AustralieFrV1, Istex, Curation, bibRecord, 002820

Sputtering effects in a helicon plasma with an additional immersed antenna

Identifieur interne : 002820 ( Istex/Curation ); précédent : 002819; suivant : 002821

Sputtering effects in a helicon plasma with an additional immersed antenna

Auteurs :

Source :

Plasma Sources Science and Technology [ 0963-0252 ] ; 2003-02-01.

RBID : ISTEX:D73B31B2446D68503FC64A55B1788F09FED78058

English descriptors

KwdEn :
- Antenna, Antenna material, Antennae system, Axial distance, Clean source wall, Clean tube, Copper coating, Copper cylinder, Density jump, Diffusion chamber, Direct contact, Dramatic changes, Electron temperature, Faraday shield, Glass wall, Gure, Helicon, Helicon antenna, Helicon plasma, Helicon systems, Normal construction, Open diamonds, Phase difference, Plasma, Plasma density, Plasma parameters, Plasma research laboratory, Plasma sources, Same frequency, Second copper antenna, Small antenna, Source tube, Source wall, Sputtering effects, Technol, Thick coating, Thick copper coating, Thin copper coating, Total power input, Traditional helicon source, Wall conditions.
Teeft :
- Antenna, Antenna material, Antennae system, Axial distance, Clean source wall, Clean tube, Copper coating, Copper cylinder, Density jump, Diffusion chamber, Direct contact, Dramatic changes, Electron temperature, Faraday shield, Glass wall, Gure, Helicon, Helicon antenna, Helicon plasma, Helicon systems, Normal construction, Open diamonds, Phase difference, Plasma, Plasma density, Plasma parameters, Plasma research laboratory, Plasma sources, Same frequency, Second copper antenna, Small antenna, Source tube, Source wall, Sputtering effects, Technol, Thick coating, Thick copper coating, Thin copper coating, Total power input, Traditional helicon source, Wall conditions.

Url:

https://api.istex.fr/document/D73B31B2446D68503FC64A55B1788F09FED78058/fulltext/pdf

DOI: 10.1088/0963-0252/12/1/311

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Le document en format XML

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<profileDesc><textClass><keywords scheme="KwdEn" xml:lang="en"><term>Antenna</term>
<term>Antenna material</term>
<term>Antennae system</term>
<term>Axial distance</term>
<term>Clean source wall</term>
<term>Clean tube</term>
<term>Copper coating</term>
<term>Copper cylinder</term>
<term>Density jump</term>
<term>Diffusion chamber</term>
<term>Direct contact</term>
<term>Dramatic changes</term>
<term>Electron temperature</term>
<term>Faraday shield</term>
<term>Glass wall</term>
<term>Gure</term>
<term>Helicon</term>
<term>Helicon antenna</term>
<term>Helicon plasma</term>
<term>Helicon systems</term>
<term>Normal construction</term>
<term>Open diamonds</term>
<term>Phase difference</term>
<term>Plasma</term>
<term>Plasma density</term>
<term>Plasma parameters</term>
<term>Plasma research laboratory</term>
<term>Plasma sources</term>
<term>Same frequency</term>
<term>Second copper antenna</term>
<term>Small antenna</term>
<term>Source tube</term>
<term>Source wall</term>
<term>Sputtering effects</term>
<term>Technol</term>
<term>Thick coating</term>
<term>Thick copper coating</term>
<term>Thin copper coating</term>
<term>Total power input</term>
<term>Traditional helicon source</term>
<term>Wall conditions</term>
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<keywords scheme="Teeft" xml:lang="en"><term>Antenna</term>
<term>Antenna material</term>
<term>Antennae system</term>
<term>Axial distance</term>
<term>Clean source wall</term>
<term>Clean tube</term>
<term>Copper coating</term>
<term>Copper cylinder</term>
<term>Density jump</term>
<term>Diffusion chamber</term>
<term>Direct contact</term>
<term>Dramatic changes</term>
<term>Electron temperature</term>
<term>Faraday shield</term>
<term>Glass wall</term>
<term>Gure</term>
<term>Helicon</term>
<term>Helicon antenna</term>
<term>Helicon plasma</term>
<term>Helicon systems</term>
<term>Normal construction</term>
<term>Open diamonds</term>
<term>Phase difference</term>
<term>Plasma</term>
<term>Plasma density</term>
<term>Plasma parameters</term>
<term>Plasma research laboratory</term>
<term>Plasma sources</term>
<term>Same frequency</term>
<term>Second copper antenna</term>
<term>Small antenna</term>
<term>Source tube</term>
<term>Source wall</term>
<term>Sputtering effects</term>
<term>Technol</term>
<term>Thick coating</term>
<term>Thick copper coating</term>
<term>Thin copper coating</term>
<term>Total power input</term>
<term>Traditional helicon source</term>
<term>Wall conditions</term>
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Sputtering effects in a helicon plasma with an additional immersed antenna

Sputtering effects in a helicon plasma with an additional immersed antenna

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English descriptors

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