| Ident. | Authors (with country if any) | Title |
|---|---|---|
| 000127 | Zhi-Min Dang [République populaire de Chine] ; BO ZHANG [République populaire de Chine] ; JINGE LI [République populaire de Chine] ; Jun-Wei Zha [République populaire de Chine] ; Guo-Hua Hu [France] | Copper Particles/Epoxy Resin Thermosetting Conductive Adhesive Using Polyamide Resin as Curing Agent |
| 000446 | SHU CHEN [République populaire de Chine] ; CHEN GUO [République populaire de Chine] ; Guo-Hua Hu [France] ; Hui-Zhou Liu [République populaire de Chine] ; Xiang-Feng Liang [République populaire de Chine] ; JING WANG [République populaire de Chine] ; Jun-He Ma [République populaire de Chine] ; LILY ZHENG [République populaire de Chine] | Dissipative particle dynamics simulation of gold nanoparticles stabilization by PEO-PPO-PEO block copolymer micelles |
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