Eléments de l'association
|  |
List of bibliographic references
Number of relevant bibliographic references: 2.| Ident. | Authors (with country if any) | Title |
|---|---|---|
| 000127 | Zhi-Min Dang [République populaire de Chine] ; BO ZHANG [République populaire de Chine] ; JINGE LI [République populaire de Chine] ; Jun-Wei Zha [République populaire de Chine] ; Guo-Hua Hu [France] | Copper Particles/Epoxy Resin Thermosetting Conductive Adhesive Using Polyamide Resin as Curing Agent |
| 000665 | Guo-Hua Hu [France] ; Hervé Cartier [France] ; Lian-Fang Feng [France, République populaire de Chine] ; Bo-Geng Li [République populaire de Chine] | Kinetics of the In situ polymerization and In situ compatibilization of poly(propylene) and polyamide 6 blends |
| This area was generated with Dilib version V0.6.32. |  |