Eléments de l'association
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List of bibliographic references
Number of relevant bibliographic references: 8.| Ident. | Authors (with country if any) | Title |
|---|---|---|
| 000036 | Y. Messaoudi [Algérie] ; N. Fenineche [France] ; A. Guittoum [Algérie] ; A. Azizi [Algérie] ; G. Schmerber [France] ; A. Dinia [France] | A study on electrodeposited Co-Mo alloys thin films |
| 000040 | M. R. Khelladi [Algérie] ; L. Mentar [Algérie] ; A. Azizi [Algérie] ; L. Makhloufi [Algérie] ; G. Schmerber [France] ; A. Dinia [France] | The potential dependence of Co-Cu alloy thin films electrodeposited on n-Si(100) substrate |
| 000144 | T. El Bahraoui [Maroc] ; H. Errahmani [Maroc] ; Y. Belghazi [Maroc] ; A. Berrada [Maroc] ; A. Dinia [France] ; G. Schmerber [France] ; H. Lassri [Maroc] ; F. Cherkaoui El Moursli [Maroc] ; F. Hajji [Maroc] | Structural and magnetic properties of electrodeposited (Co/CoxZn1-x)n thin films |
| 000183 | A. Azizi [Algérie] ; J. Arabski [France] ; A. Dinia [France] | Nucleation, growth and structural properties of epitaxial Co-Ag alloy films |
| 000241 | N. El Hourch [Maroc] ; A. El Yahyaoui [Maroc] ; S. Bouhlassa [Maroc] ; H. Errahmani [Maroc] ; A. Berrada [Maroc] ; G. Schmerber [France] ; A. Dinia [France] | Structural and magnetic properties of cobalt (II) copper (II) phosphate granular layers prepared by an inorganic sol-gel process |
| 000273 | H. Errahmani [Maroc] ; A. Berrada [Maroc] ; G. Schmerber [France] ; A. Dinia [France] | Comparative study between the effect of annealing and substrate temperature on the magnetic and transport properties of Co20Cu80 granular alloys |
| 000283 | H. Errahmani [Maroc] ; A. Berrada [Maroc] ; G. Schmerber [France] ; A. Dinia [France] | Magnetic and transport properties of ion beam sputtered CoxCu1-x granular alloys |
| 000313 | H. El Fanity [Maroc] ; K. Rahmouni [France] ; M. Bouanani [Maroc] ; A. Dinia [France] ; G. Shmerber [France] ; C. Meny [France] ; P. Panissod [France] ; A. Cziraki [Hongrie] ; F. Cherkaoui [Maroc] ; A. Berrada [Maroc] | Structural properties of electrodeposited Co/Cu multilayers |
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